PDF 原檔：報告_OCP2026_鴻富瀚_散熱系統_20261015_original.pdf
講者公開簡報（OCP 官方 Recorded Content 頁提供下載）。文字以 PyMuPDF 逐頁抽取，
### p<n>為頁碼；圖表內容見原檔。
圖片清單（已驗證 2026-10-19）
| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_鴻富瀚_散熱系統_20261015_p6.png |
p6 | 真資料圖 | 功耗成長對照：AI GPU 每晶片 TDP（V100 300W → Rubin 2026E 2,300W，×7.7）、交換器 ASIC（TH3 12.8T 390W → TH7 204.8T 3.5–4 kW，×10）、光模組（400G 約 9W → 3.2T 約 40W，×4.5；籠子接觸熱通量 2→6 W/cm²） |
報告_OCP2026_鴻富瀚_散熱系統_20261015_p8.png |
p8 | 真資料圖 | HFH 液冷路線圖：2025 MCCP 量產、2026 mJet 與 VC LCP 量產、2027 P2P 泵送兩相研發（晶片級測試排 2027 年 Q1）、Beyond 鑽石銅與 thermosyphon；mJet 與 VC-LCP 皆標 500 W/cm² 熱點熱通量 |
報告_OCP2026_鴻富瀚_散熱系統_20261015_p11.png |
p11 | 真資料圖 | mJet LCP 剖面與流場溫度圖（單片真空硬焊銅冷卻頭、噴流入口、熱出口）；規格：晶片功率 800–3,500 W、熱點熱通量 >500 W/cm²、流量 1.35–4.5 L/min、進水 25–45°C |
報告_OCP2026_鴻富瀚_散熱系統_20261015_p13.png |
p13 | 真資料圖 | TH7 用 mJet LCP：流道分隔器與微鰭陣列結構、銅鰭高 1.2 mm／厚 0.1 mm／間距 0.12 mm 錐形鰭、模擬溫度場最高 85°C（Tcase 上限 90°C、餘裕 5°C）、壓力分布 2.16 psi |
報告_OCP2026_鴻富瀚_散熱系統_20261015_p15.png |
p15 | 真資料圖 | 光模組浮動冷板：2×8 與 1×1 浮動冷板 3D 圖；三種方案比較：1×16 共用（簡單但模組互相影響）、2×8 接合（獨立但接點多）、1×1 浮動（專利申請中，接觸最佳壓降最低）；標註客戶定義系統、HFH 做冷板 |
報告_OCP2026_鴻富瀚_散熱系統_20261015_p16.png |
p16 | 真資料圖 | 可插拔介面 TIM 三種比較表：Thermal Tape（0.1–1.6 mm、PCM＋PI、30W 下界面 ΔT 3–4°C、插拔 ≤200 次、成本低）、Thermal Skateboard（0.26 mm、SUS301＋PCM、4–6°C、>500 次、成本高）、Thermal Coating（0.03 mm、矽膠複合、4–6°C、≥200 次、成本中） |
原始內容
p1
Silas Cui Technical Specialist, Hongfuhan Technology Co., Ltd. Cooler System Hotter Innovation COOLING: COLD PLATE HFH Thermal
p2
Contents 01 HFH thermal BU review 02 Advanced liquid cooling technologies 03 Cooling solutions for optical modules 2.1 Micro-jet liquid cold plate (mJet LCP) 2.2 Vapor-chamber liquid cold plate (VC LCP) 2.3 mJet LCP for TH7 3.1 Different cold-plate solutions 3.2 TIMs for Pluggable Interfaces
p3
Thermal BU global engineering and manufacturing footprint China Thailand US Cupertino, CA West coast Houston, TX Gulf coast Rich in technology & experience: GPU/CPU/Switch/NIC cold plates Optical-module cold plates Dongguan Thermal R&D center Meizhou Thermal module base Bangkok Liquid cooling coldplate production base Offices DIMM/SSD cold plate Manifold PSU cold plates
p4
01 HFH thermal BU review 02 Advanced liquid cooling technologies 03 Cooling solutions for optical modules 2.1 Micro-jet liquid cold plate (mJet LCP) 2.2 Vapor-chamber liquid cold plate (VC LCP) 2.3 mJet LCP for TH7 3.1 Different cold-plate solutions 3.2 TIMs for Pluggable Interfaces Contents
p5
Integrated Engineering, Prototyping & Validation Capabilities Design and simulation • Thermal flow mechanical simulation • Design, prototype and test in one team • Joint research with XJTU and SCUT Manufacturing • CNC, skiving, friction stir welding • Vacuum brazing, laser welding • Diffusion welding in development • Cleanroom welding and assembly Test and validation • Five 100% checks on every cold plate • Helium leak < 1×10⁻⁶ mbar·L/s • Flow and thermal resistances measured • C-scan on every brazed joint Closed-loop workflow: simulate, prototype, test, iterate
p6
AI keeps pushing power and heat flux up More advanced cooling technologies are urgently needed. AI GPU · per-chip TDP V100 '17 300 W A100 '20 400 W H100 '22 700 W B200 '24 1,000 W Rubin '26E 2,300 W ×7.7 per chip · 2017 → 2026E Switch ASIC · design load TH3 12.8T 390 W TH5 51.2T 850 W TH6 102.4T 1,700 W TH7 204.8T 3.5–4 kW ×10 per chip · TH3 → TH7 Optical module · per unit 400G ≈9 W 800G ≈15 W 1.6T ≈25 W 3.2T ≈40 W Cage contact heat flux: 2 → 6 W/cm² ×4.5 per module · 400G → 3.2T
p7
Four steps: air, regular liquid, advanced liquid, two-phase Air cooling Heat pipes · VC · 3DVC up to 150 W/cm² Regular liquid Microchannel cold plate up to 250 W/cm² Advanced liquid Manifold + microchannel up to 500 W/cm² Future Two-phase beyond 500 W/cm² Why it matters • Air: TIM, lid and fins add resistance, leaving high Rth • Cold plate: lower fluid temperature & lower Rth • Manifold microchannel: lower Rth & pressure drop Two-phase: much lower fluid-side Rth & fluid temperature HFH works on all four steps at the same time. conventional cooling advanced cooling Regular liquid cooling Advanced liquid cooling Two-phase cooling Air cooling
p8
HFH liquid cooling roadmap: 2025 to 2027 and beyond 4 2025 MCCP in mass production 2026 mJet and VC LCP in MP 2027 P2P two-phase, under development Beyond Diamond-copper, thermosyphon mJet LCP • 500 W/cm² hotspot flux • Significant reduction in Tj and pressure drop VC-LCP composite • Vapor chamber built into the fin base • Verified at ≥ 500 W/cm² hotspot flux P2P two-phase • Pumped two-phase refrigerant • Chip-level test planned in Q1 2027 • Improved performance expected One rule: increase the coolant-side HTC as much as possible.
p9
Manifold + microchannel: high-efficiency convective heat transfer Chip core power map 500 W/cm² hotspot zone Challenge On-chip heat sources are highly non-uniform — the central region exhibits far higher heat flux than peripheral areas. Conventional liquid cooling fails to deliver targeted cooling to these hotspot zones. Solution A compact manifold divider directs additional coolant jets precisely at hotspots, allocating low- temperature fluid and pressure-drop budget where peak heat flux occurs. This achieves maximum heat- transfer efficiency with minimal pressure drop, because: 1. Jet impingement yields a dramatically higher heat-transfer coefficient. 2. It shortens the thermal path between cold coolant and hotspots. 3. Lower heat-flux regions receive reduced flow and higher-temperature fluid.
p10
Cover plate Liquid separation plate Manifold plate Skiving fin plate Typical structure and component functions In some designs, the bottom plate and the fin are integrated into one part. Cover plate Seals the top of the core and closes the flow path Liquid separation plate Distributes inlet fluid into the microchannels Need well-designed structure for proper flow distribution Manifold plate Collects the heated fluid toward the outlet Skiving fin plate Primary heat-transfer surface Innovative structure: tapered-width fins
p11
mJet LCP: lower temperature, far less pumping power mJet LCP flow and temperature fields mJet LCP cooling head one-piece vacuum-brazed copper 800–3,500 W chip power
500 W/cm² hotspot flux capability 1.35–4.5 L/min flow rate 25–45 °C inlet Z-X plane Coolant inlet
p12
VC LCP: VC and skived fins as one part The problem with a stacked cold plate Cover, skived fin, brazing layer, VC: four parts, three interfaces, three leak paths. The HFH choice: fin and VC cover as one part The fins are machined directly into the VC upper cover, so the brazing layer between them disappears. Rth and material costs are reduced. ≥ 500 W/cm² hotspot flux capacity One part Simple & low cost Traditional: VC and cold plate separated Now: VC and cold plate are integrated into one part Cold plate upper cover Skiving piece Brazing layer VC upper cover VC lower cover Cold plate upper cover Skiving piece integrated with VC upper cover VC lower cover Challenge Complex welding process and quality assurance
p13
mJet LCP for TH7 Manifold Structure Flow dividers Split the jet into parallel channels Microfin array High-density fins between dividers Unit cell Pattern repeats across the die Microfin Temperature Material Cu Fin height 1.2 mm Fin thickness 0.1 mm Fin spacing 0.12 mm Temperature Field Plane maximum 85 ℃ Tcase limit 90 ℃ Margin 5 ℃ Pressure Distribution 2.16 psi 2.3 · MJ-LCP for TH7 Tapered-width Fins are used to ensure high flow and thermal performance
p14
Contents 01 HFH thermal BU review 02 Advanced liquid cooling technologies 03 Cooling solutions for optical modules 2.1 Micro-jet liquid cold plate (mJet LCP) 2.2 Vapor-chamber liquid cold plate (VC LCP) 2.3 mJet LCP for TH7 3.1 Different cold-plate solutions 3.2 TIMs for Pluggable Interfaces
p15
Optical modules: the floating cold plate Why floating? • Modules slide in flat; the cage cannot move up or down • The cold plate floats instead, with even downforce on each module 1×1 floating cold plate, 3D view 1×16 shared Simple, but modules may interact. 2×8 joint Independent, but more joints. 1×1 floating · patent pending Best contact, lowest pressure drop. Customer defines the system · HFH makes the cold plates. 2×8 floating cold plate, 3D view
p16
TIMs for Pluggable Interfaces Thermal Tape Thermal Skateboard Thermal Coating 0.03 4-6 ℃ ≥ 200 Silicone Composite Medium High Thermal Coating Thermal Coating
p17
Thank You!