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報告_MS_晶圓代工月報_台積電3Q26預覽_20261005

更新 2026-10-06

PDF 原檔:報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_original.pdf

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僅列 ≥40KB 並逐張 Read 者;其餘 <40KB 抽圖(含 Exhibit 1-2 晶圓價格趨勢/GM 與折舊、CoWoS/CoPoS/EMIB 產能長條圖等)預設為小圖,未逐張驗證,lib 不嵌。

檔名 size 分類 親眼所見內容
報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_003.png 43KB 真資料圖 TSMC 年度 capex(US$bn,2011-2028e 長條)與 capital intensity(折線,約 2021 高點 52% 後下滑至 2028e 約 28%)
報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_005.png 69KB 真資料圖 TSMC 簡報頁「N2 Family Technology Capacity Growth」:N2/A16 產能 2025→2026(F)→2027(F)→2028(F) 長條,標註 2026-2028 CAGR 70%(12 吋約當 K wafer),來源 TSMC
報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_009.png 253KB 真資料圖 TSMC 簡報「CoWoS Enables AI Compute Scaling」:interposer 尺寸 roadmap,CoWoS-S 1.5/2/3.3 reticle('16-'23)、CoWoS-R 1.4、CoWoS-L/R 3.3/5.5/9.7 reticle(至 '27),附 SoC+HBM 與 SoIC 多晶粒示意,1 reticle≈830mm²,來源 TSMC
報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_010.png 142KB 真資料圖 Yole 圖「Size does matter」:~5.5x reticle interposer(4,565mm²)於 300mm 晶圓僅 7 片、面積效率約 45%;300x300mm² 面板 16 片、約 81%、成本約 -10%;600x600mm² 面板 64 片、約 81%、成本約 -20%
報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_011.png 268KB 真資料圖 Intel 簡報「EMIB Scalability to Support AI Demand」:2023 約 4x reticle/約 80x80 封裝/8 HBM/12 EMIB;2026 >8x/約 120x120/12 HBM/>20 EMIB;2028 >12x/>120x180/>24 HBM/>38 EMIB,附三代封裝示意
報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_012.png 227KB 真資料圖 UMC 簡報頁「TFLN pros and cons」:優勢=低損耗、高頻寬(>110 GHz)、熱穩定佳、線性度極佳;劣勢=體積大、較矽昂貴、與 SiPh 整合需異質整合或先進封裝;右側為 TFLN MZM 結構與電子顯微圖
報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_013.png 263KB 真資料圖 簡報頁「Modulator selection 2. MRM」:微環調變器(含 heater、Ge implant、PD bias、pn-junction)立體結構;要點=體積小、驅動電壓低、電頻寬高、對溫度極敏感、製程控制要求高、消光比與速度需取捨、不適合 400Gbps/channel 以上(報告圖說標示來源 UMC)
報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_015.png 46KB 真資料圖 TSMC P/B(藍線)與 ROE(黃階梯線)2011-2026,標示 P/B 平均 3.8x(估值圖)
報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_024.png 62KB 真資料圖 MS 對 TSMC 的評等與目標價沿革圖(2023-10 至 2026-10,紅階梯線至 2,988,股價藍線約 2,500),揭露頁圖
報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_025.png 51KB 真資料圖 MS 對 UMC 的評等與目標價沿革圖(紅階梯線至 138),揭露頁圖

原始內容

Morgan Stanley Taiwan Limited+ Morgan Stanley Taiwan Limited+ Morgan Stanley Taiwan Limited+
Charlie Chan Equity Analyst Charlie Chan Equity Analyst Charlie Chan Equity Analyst
C arlie.C an@morganstanley.com C arlie.C an@morganstanley.com +886 2 2730-1725
Daniel Yen, CFA Equity Analyst Daniel Yen, CFA Equity Analyst Daniel Yen, CFA Equity Analyst
Daniel.Yen@morganstanley.com Daniel.Yen@morganstanley.com +886 2 2730-2863
Morgan Stanley Asia Limited+ Morgan Stanley Asia Limited+ Morgan Stanley Asia Limited+
Daisy Dai, CFA Equity Analyst Daisy Dai, CFA Equity Analyst Daisy Dai, CFA Equity Analyst
Daisy.Dai@morganstanley.com Morgan Stanley Taiwan Lucas.Wang@morganstanley.com Morgan Stanley Asia Daisy.Dai@morganstanley.com Morgan Stanley Taiwan Lucas.Wang@morganstanley.com Morgan Stanley Asia +852 2848-7310 +886 2 2730-2875
Lucas Wang Lucas Wang Lucas Wang
Researc Associate Researc Associate Researc Associate
Ethan Jia Ethan Jia Ethan Jia
Et an.Jia@morganstanley.com +852 3963-2287 Et an.Jia@morganstanley.com +852 3963-2287 Et an.Jia@morganstanley.com +852 3963-2287
Greater China Technology Semiconductors Greater China Technology Semiconductors Greater China Technology Semiconductors
Asia Pacific Asia Pacific Asia Pacific
Industry View Attractive Industry View Attractive Industry View Attractive
What's Changed What's Changed What's Changed
Researc Associate UMC (2303.TW) From To
Price Target NT$138.00 NT$ 88.00
TSMC (2330.TW) From To
Price Target NT$2,988.00 NT$3,088.00

Morgan Stanley does and seeks to do business with companies covered in Morgan Stanley Research. As a result, investors should be aware that the firm may have a conflict of interest that could affect the objectivity of Morgan Stanley Research. Investors should consider Morgan Stanley Research as only a single factor in making their investment decision.

For analyst certification and other important disclosures, refer to the Disclosure Section, located at the end of this report.

= Analysts employed by non-U.S. affiliates are not registered with FINRA, may not be associated persons of the member and may not be subject to FINRA restrictions on communications with a subject company, public appearances and trading securities held by a research analyst account.

M Idea October 5, 2026 08:00 PM GMT

Greater China Semiconductors | Asia Pacific

The Foundry Floorplan: TSMC 3Q26 Earnings Preview; UMC Preli inary 2027 Positives

We think the capex budget ight gradually shift to AI co pute and AI networking in 2028, as e ory usage needs to be opti ized. We see positives for TSMC and UMC.

TSMC 3Q26 earnings preview: We expect the company to raise full-year revenue gui ance to the low-to-mi -40% range (vs. above 40%) Y/Y, implying 4Q26 revenue will rise 10%-15% Q/Q ami very strong 3nm eman . 3Q26 gross margin shoul reach the high en of gui ance of 67.5% However, shoul Intel focus on internal capacity expansion, we think TSMC woul maintain 2nm capacity expansion at the same pace an its capex at US$54bn for 2026. For 2027, we see TSMC's capex reaching US$75bn to US$80bn.

In terms of 2027 wafer price hikes, we see lea ing e ge (7nm an below) up 5%-10% an mature no es up 0%-3%; hence, gross margin coul approach 70% in 2027. As a result, we raise our TSMC price target by 3% to T$3,088.

Key topics for upcoming TSMC 3Q26 earnings call on October 15:

  1. Woul TSMC consi er working with TereFab (Taiwan News, Oct 3 2026) an buil ing new fab sites in Texas (Bloomberg, Oct 1 2026)? Our view is that expansion in Texas coul be necessary, consi ering customer eman an limite space at the Arizona fab in five years.
  2. If Intel were to increase capex, woul that re uce outsourcing at TSMC? Our recent in ustry checks suggest some trimming of Intel's 3nm an 2nm; how might TSMC reallocate its resources?
  3. How woul TSMC a ress large reticle size chip eman ? Our checks suggest Me iaTek han le TPU v10 IceFish reticle size initially at 14x; coul TSMC's CoWoS or CoPoS be able to support such packaging?

We raise our UMC price target by 36% to T$188 on AI networking (SiPh)

business upside: Some investors remain on the si elines ami ongoing smartphone an PC eman weakness. We have seen some or er cuts in PC semis recently, as some consumer analog IC customers (e.g., Silergy) have not been able to pass through UMC's wafer price hike. Therefore, some investors o not expect any UMC's price hike in 2027. However, two growth rivers coul help UMC raise wafer price for 8-inch in 2027: 1) Samsung DDI outsourcing, as we note in our earlier Foun ry Floorplan, an 2) growing SiPh PIC eman , in particular after UMC intro uce its 400Gb per lane solution (PIC + TFLN) solution.

M Idea

AlphaSignals Earnings Preview

Focus KPI Focus KPI urprise Likely impact to consensus EP *
TSMC 2330.TW
3Q26 GM and 4Q26 Revenue guidance Likely upside surprise Modest revision higher

M Idea

TSMC 3Q26 earnings and 4Q26 guidance preview

Exhibit : 3Q26 earnings and 4Q26 guidance preview

(NT$ bn) 3Q26 - Guidance 3Q26 - Preliminary 3Q26 - MS Est. 3Q26 - Consensus 4Q26 - Guidance 4Q26 - MS Est. 4Q26 - Consensus
Revenue US$44.6 - 45.8bn 1,499 1,450 1,686 1,591
Q/Q +12% at mid-point in USD 14.1% 9.7%
Y/Y 46.5% 52.1%
GM (%) 65.0% - 67.0% 67.5% 66.5% 68.6% 66.4%
OpM (%) 56.0% - 58.0% 60.8% 58.2% 62.2% 58.4%
EPS (NT$) 30.74 28.28 35.25 31.23

Source: Company data, FactSet, Morgan Stanley Researc estimates

TSMC's 2026-28 foundry floor lan broadly aligns with our bottom-u demand analysis

Our in ustry checks suggest ASML allocates capacity base largely on historical eman an long-term partnerships, in icating that TSMC remains the largest customer for EUV shipments. If so, TSMC shoul retain strong pricing power an coul increase lea ing-e ge wafer prices by 5%-10% in 2027, reflecting both the value it elivers to customers an the potential for margin expansion.

Exhibit 3: TSMC's GM and depreciation trends - 60% s ould be t e floor

Source: Company data, Morgan Stanley Researc (e) estimates

Exhibit 2: TSMC - Wafer pricing trend

Source: Company data, Morgan Stanley Researc (e) estimates M Idea

Exhibit 4:

TSMC's capex intensity s ould drop significantly as a result of robust revenue growt

Source: Company data, Morgan Stanley Researc (e) estimates

TSMC 2nm and 3nm ca acity growth remains robust; 5nm set to decline

Consistent with our eman forecast, TSMC in icate very strong capacity requirements for both 2nm an 3nm starting in 2026, implying a 70% capacity CAGR for N2 from 2026 to 2028. TSMC also suggeste that 5nm capacity will begin to ecline from 2027, in line with our forecast that 5nm eman will rop as Blackwell transitions to Rubin on 3nm.

Separately, a vance packaging capacity expansion shoul remain in focus for TSMC in 2027. This inclu es, but is not limite to, CoWoS an SoIC, for which we now expect capacity to reach 200kwpm an 40kwpm, respectively, by 2027.

Exhibit 5: TSMC - Our estimate of 2nm customer demand breakdown

Exhibit 6: TSMC suggested N2 capacity could see >70% CAGR from 2026-28

Source: Morgan Stanley Researc estimates

Source: TSMC

With no es below 3nm expecte to continue to see strong eman , our checks suggest TSMC's 2nm/1.6nm capacity coul approach 100kwpm by en -2026, increase to 150170kwpm in 2027, an excee 200kwpm in 2028. We expect 1.4nm to begin pulling in tools in 2027, with the bulk of capacity ramping in 2028. Looking further ahea , we expect TSMC to intro uce initial 1.0nm capacity in Tainan in 2029. We have not bake in potential M Idea capacity in Texas, which we believe is still un er iscussion.

Exhibit 7: TSMC fab roadmap (wit out potential Texas capacity )

Node Location Fab Capacity - 2025 Capacity - 2026 Capacity - 2027 Capacity - 2028 Capacity - 2029
N3 Tainan F18 - P4/P5/P6/P8/P9 110k 160-170k
Arizona F21 - P2 20k
Japan F23 - P2 15k
Total 110k 180-190k 190k 200-205k
N2/A16 HsinChu F20 - P1/P2 20k 30k
Tainan F22 - P7/P8/P9 40-50k 60k
KaoHsiung F22 - P1/P2/P3/P4/P5/P6 25k 60k 80-90k 100k
Arizona F21 - P3/P4/P5/P6 20k
Total 45k 90-100k 150-170k 210k
A14 HsinChu F20 - P3/P4 10-20k 30-40k 40k
A14/A13/A12 Taichung F25 - P1/P2/P3/P4 10-20k 30-40k 80k
Total 20-40k 60-80k 120k
A10 Tainan F26 - P1/P2/P3/P4 5k
N40/28/22/12 Japan F23 - P1 25k
N28/16 Germany F24 5k 40k

Source: Morgan Stanley Researc estimates

M Idea

How ight TSMC address Intel's co petition in both wafer foundry and advanced packaging?

Intel EMIB-T remains com etitive in 2029; how TSMC will address?

With eman in AI continuing to boom, we expect TSMC an its OSAT partners to expe ite capacity expansion plans for CoWoS. We see TSMC's CoWoS capacity buil ing further to 260kwpm in 2028, from 130/200kwpm in 2026/2027, with 2028's expansion mainly focuse in Arizona's AP9/10 an potentially in AP7. TSMC is now con ucting trial pro uction for CoPoS in Taoyuan. If the progress goes well, we woul expect TSMC to start buil ing its CoPoS capacity, with location also likely to be in AP9/10 or AP7P3.

We expect the non-TSMC camp to expan CoWoS capacity to 110kwpm by 2028 year-en , from 80kwpm by en -2027. For ASE/SPIL, we expect FoCoS+CoWoS capacity to rise from 30kwpm at 2027-en to 50-60kwpm at 2028-en , with expansion focuse on CoWoS-L an CoWoS-R. For Amkor, we expect CoWoS capacity to increase from 30kwpm at 2027en to 55-60kwpm at 2028-en , also focuse on CoWoS-L an CoWoS-R.

Exhibit 8: We expect TSMC's CoWoS capacity to build furt er to 260kwpm in 2028, wit OSAT (ASE/SPIL/Amkor) toget er building to 110kwpm

Exhibit 9: We expect TSMC's CoPoS capacity to build furt er to 5-10kwpm in 2028 and 10-20kwpm in 2029, but t is mig t depend on results from trial production

Source: Company data, Morgan Stanley Researc (e) estimates Source: Morgan Stanley Researc (e) estimates

What about Intel EMIB capacity build?

For Intel, we see current average EMIB-M capacity of 110kwpm falling slightly to 95kwpm in 2027 as it converts some towar EMIB-T. We see the major customers of EMIB-M being Trainium3, upcoming Trainium 4 an its in-house server CPU. Average EMIB-T capacity is aroun 5kwpm in 2026, which we expect to further scale to 15-20kwpm in 2027 an 4045kwpm in 2028. All of the capacity mentione above is converte for 12-inch wafer equivalent, which we believe woul be much more easier to communicate with compare to TSMC CoWoS capacity.

Although some small projects are ongoing, we still see Me iaTek/Google Humufish consuming most of the capacity uring 2027-28. We maintain our view that Intel EMIB-T

M Idea

coul still pro uce close to 3mn units of Humufish from late 2027-28, by assuming 4-5 chips per wafer of EMIB-T.

Exhibit 0: We expect Intel's EMIB-T capacity to reac 20kwpm in 2027 and 45kwpm in 2028; EMIB-M capacity is currently at 110kwpm, w ic could fall to 95kwpm due to conversion

Intel EMIB Capacity (Average)

Source: Morgan Stanley Researc (e) estimates

In ee , we have seen some TSMC customers surveying (testing vehicles) Intel EMIB-T ue to the esign for larger chip size, lower cost, an intention to seek a secon source because TSMC's CoWoS capacity is still relatively tight. However, we believe TSMC coul still try to expan its packaging size by leveraging ifferent technologies to meet customers' nee s. We think it remains concerne about whether it is going to open its front-en computing ie pro uction/know-how to its competitor, Intel, for back-en packaging.

Our prediction of the trend after 2028 - TSMC might:

  1. Pull in CoPoS (panel-level process) with both 300mm an 500mm square panel size
  2. Intro uce 3.5D packaging with SoIC for vertical chip stacking (Meta MTIA is surveying)
  3. A opt glass core substrate to solve warpage for >9.7x reticle-size chips

M Idea

Exhibit : TSMC's roadmap for interposer size

報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_009

Source: Winway, TSMC

Pros and cons of TSMC's CoWoS, Intel's EMIB, TSMC's CoPoS, and SoIC

TSMC's CoWoS, Intel's EMIB, TSMC's CoPoS, an TSMC's SoIC represent ifferent points along the a vance packaging spectrum, each optimizing for a ifferent balance of ban wi th, cost, scalability an integration complexity. We think future esign of the chips is likely to combine these approaches-for example, using CoWoS for lateral integration an SoIC for vertical stacking-to achieve optimal system-level performance.

Exhibit 2: Comparison between TSMC's CoWoS, CoPoS, SoIC, and Intel's EMIB-T

CoWoS CoPoS SoIC EMIB
Packaging solutions 2.5D Wafer level 2.5D Panel level 3D Chip/die stacking 2.5D Substrate level
Performance (data bandwidth) High Low Highest Low
Efficiency for large chip (use of the subrate area) Low High NA High
Production sweet spot of the chip size <9.7x reticle size >9.7x reticle size >9.7x reticle size >9.7x reticle size
Cost at 9.7x retical size (including yield issue) High Theoretical low Highest Theoretical low
Technology maturity (opposite of execution risk) High Low Medium Low
Thermal challenge Medium Theoretical low Highest Theoretical low
Overview CoWoS excels in high-bandwidth 2.5D integration but is costly and capacity- limited CoPoS targets large-scale, cost- efficient integration but is still maturing SoIC delivers the highest performance through 3D stacking at the expense of complexity and thermal constraints EMIB offers a more cost-effective and modular alternative with some performance trade-offs
Strategic consideration from customers Strategic consideration from customers Strategic consideration from customers Strategic consideration from customers Strategic consideration from customers
Pros Reliable and time to market Cost efficient with larger chip size Breakthrough the planar constraints Cost efficient with larger chip size
Cons Higher Cost Not currently avaiable at TSMC High cost with thermal issue Execution Risk

Source: Company data, Morgan Stanley Researc

In summary,

M Idea

  • CoWoS excels in high-ban wi th 2.5D integration but is costly an capacity-limite
  • EMIB offers a more cost-effective an mo ular alternative with some performance tra e-offs
  • CoPoS targets large-scale, cost-efficient integration but is still maturing
  • SoIC elivers the highest performance through 3D stacking at the expense of complexity an thermal constraints.

Exhibit 3: CoWoS, CoPoS and FoPLP comparison

COMPARISON OF WLP AND PLP FOR LARGE PACKAGE SIZE

Source: Panel Level Packaging 2025 report, Yole Group

報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_010

wwwyolegroup.com | ©Yole Group 2025

Source: Yole

Exhibit 4: Intel's EMIB s ould easily support larger c ips wit more reticles (>12) if its supply c ain can execute well

報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_011

Source: Intel M Idea

UMC is well positioned for Silicon Photonic IC (PIC) foundry

In our previous Foun ry Floorplan, we presente a constructive view on UMC given its AIrelate revenue. Management in icate AI revenue of US$300mn this year (3-5% of revenue), potentially more than tripling to US$1bn in three years (2029).

UMC has a capacity expansion plan to capture AI eman , inclu ing a clean room for a vance packaging for AI chips, such as wafer-on-wafer an memory-on-memory stacking.

Some investors remain on the si elines ami ongoing smartphone an PC eman weakness, an we have seen some or er cuts of PC semis recently. Some think a UMC price hike in 2027 woul n't go through, but we see two growth rivers helping it successfully hike wafer price for 8-inch in 2027: 1) Samsung DDI outsourcing, an 2) growing SiPh PIC eman , in particular after UMC intro uce its 400Gb per lane solution (PIC + TFLN) solution.

How UMC is differentiated in PIC foundry

Accor ing to UMC, InP an TFLN are the two most promising solutions, as they are much more mature than the other conten ers. InP is facing severe shortage, a ing to TFLN's momentum.

UMC Group's TFLN program starte in 2021 with 6' in mass pro uction an 8' in sampling. TFLN's strengths inclu e low loss, high ban wi th (> 110 GHz), goo thermal stability, an strong linearity.

Integrating TFLN with PIC is a challenge as well as an opportunity. A vance packaging schemes an micro transfer printing are both seen as promising can i ates. UMC is eveloping the integration technology, leveraging its expertise in PIC, TFLN, an a vance packaging.

A option of higher-performance mo ulators (TFLN/InP) an improvement in photo io es are key factors affecting eployment of plain-vanilla (non-WDM, IM/DD) DCIs with 400 Gbps/channel performance an beyon , which is very close to TSMC's mainstream PIC technology Micro Ring.

Exhibit 5: UMC differentiates in TFLN process offering for PIC

報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_012

Source: UMC

M Idea

Exhibit 6: TSMC's PIC focus on Micro Ring Modulator

報告_MS_晶圓代工月報_台積電3Q26預覽_20261005_013

Source: UMC

M Idea

About Foundry Floorplan

In 2011, we first publishe this pro uct (Asia/Pacific Foun ry: The Foun ry Floorplan) to provi e our analysis of foun ry in ustry ynamics. We have resume this practice as global foun ry competition remains active. Foun ry supply is also a critical resource for future AI chips, whether in the global market or China's local market.

Below are prior reports from this series:

M Idea

TSMC: Esti ate and price target revisions

Our earnings forecasts increase 4% for 2026, 5% for 2027 and 3% for 2028: We raise our 2026 revenue forecast an mo estly increase our margin assumptions to reflect stronger-than-expecte 3Q26 performance, riven by robust AI eman , inclu ing sustaine Blackwell shipments. We raise our 2027-28 revenue assumptions by 3%-5%, reflecting the increase in strong lea ing-e ge eman as well as the wafer price hike.

Exhibit 7: TSMC: Estimate revisions

(NT$ mn) New 2026e Old 2026e Diff.% New 2027e Old 2027e Diff.% New 2028e Old 2028e Diff.%
Net sales 5,589,451 5,438,831 3% 7,471,986 7,187,423 4% 9,340,906 9,037,662 3%
Gross profit 3,779,639 3,663,403 3% 5,155,084 4,912,038 5% 6,420,040 6,219,699 3%
Operating profit 3,384,759 3,249,517 4% 4,577,529 4,342,910 5% 5,739,313 5,548,069 3%
Pretax income 3,563,509 3,425,902 4% 4,685,707 4,446,359 5% 5,843,492 5,647,518 3%
Net income 2,990,329 2,880,237 4% 3,960,521 3,758,166 5% 4,924,352 4,759,400 3%
Diluted EPS 115.32 111.08 4% 152.74 144.93 5% 189.91 183.55 3%
Margins
Gross margin 67.6% 67.4% 69.0% 68.3% 68.7% 68.8%
Operating margin 60.6% 59.7% 61.3% 60.4% 61.4% 61.4%
Pretax margin 63.8% 63.0% 62.7% 61.9% 62.6% 62.5%
Net margin 53.5% 53.0% 53.0% 52.3% 52.7% 52.7%

Source: Morgan Stanley Researc (e) estimates

Exhibit 8: TSMC: Quarterly financials

(NT$ mn) 1Q25 2Q25 3Q25 4Q25 1Q26 2Q26 3Q26e 4Q26e 2023 2024 2025 2026e 2027e 2028e
Total Revenues Sequential Change 839,254 -3.4% 933,792 11.3% 989,918 6.0% 1,046,090 5.7% 1,134,103 8.4% 1,270,380 12.0% 1,499,073 18.0% 1,685,894 12.5% 2,161,736 2,894,308 3,809,054 5,589,451 7,471,986 9,340,906
Change vs Year Ago 41.6% 38.6% 30.3% 20.5% 35.1% 36.0% 51.4% 61.2% -4.5% 33.9% 31.6% 46.7% 33.7% 25.0%
Cost of Sales (345,859) (386,423) (401,375) (394,104) (382,808) (410,070) (486,890) (530,044) (986,625) 45.6% (1,269,954) (1,527,760) (1,809,812) 32.4% (2,316,902) 31.0% (2,920,866) 31.3%
Percent of Revenues 41.2% 493,395 58.8% 41.4% 547,369 40.5% 37.7% 33.8% 32.3% 32.5% 31.4% 43.9% 40.1% 6,420,040
Gross Profit Gross Margin Total Opex Percent of Revenues R&D Percent of Revenues (86,314) 10.3% (56,547) 6.7% (29,767) 1.1% 53.6% 58.6% (83,946) 9.0% 588,543 59.5% (87,858) 651,987 62.3% (87,084) 8.3% (64,858) 6.2% 751,295 66.2% (92,329) 8.1% (67,757) 6.0% 860,311 67.7% (93,708) 7.4% 1,012,184 67.5% (101,410) 6.8% 1,155,849 68.6% (107,433) 6.4% (80,146) 4.8% 1,175,111 54.4% (253,645) 11.7% (182,370) 8.4% 1,624,354 56.1% (302,301) 10.4% (204,182) 7.1% 2,281,294 59.9% (345,202) 9.1% (246,427) 6.5% 3,779,639 67.6% (394,880) 7.1% (298,195) 5.3% 5,155,084 69.0% (577,555) 7.7% (356,300) 4.8% 68.7% (680,727) 7.3% (400,500) 4.3%
SG&A Sequential Change Change vs Year Ago Operating Income 407,081 48.5% (61,280) 6.6% (22,666) -23.9% -3.6% 463,424 8.9% (63,742) 6.4% (24,116) 6.4% -6.5% 500,685 (22,227) -7.8% -24.5% 564,902 54.0% (24,573) 10.6% -17.4% 658,966 (73,146) 5.8% (20,562) -16.3% -9.3% (77,146) 5.1% (24,263) 18.0% 0.6% 910,774 (27,287) 12.5% 22.8% 1,048,416 (71,275) (98,119) 1,322,053 45.7% (98,775) 1,936,092 50.8% (96,685) 3,384,759 60.6% (221,255) 4,577,529 61.3% (280,227)
Percent of Revenues Non-operating Income(Loss) Profit Before Taxes 23,815 430,895 49.6% 29,612 50.6% 24,684 53.1% 27,461 58.1% 766,603 60.3% 60.8% 27,045 62.2% 27,045 921,466 42.6% 57,706 83,786 105,571 178,750 108,179 5,739,313 61.4% 104,179
Percent of Revenues 51.3% 493,035 52.8% 525,369 592,363 56.6% 28,834 687,800 95,827 862,430 937,819 62.6% 1,075,461 63.8% 979,171 45.3% 1,405,839 48.6% 2,041,663 53.6% 3,563,509 63.8% 4,685,707 62.7% 5,843,492
Taxes Tax Rate (70,163) 16.3% 19.4% (73,614) 14.0% (86,948) 14.7% 60.6% 67.9% (155,649) (140,673) 15.0% (161,319) 15.0% (233,407) 16.6% (326,266) 16.0% (572,639) 16.1% 15.5% 62.6% (919,140) 15.7%
(95,542) (114,998) 16.7% 18.0% (141,404) 14.4% (725,186)
Net Income, Cont Ops 360,733 397,493 451,755 546 505,415 572,801 797,146 0 914,141 837,768 1,172,432 2,990,870 3,960,521
Minority Interest 831 780 329 706,781 1,715,397 4,924,352
(219) 0 730 2,486
Reported Income (TW 361,564 43.1% 42.7% 452,301 45.7% (322) 53.2% 54.2% 838,498 (541) 0 52.7%
Percent of Revenues 398,273 797,146 914,141 38.8% 836 1,717,883 2,990,329 0
GAAP) 505,744 572,480 706,562 1,173,268 40.5% 45.1% 53.5% 3,960,521 53.0% 4,924,352
60.3% 60.7% 39.1% 48.3% 50.5% 58.3% 55.6% 80.8% 74.1%
Change vs Year Ago 76.2%
35.0% -17.5% 46.4% 32.4% 24.3%
15.36 22.08 30.74 35.25 39.9% 189.91
Reported EPS (NT$, TW GAAP) 13.94 17.44 19.50 77.4% 32.34
27.25 45.25 66.25 115.32 152.74
Basic shares (mn units) 25,927 25,928 25,929 25,930 25,931 25,931 25,931 25,931
25,928 25,931 25,929 25,928 25,928 25,930

Source: Company data, Morgan Stanley Researc (e) estimates Our PT increases to T$3,088 from T$2,988, riven primarily by our estimate revisions. Our PT implies a 20x P/E multiple on our new 2027 EPS forecast. TSMC currently tra es at 17x that estimate, close to its average NTM P/E of 16.5x since 2018. We fin the stock attractive at current levels.

We continue to erive our 12-month price target (base-case scenario) using a resi ual income valuation framework. Our key assumptions are unchange , inclu ing a cost of equity of 9.2% (beta of 1.2, equity risk premium of 6.0%, an risk-free rate of 2.0%), an interme iate growth rate of 10.5%, an a terminal growth rate of 4%.

Our bull an bear case scenario values increase to NT$3,720 (from NT$3,600) an NT $1,700 (from NT$1,645), respectively.

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Exhibit 9: TSMC: Residual income model

2026e 2027e 2028e 2029e 2030e 2031e 2032e 2033e 2034e 2035e 2036e 2037e
Total Equity 7,887,536 11,096,019 15,060,873 18,543,374 22,391,538 26,643,760 31,342,464 36,534,533 42,271,769 48,611,415 55,616,723 63,357,589
Net Profit 2,990,329 3,960,521 4,924,352 5,441,409 6,012,757 6,644,096 7,341,726 8,112,607 8,964,431 9,905,696 10,945,794 12,095,103
ROAE 44.8% 41.7% 37.7% 32.4% 29.4% 27.1% 25.3% 23.9% 22.8% 21.8% 21.0% 20.3%
Residual Income 1,944,291 2,565,485 3,157,086 3,491,900 3,741,525 4,007,915 4,295,590 4,608,548 4,950,628 5,325,712 5,737,863 6,191,417
Spread 35.6% 32.5% 28.5% 23.2% 20.2% 17.9% 16.1% 14.7% 13.6% 12.6% 11.8% 11.1%
Ending Equity Capital 7,887,536
PV of Forecast Period 25,153,069
PV of Continuing Value 47,029,569
Equity Value 80,070,174
No. of Shares 25,930
Projected Price (NT$) 3,088

Source: Company data, Morgan Stanley Researc (e) estimates

Exhibit 20: TSMC's one-year forward P/E: Valuation does not appear stretc ed as a key AI semi enabler

2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Source: Company data, FactSet, Morgan Stanley Researc

Exhibit 2 : TSMC - P/B vs. ROE

Source: Company data, Refinitiv, Morgan Stanley Researc

M Idea

Risk Reward - TSMC (2330.TW) Risk Reward - TSMC (2330.TW)

Expect 40-45% revenue growth in 2026; OW

NT$3,088.00 PRICE TARGET

Base case, residual income model. Key assumptions: a cost of equity of 9.2% (beta of 1.2, riskfree rate of 2.0% and risk premium of 6.0%), an intermediate growth rate of 10.5%, and a terminal growth rate of 4.0%.

NT$3,113.97

MS PT

Mean Morgan Stanley Estimates

Consensus Price Target Distribution

NT$2,010.00

NT$3,800.00

Source: Refinitiv, Morgan Stanley Research

RISK REWARD CHART

Key: Historical Stock Performance Current Stock Price Price Target

Source: Refinitiv, Morgan Stanley Research

BULL CASE

BASE CASE

OVERWEIGHT THESIS

  • ▪Reflecting robust AI capex guidance from global CSPs, we are OW on TSMC.
  • ▪Our estimates reflect TSMC' s strong profitability and another year of >40% Y/Y revenue growth seen for 2026.
  • ▪Leading-edge (7nm below) demand remains robust.
  • ▪Reflecting increased bargaining power, long-term margin expansion, and sustainable AI semi demand, we expect the stock to rerate to our implied 2027e target P/E of 20x.

Consensus Rating Distribution

Risk Reward Themes

New Data Era: Positive
Pricing Power: Positive
Secular Growth: Positive

View descriptions of Risk Rewards Themes here

BEAR CASE

24x 2027e EPS

TSMC dominates foundry services: 1) Breakthrough in EUV tech and materials accelerates node migration to 3nm and beyond. 2) Intel outsources its server CPU production to TSMC sooner than expected. 3) Intel or Samsung exits leading-edge foundry business. 4) New tech megatrends such as 6G or AI drive global semi revenue growth and increase demand for leading edge nodes. 5) Cost per transistor decreases further along with node migration.

20x 2027e EPS

Leading position in leading-edge logic foundry services with some gross margin expansion: 1) Global semi revenue CAGR is sustained in the high single digits in 202528. 2) TSMC continues to lead in market share in 16nm, 7nm, 5nm, 3nm, and 2nm. 3) It continues to observe robust AI-related demand. 4) Cost per transistor does not decrease meaningfully in 3nm and 2nm, while capex per k is more demanding than for 7nm and 5nm.

11x 2027e EPS

TSMC's dominance in foundry business erodes: 1) Global ex-memory semi revenue growth is weaker than expected in 2025-28. 2) Declining trailing-edge market share causes revenue shortfall. 3) Intel's contribution is weaker than expected. Intel and/or Samsung successfully develop leading-edge process technology. 4) Intel's foundry business execution proves successful and weighs on TSMC with order competition. 5) Demand for 2nm is less than expected given high transistor cost for foundry customers.

NT$1,700.00

NT$3,720.00

NT$3,088.00

M Idea

Risk Reward - TSMC (2330.TW)

KEY EARNINGS INPUTS

Drivers Dec 2025 Dec 2026eDec 2027eDec 2028e
Revenue from 5nm Geometry (NT$, mn) 1,179,907 1,388,663 1,154,712 1,147,783
Revenue from 10/7nm Geometry (NT$, mn) 459,258 534,422 542,812 540,706
Revenue from 16/20nm Geometry (NT$, mn) 220,027 294,906 329,278 347,256

INVESTMENT DRIVERS

  • Moore's Law migration (chip scaling) and alternative technologies
  • Capex intensity - cost of building leading-edge foundry capacity
  • Bargaining power with key equipment vendors
  • Transistor cost for customers
  • ROI for leading-edge foundry

GLOBAL REVENUE EXPOSURE

Source: Morgan Stanley Research Estimate View explanation of regional hierarchies here

MS ALPHA MODELS

1/5 3 Month
MOST Horizon

Source: Refinitiv, FactSet, Morgan Stanley Research; 1 is the highest favored Quintile and 5 is the least favored Quintile

RISKS TO PT/RATING

RISKS TO UPSIDE

  • TSMC charging large customers more to keep its gross margin above 56% in the long term
  • AI semi demand growing more significantly than expected while TSMC maintains high market share in leading-edge foundry business
  • Outsourcing from Intel CPU increasing over 2025-27

RISKS TO DOWNSIDE

  • Inventory correction in 2026
  • Weakening demand for leading edge technologies
  • Costs of overseas fabs growing significantly

OWNERSHIP POSITIONING

Inst. Owners, % Active

75.9%

Source: Refinitiv, Morgan Stanley Research

MS ESTIMATES VS. CONSENSUS

Source: Refinitiv, Morgan Stanley Research M Idea

TSMC: Financial su ary

Exhibit 22: TSMC: Financial Summary

Income Statement, 2024-2028e, Year End Dec - (NT$ mn) Income Statement, 2024-2028e, Year End Dec - 2024 Income Statement, 2024-2028e, Year End Dec - 2025 Income Statement, 2024-2028e, Year End Dec - 2026e Income Statement, 2024-2028e, Year End Dec - 2027e Income Statement, 2024-2028e, Year End Dec - 2028e Balance Sheet, 2024-2028e, Year End Dec (NT$ 2026e 2027e - mn) Balance Sheet, 2024-2028e, Year End Dec (NT$ 2026e 2027e - 2024 Balance Sheet, 2024-2028e, Year End Dec (NT$ 2026e 2027e - 2025 Balance Sheet, 2024-2028e, Year End Dec (NT$ 2026e 2027e Balance Sheet, 2024-2028e, Year End Dec (NT$ 2026e 2027e Balance Sheet, 2024-2028e, Year End Dec (NT$ 2026e 2027e - 2028e
Revenue 2,894,308 3,809,054 5,589,451 7,471,986 9,340,906 Cash & Equivalent 2,127,627 2,767,856 3,661,121 5,146,886 7,691,797
YoY Growth 33.9% 31.6% 46.7% 33.7% 25.0% MarketableSecurity 294,393 300,738 383,795 383,795 383,795
Gross Profit b/f dep 2,247,086 2,924,669 4,539,736 6,088,989 7,751,511 A/R & N/R 272,088 281,791 531,976 660,603 799,884
Inventories 287,869 288,109 449,213 530,763 667,572
Less: COGS (1,269,954) (1,527,760) (1,809,812) (2,316,902) (2,920,866) Other Current Ass. 106,376 178,635 221,240 221,240 221,240
Variable costs (647,221) (884,385) (1,049,715) (1,382,996) (1,589,394) Total current assets 3,088,352 3,817,131 5,247,346 6,943,287 9,764,288
Depreciation & amort (622,733) (643,376) (760,097) (933,906) (1,331,471) Long-term Investment 149,040 172,370 227,936 227,936 227,936
Gross profit 1,624,354 2,281,294 3,779,639 5,155,084 6,420,040 Total fixed assets 3,234,980 3,691,841 5,059,707 6,596,943 7,782,224
% margin 56.1% 59.9% 67.6% 69.0% 68.7% Total other assets 219,565 251,682 279,138 279,138 279,138
YoY Growth 38.2% 40.4% 65.7% 36.4% 24.5% Total Assets 6,691,938 7,933,024 10,814,126 14,047,303 18,053,586
Operating Expenses: (302,301) (345,202) (394,880) (577,555) (680,727) A/P & N/P 74,227 84,330 136,031 160,727 202,155
R&D (204,182) (246,427) (298,195) (356,300) (400,500) Accrued Expenses 0 0 0 0 0
Sales and Marketing (13,144) (16,918) (20,088) (37,360) (46,705) Other Payable 531,377 630,217 871,930 871,930 871,930
General and Admin (84,975) (81,857) (76,597) (183,895) (233,523) Curr. of L-T Debt 59,858 136,926 167,410 167,410 167,410
Operating Profit 1,322,053 1,936,092 3,384,759 4,577,529 5,739,313 Other Curr. Liab. 599,064 606,547 707,796 707,796 707,796
% margin 45.7% 50.8% 60.6% 61.3% 61.4% Total Current Liab. 1,264,525 1,458,019 1,883,167 1,907,863 1,949,291
YoY Growth 43.5% 46.4% 74.8% 35.2% 25.4% L-T Liabilities 926,605 856,228 815,037 815,037 815,037
Non-Operating Income 83,786 105,571 178,750 108,179 Total 104,179 Other L-T Liab Total Liabilities 177,233 2,368,362 157,982 2,472,229 228,385 2,926,589 228,385 2,951,285 228,385 2,992,713
Pretax Profit % margin 1,405,839 48.6% 2,041,663 53.6% 3,563,509 63.8% 4,685,707 62.7% 5,843,492 62.6% Common Stocks 259,327 259,325 259,324 259,324 259,324
Tax (233,407) (326,266) (572,639) Preferred Stocks Capital Reserve 0 73,261 0 73,446 0 0 72,291 0 72,291
1,173,268 1,717,883 2,990,329 (725,186) (919,140) 3,955,957 72,291 7,513,969 10,722,452
Reported net Income 45.25 3,960,521 4,924,352 Retained earnings Treasury Stock 0 5,086,825 0 14,687,306 0
66.25 115.32 152.74 189.91 Minority Equity 35,031 41,199 0 41,953 0 41,953 41,953
Reported EPS (NT$) 115.32 4,323,576 5,460,795 7,887,536 15,060,873
EPS for consensus (NT$) 45.25 66.25 152.74 189.91 Total Total Equity Liab. & Equity 7,933,024 10,814,126 11,096,019 14,047,303
2024 19% 30% 2025 23% 35% 2026e 45% 2027e 42% 2028e 38% Depreciation 6,691,938 Year End Dec 2024 2025 688,096 8,083 2026e 3,509 2027e 0 18,053,586 2028e
Key Ratios, 2024-2028e Return (%) ROAA 32% 32% Net 31% Cash Flow Statement, 2024-2028e, (NT$ mn) Income Current 1,173,268 662,797 1,717,883 2,990,329 816,737 3,960,521 983,059 4,924,352 1,401,549
ROAE OP. ATO 0.9x Net Investment Losses (Gains) Decrease (Increase) in Working Capital 8,205 0
Gearing (x) 0.7x 0.7x 0.8x 1.0x Others 20,896 (38,988) (17,144) (121,942) (16,282) (277,252) (185,482) 0 0
Net Debt/ Equity Current Ratio -0.33x 2.4x -0.38x 2.6x -0.39x 2.8x -0.41x Cash -0.47x Flow-Operating (Purchase) of FA 1,826,177 (956,007) 2,274,976 (1,272,411) 3,517,042 (2,056,340) 4,758,098 (234,662) 6,091,239
Quick Ratio 3.6x 5.0x (2,520,295) (2,586,830)
1.9x 2.1x 2.2x 3.0x Sale of Fix Asset 895 (3,739) 797 1,992 0
Operating Cycle 4.4x (Purchase)L-T Inv. Others 94,008 (864,843) 0 127,220 0 (4,892) 0 0 0
AR/NR Turnover (days) Inventory Turnover (days) 29 76 26 68 26 73 29 76 28 74 Cash Flow-Inv. (1,144,393) (2,059,239) 0 (2,520,295) 0 (2,586,830)
AP Turnover (days) Cash Conversion (days) 19 19 22 78 23 22 80 Inc(Dec)-S-T Debt Inc(Dec) L-T 0 0 0 0 0 0
Debt 28,601 7,948 11,299 0
87 75 Dividend Paid (583,480) (752,039) (959,498) 0
Dir.&Emp.Bonus (363,055) 0 (466,779) 0 0 0 0
e = Morgan Stanley Research Source: Company Data, Morgan 18,486 (30,604)
Estimates Stanley Research (11,847) 0
82
(959,498)
(752,039)
Others (346,301) (440,345) (602,786) 1,485,764
Cash Flow-Financing 640,229 893,265 3,661,121 2,544,911 5,146,886
Change in Cash 662,199 2,767,856 5,146,886 7,691,797
Net cash/(debt), b/f 1,465,428 2,127,627
2,767,856 3,661,121
Net cash/(debt), c/f 2,127,627

M Idea

UMC: Esti ate and price target revisions

We raise our 2026, 2027, and 2028 earnings estimates by 56%, 25%, and 31%, respectively: Our 2026e change is ue mostly to strong 2Q26 non-op gains. We increase 2027/28e revenue an EPS ue to new CPO relate business contribution from 12-inch SiPh PIC as well as 8-inch TFLN. Our 2028e increase also inclu es DDI outsource from Samsung foun ry.

Exhibit 23: UMC: Estimate revisions

(NT$ mn) New 2026e Old 2026e Diff.%New 2027e Old 2027e Diff.%New 2028e Old 2028e Diff.%
Net sales 279,638 271,238 3% 357,846 327,483 9% 419,091 364,804 15%
Gross profit 89,018 82,884 7% 123,942 108,171 15% 156,862 127,311 23%
Operating profit 59,975 55,860 7% 94,477 78,823 20% 122,182 95,748 28%
Pretax income 97,963 65,511 50% 108,645 86,614 25% 138,350 105,539 31%
Net income 88,133 56,406 56% 89,233 71,242 25% 113,591 86,760 31%
Basic EPS 7.06 4.52 56% 7.15 5.70 25% 9.11 6.95 31%
Diluted EPS 7.02 4.49 56% 7.11 5.67 25% 9.05 6.91 31%
Margins
Gross margin 31.8% 30.6% 34.6% 33.0% 37.4% 34.9%
Operating margin 21.4% 20.6% 26.4% 24.1% 29.2% 26.2%
Pretax margin 35.0% 24.2% 30.4% 26.4% 33.0% 28.9%
Net margin 31.5% 20.8% 24.9% 21.8% 27.1% 23.8%

Source: Morgan Stanley Researc (e) estimates

Exhibit 24: UMC: Quarterly financials

(NT$ mn) 1Q26 2Q26 3Q26e 4Q26e 1Q27e 2Q27e 3Q27e 4Q27e 2024 2025 2026e 2027e 2028e
Total Revenues 61,038 68,733 73,187 76,680 83,696 88,507 93,909 91,735 232,303 237,553 279,638 357,846 419,091
Sequential Change -1.2% 12.6% 6.5% 4.8% 9.1% 5.7% 6.1% -2.3%
Change vs Year Ago 5.5% 17.0% 23.8% 24.1% 37.1% 28.8% 28.3% 19.6% 4.4% 2.3% 17.7% 28.0% 17.1%
Cost of Sales (43,219) (46,410) (49,399) (51,592) (54,705) (58,395) (60,907) (59,896) (156,649) (168,647) (190,620) (233,904) (262,228)
Gross Profit 17,818 22,323 23,789 25,088 28,991 30,111 33,002 31,838 75,654 68,906 89,018 123,942 156,862
Gross Margin 29.2% 32.5% 32.5% 32.7% 34.6% 34.0% 35.1% 34.7% 32.6% 29.0% 31.8% 34.6% 37.4%
Total Opex (6,542) (7,373) (7,480) (7,648) (7,192) (7,313) (7,441) (7,518) (24,042) (24,958) (29,043) (29,465) (34,680)
Percent of Revenues 10.7% 10.7% 10.2% 10.0% 8.6% 8.3% 7.9% 8.2% 10.3% 10.5% 10.4% 8.2% 8.3%
R&D (4,575) (4,747) (4,757) (4,767) (4,650) (4,700) (4,750) (4,800) (15,616) (17,725) (18,847) (18,900) (22,380)
Percent of Revenues 7.5% 6.9% 6.5% 6.2% 5.6% 5.3% 5.1% 5.2% 6.7% 7.5% 6.7% 5.3% 5.3%
Sales and Marketing (689) (733) (780) (817) (892) (943) (1,001) (978) (2,701) (2,433) (3,020) (3,815) (4,610)
Percent of Revenues 1.1% 1.1% 1.1% 1.1% 1.1% 1.1% 1.1% 1.1% 1.2% 1.0% 1.1% 1.1% 1.1%
General and Admin (1,278) (1,893) (1,943) (2,063) (1,650) (1,670) (1,690) (1,740) (5,724) (4,800) (7,176) (6,750) (7,690)
Percent of Revenues 2.1% 2.8% 2.7% 2.7% 2.0% 1.9% 1.8% 1.9% 2.5% 2.0% 2.6% 1.9% 1.8%
Operating Income 11,276 14,950 16,308 17,441 21,798 22,798 25,561 24,320 51,613 43,949 59,975 94,477 122,182
Percent of Revenues 18.5% 21.8% 22.3% 22.7% 26.0% 25.8% 27.2% 26.5% 22.2% 18.5% 21.4% 26.4% 29.2%
Total Non-operating Income(Loss) 5,367 30,236 1,192 1,192 3,392 3,492 3,592 3,692 4,607 5,699 37,987 14,168 16,168
Profit Before Taxes 16,644 45,186 17,500 18,633 25,190 26,290 29,152 28,012 56,220 49,648 97,963 108,645 138,350
Percent of Revenues 27.3% 65.7% 23.9% 24.3% 30.1% 29.7% 31.0% 30.5% 24.2% 20.9% 35.0% 30.4% 33.0%
Change vs Year Ago 78.1% 345.0% 19.5% 20.2% 51.3% -41.8% 66.6% 50.3% (9,993)
Taxes (527) (2,962) (3,150) (3,354) (4,534) (4,732) (5,247) (5,042) (9,113) (8,113) (19,556) (24,903)
Tax Rate 3.2% 6.6% 18.0% 18.0% 18.0% 18.0% 18.0% 18.0% 16.2% 16.3% 10.2% 18.0% 18.0%
Net Income, Cont Ops 16,117 42,224 14,350 15,279 20,656 21,558 23,905 22,970 47,106 41,535 87,970 89,089 113,447
Percent of Revenues 26.4% 61.4% 19.6% 19.9% 24.7% 24.4% 25.5% 25.0% 20.3% 17.5% 31.5% 24.9% 27.1%
Minority Interest 54 36 36 36 36 36 36 36 105 182 163 145 145
Reported Income (TW GAAP) Percent of Revenues 16,171 26.5% 42,260 61.5% 14,386 19.7% 15,315 20.0% 20,692 24.7% 21,594 24.4% 23,941 25.5% 23,006 25.1% 47,211 20.3% 41,716 17.6% 88,133 31.5% 113,591 27.1%
Change vs Year Ago 107.9% 374.7% -4.0% 52.3% 28.0% -48.9% 66.4% 50.2% -22.6% -11.6% 111.3% 89,233 24.9% 27.3%
Reported diluted EPS (NT$, TW GAAP) 1.29 3.37 1.15 1.22 1.65 1.72 1.91 1.83 3.76 3.32 7.02 1.2% 7.11 9.05
1.29 3.39 1.15 1.23 1.66 7.06 7.15 9.11
Reported Basic EPS (NT$, GAAP) 1.73 1.92 1.84 3.80 3.34

Source: Company data, Morgan Stanley Researc (e) estimates

We raise our price target to T$188 from T$138: We continue to erive our price target (base case scenario value) from a resi ual income mo el, as we believe it best represents the value of the company. Besi es our estimate increases, we raise our interme iate growth rate from 12.5% to 13.5% ue to structural changes in the in ustry's supply/ eman ynamics. Other key assumptions are unchange , inclu ing a cost of M Idea equity of 9.2% (beta of 1.2, equity risk premium of 6%, an risk-free rate of 2%), an terminal growth rate of 3%.

Our bull case scenario value increases from NT$200 to NT$270, an our bear case value rises from NT$70 to NT$95, implying 7.5x an 2.6x 2027e BVPS, respectively.

Exhibit 25: UMC: Residual income model

(NT$ mn) 2026e 2027e 2028e 2029e 2030e 2031e 2032e 2033e 2034e 2035e 2036e 2037e
Total Equity 441,934 464,221 510,031 569,076 635,797 711,191 796,387 892,658 1,001,444 1,124,372 1,263,281 1,420,249
Net Profit 88,133 89,233 113,591 128,358 145,045 163,901 185,208 209,285 236,492 267,236 301,976 341,233
ROAE 21.4% 19.7% 23.3% 23.8% 24.1% 24.3% 24.6% 24.8% 25.0% 25.1% 25.3% 25.4%
Residual Income 46,528 46,381 65,542 74,412 84,658 96,233 109,312 124,088 140,785 159,650 180,966 205,052
Spread 12.2% 10.5% 14.1% 14.6% 14.9% 15.1% 15.4% 15.6% 15.8% 15.9% 16.1% 16.2%
Ending Equity Capital 441,934
PV of Forecast Period 624,556
PV of Continuing Value 1,293,778
Equity Value 2,360,268
No. of Shares 12,556
Projected Price (NT$) 188.0

Source: Morgan Stanley Researc (e) estimates.

Exhibit 26: UMC's one-year forward P/B band

Source: FactSet, Morgan Stanley Researc estimates

M Idea

Risk Reward - UMC (2303.TW) Risk Reward - UMC (2303.TW)

Wafer prices on the rise; OW

NT$188.00 PRICE TARGET

Base case, residual income model. Key assumptions: 9.2% cost of equity, 13.5% medium-term growth, and 3.0% terminal growth.

NT$128.90

Consensus Price Target Distribution

Source: Refinitiv, Morgan Stanley Research

RISK REWARD CHART AND OPTIONS IMPLIED PROBABILITIES (12M)

Key: Historical Stock Performance Current Stock Price Price Target

Source: Refinitiv, Morgan Stanley Research, Morgan Stanley Institutional Equities Division. The probabilities of our Bull, Base, and Bear case scenarios playing out were estimated with implied volatility data from the options market as of 5 Oct 2026. All figures are approximate risk-neutral probabilities of the stock reaching beyond the scenario price in either three-months ' or one-years ' time. View explanation of Options Probabilities methodology here

BULL CASE

BASE CASE

OVERWEIGHT THESIS

  • ▪We are OW as we see structural changes in the mature node industry's supply/demand dynamics.
  • ▪Its foundry quality is comparable to TSMC's in mature nodes. Along with specialty technologies, this could help offset part of the margin downside.
  • ▪Non-AI market recovery remains uncertain in 2027, yet UMC should still benefit from strong AI-related demand spillover from its foundry peers.
  • ▪12nm FinFET development is strategic. It should be one of UMC's long-term strengths, notably when Chinese foundries
  • cannot effectively expand FinFET capacity.
  • ▪The stock now trades at 4.1x 2027e BVPS.
  • That is well above its historical average since 2009, but our price target implies 5.1x.

Consensus Rating Distribution

Source: Refinitiv, Morgan Stanley Research

Risk Reward Themes

New Data Era:

Positive

Pricing Power:

Negative

Secular Growth:

Positive

View descriptions of Risk Rewards Themes here

BEAR CASE

7.5x 2027e BVPS

Stabilized semi demand; better-thanexpected 8-inch and trailing-edge 12-inch demand: 1) Global semi sales grow >15% Y/Y in 2026, and ex-TSMC foundry industry grows >10% Y/Y; 2) UMC gains share in both 8- and 12-inch wafers thanks to technology differentiation; 3) UMC receives more outsourcing from customers, which helps fill 22/28nm capacity and lifts blended wafer ASP; 4) traction increases for UMC's 12nm/14nm FinFET technologies.

5.2x 2027e BVPS

Healthy semi growth; improving demand for 8-inch and trailing-edge 12-inch: 1) Global semi sales grow ~15% in 2026 and ex-TSMC foundry industry grows 3-5% Y/Y; 2) 8-inch utilization rate is above 75% with steady 12inch demand amid semi inventory digestion; 3) UMC hikes wafer prices slightly in response to strong AI-related demand.

2.6x 2027e BVPS

Significant semi industry decline; 8-inch and trailing-edge 12-inch face weakening demand: 1) Global semi sales grow only <5% in 2026; 2) display semi and power semi demand deteriorates further; 3) significant wafer pricing erosion given low fab utilization and mature node peers' competition; 4) depreciation ramp-up of more than 30% Y/Y in 2026 without sufficient wafer order inflow to sustain UMC's gross margin.

NT$95.00

NT$270.00

NT$188.00

M Idea

Risk Reward - UMC (2303.TW)

KEY EARNINGS INPUTS

Drivers Dec 2025 Dec 2026eDec 2027eDec 2028e
Wafer shipment (K, 8 inch equivalent) (NT$, mn) 8,741 10,052 11,463 11,927
Wafer ASP (USD) (NT$, mn) 824 862 976 1,099
Utilization rate (%) (%) 75.2 83.4 92.0 92.8

INVESTMENT DRIVERS

  • Semiconductor end-demand
  • Outsourcing orders from IDM customers
  • Ramp-up of new capacity

GLOBAL REVENUE EXPOSURE

Source: Morgan Stanley Research Estimate View explanation of regional hierarchies here

MS ALPHA MODELS

3/5 3 Month
MOST Horizon

Source: Refinitiv, FactSet, Morgan Stanley Research; 1 is the highest favored Quintile and 5 is the least favored Quintile

RISKS TO PT/RATING

RISKS TO UPSIDE

  • Stronger-than-expected global economic and semiconductor growth
  • Looser pricing competition, increasing margins and utilization rates
  • Favorable customer mix changes

RISKS TO DOWNSIDE

  • Softer-than-expected global economic and semiconductor growth
  • Increasing pricing competition, reducing margins and utilization rates
  • Unfavorable customer mix changes

OWNERSHIP POSITIONING

Inst. Owners, % Active

70.1%

Source: Refinitiv, Morgan Stanley Research

MS ESTIMATES VS. CONSENSUS

Source: Refinitiv, Morgan Stanley Research M Idea

UMC: Financial su ary

Exhibit 27: UMC: Financial Summary

Income Statement, 2024-28e, (NT$ mn) Year End Dec 2024 2025 2026e 2027e 2028e
Turnover 232,303 237,553 279,638 357,846 419,091
YoY Growth 4.4% 2.3% 17.7% 28.0% 17.1%
Less: COGS (156,649) (168,647) (190,620) (233,904) (262,228)
Variable costs (111,866) (114,015) (128,161) (165,143) (193,273)
Depreciation & amort (44,782) (54,631) (62,459) (68,761) (68,956)
Gross profit 75,654 68,906 89,018 123,942 156,862
YoY Growth -2.7% -8.9% 29.2% 39.2% 26.6%
% margin 32.6% 29.0% 31.8% 34.6% 37.4%
Operating Expenses: (24,042) (24,958) (29,043) (29,465) (34,680)
R&D (15,616) (17,725) (18,847) (18,900) (22,380)
Sales and Marketing (2,701) (2,433) (3,020) (3,815) (4,610)
General and Admin (5,724) (4,800) (7,176) (6,750) (7,690)
Operating Profit 51,613 43,949 59,975 94,477 122,182
YoY Growth -10.8% -14.8% 36.5% 57.5% 29.3%
% margin 22.2% 18.5% 21.4% 26.4% 29.2%
Total Non-op 4,607 5,699 37,987 14,168 16,168
Pretax Profit 56,220 49,648 97,963 108,645 138,350
YoY Growth -20.7% -11.7% 97.3% 10.9% 27.3%
% margin 24.2% 20.9% 35.0% 30.4% 33.0%
Tax (9,113) (8,113) (9,993) (19,556) (24,903)
Reported Net Income 47,211 41,716 88,133 89,233 113,591
Reported EPS (NT$) 3.76 3.32 7.02 7.11 9.05
ModelWare EPS (NT$) 3.76 3.32 7.02 7.11 9.05
Key Ratios 2024 2025 2026e 2027e 2028e
Return (%)
ROAA 8.4% 7.3% 14.2% 13.2% 15.9%
ROAE 12.8% 11.0% 21.4% 19.7% 23.3%
OP. ATO 53.3% 54.5% 56.2% 69.7% 79.3%
Gearing (x)
Net Debt/ Equity (0.1x) (0.2x) (0.1x) (0.2x) (0.2x)
Current Ratio 2.5x 2.3x 2.1x 2.4x 2.8x
Quick Ratio 1.8x 1.6x 1.4x 1.7x 2.1x
Operating Cycle
AR/NR Turnover (days) 49 49 48 48 48
Inventory Turnover (days) 84 79 76 71 72
AP Turnover (days) 17 18 18 17 17
Cash Conversion (days) 115 110 106 102 103

e = Morgan Stanley Research Estimates Source: Company Data, Morgan Stanley Research M Idea

Balance sheet (NT$ mn) 2024 2025 2026e 2027e 2028e
Assets
Cash & Equivalent 105,000 110,660 111,350 129,380 169,460
MarketableSecurity 606 569 550 550 550
A/R & N/R 33,343 31,274 43,117 51,582 60,478
Inventories 36,408 37,934 42,756 49,638 55,329
Other Current Ass. 11,983 20,850 24,811 24,811 24,811
Total current assets 189,678 204,783 225,667 259,044 313,710
LT Investment 72,487 75,373 148,847 152,847 156,847
Total Fixed Assets 279,059 271,395 260,798 247,324 235,805
Total Other Assets 28,976 27,445 29,654 29,654 29,654
Total Assets 570,201 578,996 664,966 688,869 736,016
A/P & N/P 7,633 9,170 10,040 11,656 12,992
Accrued Expenses 281 229 148 148 148
Other Payable 34,626 36,128 66,392 66,392 66,392
Total Current Liab. 75,260 87,598 107,289 108,905 110,242
L-T Liabilities 55,533 45,372 45,566 45,566 45,566
Total Other L-T Liab 61,222 66,170 70,177 70,177 70,177
Total Liabilities 192,016 199,141 223,032 224,648 225,985
Common Stocks 125,607 125,882 125,770 125,770 125,770
Preferred Stocks
Capital Reserve 14,782 15,410 15,871 15,871 15,871
Retained earnings 237,539 238,477 303,384 325,671 371,482
Treasury Stock 0 0 (3,096) (3,096) (3,096)
Total Equity 378,185 379,855 441,934 464,221 510,031
Cash Flow Statement (NT$ mn) 2024 2025 2026e 2027e 2028e
Net Income, continued ops 47,106 41,535 87,970 89,089 113,447
Depreciation 48,168 59,259 66,947 74,149 74,359
Net Investment Losses (Gains) (72) (99) (37) 0 0
Others (3,426) (2,954) (44,667) (17,731) (17,250)
Cash Flow-Operating 93,872 99,864 110,250 145,507 170,556
(Purchase) of FA (88,544) (47,745) (57,656) (60,675) (62,840)
Sale of Fix Asset 121 129 74 0 0
(Purchase)L-T Inv. (541) 0 (659) 0 0
Sale of L-T Inv. 1,602 575 375 0 0
Sale(Pur.)S-T Inv. 1,564 (8,245) (9,579) 0 0
Cash Flow-Investing (85,941) (53,154) (65,082) (60,675) (62,840)
Inc(Dec)-S-T Debt 13,178 (21,689) 669 0 0
Dividend Paid (37,586) (35,784) (31,620) (66,802) (67,636)
Dir.&Emp.Bonus 0 0 0 0 0
Proceed from New Issue 0 0 0 0 0
Dec/Inc-TreasureSt 0 0 (3,096) 0 0
Others (14,793) 18,270 (12,012) 0 0
Cash Flow-Financing (39,200) (39,204) (46,059) (66,802) (67,636)
Change in Cash (27,553) 5,660 690 18,030 40,080
Net cash/(debt), b/f 132,553 105,000 110,660 111,350 129,380
Net cash/(debt), c/f 105,000 110,660 111,350 129,380 169,459
  1. View explanation of Options Probabilities metho ology -

Options_Probabilities_Exhibit_Link.p f

  1. View escriptions of Risk Rewar s Themes - RR_Themes_Exhibit_Link.p f
  2. View explanation of regional hierarchies - GEG_Exhibit_Link.p f

  3. View explanation of Theme/Exposure metho ology -

ESG_Sustainable_Solutions_External_Link.p f

  1. View explanation of HERS metho ology - ESG_HERS_External_Link.p f

M Idea

INDUSTRY COVERAGE: Greater Ch na Technology Sem conductors

Company (Ticker) Rating (As Of) Price* (09/30/2026)
Charlie Chan
Advanced Wireless emiconductor Co (8086.TWO) U (07/14/2025) NT$129.00
Alchip Technologies Ltd (3661.TW) O (05/14/2021) NT$3,950.00
A E Technology Holding Co. Ltd. (3711.TW) O (09/15/2024) NT$742.00
Cambricon Technology Corporation (688256. ) O (04/27/2026) Rmb1,009.01
CXMT Corp (688825. ) O (08/26/2026) Rmb54.79
Global Unichip Corp (3443.TW) O (06/24/2026) NT$8,600.00
GlobalWafers Co Ltd (6488.TWO) E (05/19/2026) NT$1,180.00
Gudeng Precision (3680.TWO) O (11/25/2025) NT$561.00
Hua Hong emiconductor Ltd (1347.HK) E (03/12/2026) HK$110.00
Iluvatar CoreX emiconductor Co., Ltd. (9903.HK) O (04/27/2026) HK$102.90
King Yuan Electronics Co Ltd (2449.TW) O (03/03/2023) NT$294.00
MediaTek (2454.TW) O (11/28/2025) NT$5,165.00
MetaX Integrated Circuits (688802. ) E (04/27/2026) Rmb497.08
Nanya Technology Corp. (2408.TW) O (05/28/2026) NT$530.00
OmniVision Integrated Circuits Group Inc (603501. ) E (11/17/2025) Rmb82.21
Phison Electronics Corp (8299.TWO) E (02/25/2026) NT$2,100.00
G Micro Corp. (300661. Z) E (11/03/2025) Rmb110.21
ilergy Corp. (6415.TW) U (05/19/2026) NT$442.00
MIC (0981.HK) O (10/21/2025) HK$61.30
T MC (2330.TW) O (02/07/2022) NT$2,575.00
UMC (2303.TW) O (05/19/2026) NT$152.50
Vanguard International emiconductor (5347.TWO) E (01/14/2026) NT$184.00
WIN emiconductors Corp (3105.TWO) U (07/14/2025) NT$615.00

Daisy Dai, CFA

M Idea

A MPT Ltd (0522.HK) O (07/24/2025) HK$178.60
China Resources Microelectronics Limited (688396. ) U (03/02/2026) Rmb55.10
Empyrean Technology Co Ltd (301269. Z) E (01/17/2025) Rmb84.66
Hangzhou ilan Microelectronics Co. Ltd. (600460. ) U (08/25/2025) Rmb30.75
Hygon Information Technology Co., Ltd. (688041. ) O (07/03/2026) Rmb226.80
Innoscience (2577.HK) E (10/13/2025) HK$39.32
JCET Group Co Ltd (600584. ) O (09/16/2026) Rmb64.28
hanghai Fudan Microelectronics (1385.HK) O (03/07/2025) HK$25.68
ICC Co Ltd (688234. ) O (03/20/2026) Rmb104.39
J emiconductor Corp (688820. ) E (09/16/2026) Rmb115.78
tarPower emiconductor Ltd (603290. ) E (05/14/2026) Rmb81.21
Unigroup Guoxin Microelectronics Co Ltd (002049. Z) U (01/10/2023) Rmb57.88
Universal cientific Ind. ( hanghai) (601231. ) O (11/05/2025) Rmb23.74
Yangjie Technology (300373. Z) O (06/10/2022) Rmb84.46
Daniel Yen, CFA
AP Memory Technology Corp (6531.TW) O (07/11/2025) NT$1,055.00
A Media Technology Inc (5269.TW) U (10/03/2025) NT$1,475.00
Aspeed Technology (5274.TWO) O (06/09/2025) NT$19,520.00
Egis Technology Inc (6462.TWO) E (01/28/2026) NT$103.50
Elan Microelectronics Corp (2458.TW) O (10/03/2025) NT$134.00
eMemory Technology Inc (3529.TWO) O (08/18/2026) NT$3,155.00
Espressif ystems (688018. ) O (05/15/2023) Rmb115.08
GigaDevice emiconductor Beijing Inc (603986. ) O (05/15/2025) Rmb353.90
Macronix International Co Ltd (2337.TW) O (09/18/2025) NT$121.50
Montage Technology Co Ltd (6809.HK) O (03/18/2026) HK$304.80
Montage Technology Co Ltd (688008. ) Novatek (3034.TW) O (03/18/2026) U (02/04/2026) Rmb202.31 NT$543.00
Nuvoton Technology Corporation (4919.TW) U (11/10/2025) NT$155.50
Parade Technologies Ltd (4966.TWO) O (05/27/2026) NT$574.00
Powerchip emiconductor Manufacturing Co (6770.TW) O (10/27/2025) NT$75.80
Realtek emiconductor (2379.TW) E (01/30/2026) NT$755.00
henzhen Goodix Technology Co Ltd (603160. ) U (07/14/2025) Rmb53.19
Winbond Electronics Corp (2344.TW) O (05/28/2026) NT$181.00
WPG Holdings (3702.TW) O (03/16/2026) NT$119.00
WT Microelectronics Co. Ltd. (3036.TW) O (01/27/2026) NT$213.50
Duan Liu
Dosilicon Co Ltd (688110. ) U (09/06/2024) Rmb113.81
henzhen Longsys Electronics Co Ltd (301308. Z) E (02/25/2026) Rmb301.93
Henry Zhao
ACM Research Inc (ACMR.O) O (03/07/2023) U $83.38
Advanced Micro-Fabrication Equipment Inc (688012. ) O (11/06/2023) Rmb318.55
Maxscend Microelectronics Co Ltd (300782. Z) U (01/11/2021) Rmb70.17
NAURA Technology Group Co Ltd (002371. Z) O (11/06/2023) Rmb615.97
Tiffany Yeh
AllRing Tech Co. (6187.TWO) O (09/23/2025) NT$1,490.00
FOCI Fiber Optic Communications Inc (3363.TWO) O (01/15/2025) NT$664.00
Himax Technologies Inc (HIMX.O) E (02/04/2026) U $15.24
Hon Precision (7769.TW) O (04/17/2026) NT$5,815.00
MPI Corporation (6223.TWO) O (04/17/2026) NT$5,520.00
ilicon Motion ( IMO.O) O (05/06/2024) U $280.50
WinWay Technology Co Ltd (6515.TW) O (04/17/2026) NT$6,205.00

Stock Ratings are subject to c ange. Please see latest researc for eac company.

  • Historical prices are not split adjusted.

M Idea

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