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報告_OCP2026_Broadcom_CPO與OCI_20261015

PDF 原檔:報告_OCP2026_Broadcom_CPO與OCI_20261015_original.pdf

講者公開簡報(OCP 官方 Recorded Content 頁提供下載)。文字以 PyMuPDF 逐頁抽取,### p<n> 為頁碼;圖表內容見原檔。

圖片清單(已驗證 2026-10-19)

檔名 頁 分類 親眼所見內容
報告_OCP2026_Broadcom_CPO與OCI_20261015_p3.png p3 真資料圖 光互連四條路線示意圖:FRO/LRO/LPO、NPO、CPO、OCI 的 ASIC 與光引擎相對位置與 SerDes/D2D 路徑,標示 CPO「可靠度比可插拔高 10 倍」、OCI「延遲功耗成本最低、可靠度比肩銅」
報告_OCP2026_Broadcom_CPO與OCI_20261015_p4.png p4 真資料圖 Broadcom CPO 世代時間軸:2022 TH4 Humboldt 25.6T、2024 TH5 Bailly 51.2T 100G/lane、2026 TH6 Davisson 102.4T 200G/lane、2028 第四代 CPO;標註超過 1M 裝置小時 0 次 link flap
報告_OCP2026_Broadcom_CPO與OCI_20261015_p10.png p10 真資料圖 TH6-Davisson CPO 夥伴生態圖:FAU 為 Corning、Twinstar;ELSFP 為 Eoptolink、O-Net、TFC、FIT、Source Photonics、Aperion、Ligent;製造 TSMC、SPIL;CPO 機櫃單元為 Celestica、nexthop.ai、Micas、HPE、Supermicro、Jabil、Delta、QCT
報告_OCP2026_Broadcom_CPO與OCI_20261015_p12.png p12 真資料圖 OCI-MSA Gen1 規格圖:三種 OE 與 ELS 位置的實作選項 (a)(b)(c),雙向鏈路 Group A/B 波長,每方向每光纖 4 波長,Tx group A/B 圖上兩組均標 1311 nm(CWDM 格點上的 DWDM 通道);另有 Type A/B 雙向波長實作示意
報告_OCP2026_Broadcom_CPO與OCI_20261015_p13.png p13 真資料圖 200G 全鏈路功耗與傳輸距離表:DAC 7 pJ/bit 2m、整合 OCI 7 pJ/bit 500m、DR LRO 前面板可插拔 23 pJ/bit 500m
報告_OCP2026_Broadcom_CPO與OCI_20261015_p14.png p14 真資料圖 1024 XPU scale-up 叢集表:GPU 25.6 Tbps/XPU、每機櫃 64、16 櫃、每台 128 條雙向光纖、每櫃 8,192 條;交換器 204.8 Tbps、每櫃 32、4 櫃、每台 1024 條、每櫃 32,768 條

原始內容

p1

Rajiv Pancholy Director Hyperscale Strategy & Products, Broadcom CPO, OCI OCP SPECIAL FOCUS: PHOTONICS

p2

AI Scale-up, Scale-out and Scale-across Networking Scale-up In Rack Scale-out Across Racks Datacenter1 Datacenter2 Across Racks … Spine Leaf … … … Spine Leaf … … Across Data Centers Scale-out Scale-across

p3

Optical Interconnect Technology Options NPO OE CPO NPO FRO/LRO/ LPO IL IL OE IL Faceplate density & thermal Improvements 10x reliability improvement vs. pluggables Pluggable OE OCI SerDes ASIC/XPU SerDes ASIC/XPU SerDes ASIC/XPU Lowest latency, power and cost -at par with copper reliability Pluggable flexibility but limited reach, power/performance IL IL IL OCI ASIC/XPU D2D

p4

Leading the Future of Co-Packaged Optics Next Gen 2028 4th Generation CPO 102.4T 2026 TH6 Davisson 200G/lane 51.2T 2024 TH5 Bailly 100G/lane 25.6T 2022 TH4 Humboldt 100G/lane 4th Generation CPO in development

1M device hours with 0 link flaps Open and Scalable Mature Partner Ecosystem

p5

CPO: MTBF Advantage for AI Networks Training Job Cluster 1 Cluster N START Training Job Training Job Training Job Cluster 2 Cluster 3 Scale-Out Switches Cluster 1 Cluster 3 Cluster 2 Cluster N Link Flap Link Flap Checkpoints … Scale-Out with Pluggable Optics Training Hrs Lost -$$$$

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CPO: MTBF Advantage for AI Networks Training Job Cluster 1 Cluster N START Training Job Training Job Training Job Cluster 2 Cluster 3 Scale-Out Switches Cluster 1 Cluster 3 Cluster 2 Cluster N Link Flap Cluster 1 Cluster N Cluster 2 Cluster 3 Checkpoints … … Training Job Training Job Training Job Training Job 90% Efficiency Improvement Scale-Out with Pluggable Optics Scale-Out with CPO Training Hrs Lost -$$$$

p7

Challenges to Overcome for CPO & OCI at Scale Advanced Packaging • High-density and high-quality PIC to EIC attach required • Must optimize signal integrity • Enablement for 400G direct drive Optical Connectivity • More than 1k fibers connecting to each chip package • Detachable fiber connectivity to enable package reflow Volume Manufacturing • Must deliver industry leading yield and reliability through automation • Enable system partners with automated assembly and test Auto dispenser with loader and unloader Detachable fiber connector EIC PIC EIC to PIC attach with COUPE

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CPO Support Frame Attach Automation Example

p9

Broadcom CPO Backend MFG Automation Line Support Frame Attach (Automation Example)

p10

TH6-Davisson CPO Partner Ecosystem ELSFP FAU TH6-Davisson CPO Rack Unit

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OCI-MSA Future AI infrastructure built on open standards. Architecture that delivers the efficiency required to scale AI infrastructure. Optical Scale-Up Founding Members Industry alignment around an optical scale-up. OCI-MSA GEN1 Specification www.oci-msa.org Est. March 12, 2026 Working to enable a broader industry participation structure while maintaining pace of innovation.

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OCI-MSA GEN1 Specification Diagrams OCI-MSA implementation options Bi-Di Group A and B Wavelength Implementation DWDM channels on CWDM grid for a Bi-Di link OCI-MSA GEN1 Specification www.oci-msa.org

p13

Total Link Power and Reach Comparison – 200G OCI – the reach of Front Panel Pluggable, the power of Copper

p14

Building a 1024 XPU Scale-Up Cluster Inside GPU 1 2 Fiber Shuffle 3 Patch Panel 4 Fiber Jumpers 5 Inside Switch Optical Network Components 1 Scale-up Scale-up 2 Scale-up Scale-up 3 Scale-up Scale-up 4 Scale-up Scale-up 5 Scale-up Scale-up 6 Scale-up Scale-up 7 Scale-up Scale-up 8 Scale-up Scale-up 9 Scale-up Scale-up 10 Scale-up Scale-up 11 Scale-up Scale-up 12 Scale-up Scale-up 13 Scale-up Scale-up 14 Scale-up Scale-up 15 Scale-up Scale-up 16 Scale-up Scale-up 1 2 3 5 4 4 3 2 204T 1024 Scale-Up GPU Switch Scale-Up BW/XPU 25.6 Tbps 204.8 Tbps Per Rack 64 32 Total racks 16 4 Total Units 1024 128 Fibers/unit 128 (Bi-Di) 1024 (Bi-Di) Fibers/rack 8,192 32,768

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1M XPU Cluster with Single Layer Scale-Out • Very high bandwidth low latency scale-up domain → to connect many scale-out rails. • ESUN framework to unify scale-up and scale-out messages • Single scale-out switch can connect 1024 scale-up PODs (1024 x1024) x 1000 SINGLE LAYER SCALE-OUT Use ESUN for unified protocol enabling domain fungibility Advantage of Super High BW, Lowest Latency Scale-up OPTICAL BACKPLANE 1,048,576 XPU

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• Problem to solve • Need to address optical backplane and deployment challenges with industry participation • Adoption into a single type of Scale-Up interconnect will help to produce the right scale and cost point to drive the next phase of AI interconnect build outs • OCI-MSA movement to include a larger ecosystem of partners • Links: • OCI-MSA GEN1 Specification please see www.oci-msa.org • Broadcom CPO BiDi White Paper https://docs.broadcom.com/doc/cpo-bidi • What is Integrated Optics for AI Infrastructure https://www.broadcom.com/topics/integrated- optics-for-ai-infrastructure Call to Action

p17

Thank You!