PDF 原檔：報告_OCP2026_Samtec_224G448G銅光連接_20261015_original.pdf
講者公開簡報（OCP 官方 Recorded Content 頁提供下載）。文字以 PyMuPDF 逐頁抽取，
### p<n>為頁碼；圖表內容見原檔。
圖片清單（已驗證 2026-10-19）
| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_Samtec_224G448G銅光連接_20261015_p3.png |
p3 | 真資料圖 | AI 機房纜線比較：Passive DAC 約 2m、Powered ACC 約 5m、Retimed AEC 約 7m、LPO 約 50m、AOC 約 100m+，右側箭頭標延遲、雜訊/SI、功耗、成本隨介質變化的方向 |
報告_OCP2026_Samtec_224G448G銅光連接_20261015_p5.png |
p5 | 真資料圖 | Eye Speed Twinax 1 公尺差分插損曲線：34AWG（112G）、32AWG（224G 內部 CPC/NPC 纜）、28AWG（224G 外部背板纜），56GHz 處分別約 -17.5／-14／-10dB；文字稱 skew 最大 1.75ps/m、阻抗 92Ω |
報告_OCP2026_Samtec_224G448G銅光連接_20261015_p6.png |
p6 | 真資料圖 | Si-Fly HD 共封裝 vs 近晶片佈局：同為 100T ASIC，共封裝為 95x95 封裝、連接器在基板邊緣、藍色纜向四邊出；近晶片為 90x90 封裝、連接器在 PCB 上、纜線更長排列 |
報告_OCP2026_Samtec_224G448G銅光連接_20261015_p8.png |
p8 | 真資料圖 | Open CPX MSA 說明與成員 logo 牆：創始成員 Ciena、Coherent、Marvell、Molex、Samtec、Terahop；貢獻成員含 Amphenol、BizLink、Credo、FIT、Intel、LINTES、LOTES、Lumentum、TE 等 |
報告_OCP2026_Samtec_224G448G銅光連接_20261015_p12.png |
p12 | 真資料圖 | Open CPX MSA 路線圖：2026/3 成立、2026/9 成員逾 50；2026/9 Rev1.0 規格（32/36 x 200G，Type 1/2，ILM/ELM）；2027/3 Rev1.1（銅媒介、Type 3）；2027/6 Rev2.0（64/72 x 200G）；2027 末至 2028 初 Rev3.0（N x 400G） |
報告_OCP2026_Samtec_224G448G銅光連接_20261015_p13.png |
p13 | 真資料圖 | 448Gbps CPC/CPC 概念驗證展示實物：兩塊 Si-Fly HD 基板插座板以 1.0m 藍色 EyeSpeed Hyper Low Skew 纜相連，標示 448 與 Flyover |
原始內容
p1
INNOVATIVE TECHNOLOGIES SUDDEN SERVICE GLOBAL REACH CONFIDENTIAL & PROPRIETARY A Pathway to 224/448 Gbps Copper and Optical Connectivity in AI Matthew Burns | Director, Technical Marketing October 14, 2026 2026 OCP Global Summit – Expo Hall Session
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Sa mt ec C onf iden tia l • Evolving AI system topologies/architectures require more external cabling • Reach requirements vary • Within the rack ~2m • Adjacent racks ~3-5m • Rack-to-rack ~7m • Larger clustering ~10m+ • Interconnect options vary as well • Passive DACs • Powered ACCs • Re-timed AECs • LPOs • AOCs AI Infra Cabling – How far can we go?
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Sa mt ec C onf ide n tia l AI Infra Cabling Comparison Passive DACs ~2m Powered ACCs ~5m Retimed AECs ~7m LPOs ~50m AOCs ~100m+ Latency Noise/SI Power Cost
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Sa mt ec C onf iden tia l Si-Fly® HD Co-Packaged System • Ultra-high I/O density with minimal beachfront • Lowest loss signal transmission • SMT reflow process on HDI substrate Si-Fly® HD Near-Chip System • ASIC-adjacent, high-density signal launch • SMT reflow process on PCBs Flyover® OSFP Cable System Product Portfolio NEAR CHIP CO-PACKAGED Copper (Scale-Up) and Optics (Scale-Out) in a Single Connector
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Sa mt ec C onf iden tia l • Eliminates the performance limitations and inconsistencies of traditional twinax • Hyper low skew: 1.75 ps/meter max • Insertion Loss: 14.3 dB (32 AWG, 1 meter length at 56 GHz) • Easy to route through systems • Impedance: (92 Ω) • Ideal for all high-performance applications up to 224+ Gbps PAM4 • Tight coupling between signal conductors Eye Speed® Twinax Cable Technology 112G 34 AWG 224G 32 AWG 56 GHz 224G 28 AWG External Backplane Cable Internal CPC/NPC Cable
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Sa mt ec C onf iden tia l Si-Fly® HD Co-Packaged vs Near Chip 100T 95x95 package
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Sa mt ec C onf iden tia l 224G Si-Fly® HD Co-Packaged Connectivity
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Sa mt ec C onf iden tia l • Universal mixed-media pluggable interconnect • 6.4T and 7.2T pluggable interfaces • Supports CPO/CPC and NPO/NPC options • Uses existing electrical, optical and control plane standards • No compression hardware • Supply chain resilience with multiple sources Open CPX MSA: Scale-Up & Scale-Out Founding Members Contributor Members
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Sa mt ec C onf iden tia l • Separate high-speed and power/control sockets • 6.4 Tbps per socket • 64 DPs/32 lanes @ 200 Gbps • Same or different mounting planes • High-speed socket: 10 mm stack height • Power/control socket: 10/13 mm stack heights • <15 mm of beachfront width • Flexibility of internal or external lasers Open CPX MSA Type-1 Socket/Module Co-packaged Near-packaged
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Sa mt ec C onf iden tia l • Single connector with high-speed and power/control • 7.2 Tbps per socket • 72 DPs/36 lanes @ 200 Gbps • Single mounting plane • 7 mm stack height • <16 mm of beachfront width • Flexibility of internal or external lasers Open CPX MSA Type-2 Socket/Module Near-packaged
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Sa mt ec C onf iden tia l Open CPX MSA: Scale-Up & Scale Out Type-1 Co-packaged Type-1 Near-package Type-2 Near-package
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Sa mt ec C onf iden tia l Open CPX MSA Roadmap Subject to change without notice.
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Sa mt ec C onf iden tia l • PoC 448 Gbps Demo at OCP Global Summit • Samtec Si-Fly® HD Co-Packaged System • Two Substrate Sockets • 1.0 m EyeSpeed® Hyper Low Skew cable • Supports PAM4 and/or PAM6 encoding • Ideal for AI scale-up and scale-out What’s Coming? → 448 Gbps CPC/CPC
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Sa mt ec C onf iden tia l • Visit Samtec @ Booth E-1 • Get additional details on Si-Fly® HD • Learn about Open CPX MSA • Discover a “path to reality” for 400G • Visit www.samtec.com/si-fly-hd • Download our latest white paper: Next Steps
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www.samtec.com