PDF 原檔：產業_矽光子發展趨勢_20260522_original.pdf

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矽光子發展趨勢：技術演進與機會 Silicon Photonics : Technology Evolution and Opportunities

張勤煜 Leo

知識力科技資深顧問

臺灣大學電機工程學系博士 . 大同大學電機系助理教授

• Silicon PIC revenue growth forecast by application

• Datacom pluggables

• Datacom CPO scale-out

• Others

2030

• "Memory Wall" & Power Crisis

LIGHTMATTER

HEARENCHEET LEADE

Interconnect progress is too slow 108 200 -

107 -

10° -

105 -

Compute

Ref :Lightmatter, 曲博科技教室 , 麥肯錫 (2025), IEK

Capacity (GW)

Projected Data Center Power Capacity by Workload (2025-2030)

AI (GW)

Non-Al (GW)

150 -

100 -

50 -

180

56

152

全球資料中心電力負載容量需求

220

64

• Losses of Traditional EO Module

Substrate

4x3&t*

Die Paddle Card

PCB

112G SerDes-

224G SerDes

(174t)

Ref : 博通 (Broadcom), Seimens

• CPO Penetration Accelerates Towards 2030

2025-2030#CPOhAl#Ф2И5ШН5ta

• CPO penetration rate (%) • Transceiver (800G+1.6T+3.2T) • CPO (800G+1.6T+3.2T)

200

Source: TrendForce, Mar. 2026

35.74%

Ref : TrendForce, Technews

• CPO Roadmap

Today Pluggable Optics Pluggable Optics

2000 ~

Today

2020

2025

2022

-

2030(e)

2030(e)

2.5D

Near-Packaged

Optics (NPO) Near-Package remained as

Optics (NPO)

proof of concep

2.5D

Co-Packaged

Optics (CPO)

3D

2040(e)

Ref : Yole, Technews

Ref : Yole, Technews

Co-Packaged

Optics (CPO)

2020~

E ASIC

150 mm

Package substrate

High-performance Substrate

Sustate

PCB\

2032

Co-Packaged

Optics (CPO)

2026~

2040

High Performance substrate DE/EE

Host PCB

Multi-Chip Module

50 mm

Switch ASIC 1>

EIC

Transceiver module

QSFP Connector

Fiber

Connector

NPO

, Connector

PIC

/ (socketed)

AMINA BGA ball

Connector

PIC

Co-packaged Substrate (ISV or Organic interposer)

A- BGA ball

Host PCB

Fully integrated optics with switch through TSV

EIC

Switch ASIC

PIC

2 Co-packaged Substrate (TSV or Organic interposer)

Package substrate

Host PCB

CPO roadmap illustrating increasing levels of integration of optics and switch ASIC

OE/EE

Switch ASIC

Package substrate

0000000

Host PCB

Pluggable Transceiver

Switch ASIC

Copper trace

• ubump or C4 bump

A-BGA ball

Connector

Fiber

Fiber

Fiber

• Silicon Photonics & CPO (Co-Packaged Optics )

EIC #77EI

PIC *77A1 B0

AACHMWA (AK) (7)

•0û

Ref : 日月光 (ASE)

10 3FER

FASN*

718184 88 (PIC)

(LD)

7 7 124RI8 (EIC)

• Silicon

8

• Silicon Photonics

Ref :Intel, IMEC

Photonics

YEXI

• Modulator Battleground: MZM vs. MRM

+

• Modulator Battleground: MZM vs. MRM

Bus Waveguide Modulator Junctions 12148: ÷18

111

TX: Modulate + Multiplex

CW Lasers

1111

WDM Data

Input

PD

*15 028

Ref : WeiShi • etal. Nanophotonics, #|#/*#÷, Intel, Lightmatter

WDM Data

Output

: 1731

RX: Demultiplex

(a)

• Intrinsic Si n-Si

"Metal depletion region

10

ZIGHTMATTER

11

Why rings are revolutionizing photonics

Metric

3D-CPO compatible?

Need another multiplexer?

Thermal stability

Power consumption [5]

Transmitter penalty

Optical bands

[1] M. Streshinsky, et al. Opt. Express 21, 30350-30357 (2013).

[3] Y. Liu, et al, PRJ 8, 1474 (2023).

[2] J. Fujikata, et al, Opt. Express 31, 10732-10743 (2023).

[4] E. Timurdogan, et al. Nature Communications 5, 4008 (2014).

[5) DAB Miller, et al. Opt. Express 20, A293-A308 (2012).

Ref : Lightmatter, 曲博科技教室

MZM [1]

SiGe/Ge EAM [2, 3]

MRM [4]

3.5

3.0

2.5

junction Temperature (°C)

Feedback control loop operating range: 0°C-

gives the MRM a wide

Without stabilization

-12

With stabilization -6 -12

40

Junction Temperature (*C)

Note: 'Relative OMA* (relOMA) is relative to 1 mW laser into the MRM.

16

• Laser Integration Strategy: External Sources

Ref : 思科 (CISCO), 智邦 (Accton), 曲博科技教室

12

TSMC COUPE ( COmpact Universal Photonic Engine)

Optical Path Si lens

Top die

EIC

Stacking

Bottom wafer

Ref: TSMC, #E cnyes, #f& # #RTechnews

GC

FAU

Si Carrier

EIC

FAU

14

• The Silicon Photonics Ecosystem

=·#** Nvidia Marvell Broadcom AXT

ASIC /

XPU

*7 IC

187 IC

naKI

Ref : 科技新報 Technews

NVDA

MRVL

AVGO

AXTI

InP 1*5

Ері

wafer

БФ16H15

CCL

5802

• The Silicon Photonics Ecosystem

15

· %# Lumentum Coherent Broadcom Coherent COHR

m9t/71n

(55%t)

(EML)

****a

FAU

Ref : 科技新報 Technews

***A

FAU

18 48

Marvell

Lumentum

LITE

Fabrinet

CSCO

• The Silicon Photonics Ecosystem

VSFF

GLW Amphenol APH 5803

Ref : 科技新報 Technews

16

AU ARTS

TER

Keysight

FormFactor

FORM

KEYS

• Dual Engines for Al Computing: Scale Out & Scale Up

Scale up

LIE

FLIE

Scale up firE :

17

Ref : Nvidia, 工研院產科國際所

10~100 AE

459229

6R 1988

• Dual Engines for Al Computing: Scale Out & Scale Up

18

(Core layer)

≥$78

(Spine layer)

日月光

Ref :

(ASE)

21988 EPBJ #.18 45 (PCB)

Pluggable Optics.

59*7864

(CPO))

co-Packaged outies

C98

ED#| #8845 (PCB)

• Transition Technology:

• Multi-Physics Testing

Demand (FAU) LPO (Linear-drive Pluggable Optics) Serdes DSP Driver TIA LD PD (a)

DSP

JUST A2 1A

Ref : 曲博科技教室 , 日月光 (ASE), 科技新報 Technews

• SiPh Roadmap: Bandwidth Growth

Han SA Han Bo 400G+ OPTICAL ENGINE (OE) 100G 200G

TIA

4x

4x100G

REX

TX

4x

DRV

AX1O0G

TX

DSP

AGOGAUI-S

do1

DSP

(a)

doi

(a)

BANDWIDTH (Data Rate / Lane Density)

200G

<100G

400G+

MZM

MZM / MRM

DRV

X1

13

12

14

PIC

400G

Tx+Rx

400GAUI-8

0 00 18 0

dO1

PIC

400G

TxtRy

(b)

dO1

(b)

Ref : 曲博科技教室 , TSMC

BEE:

BEE:

PIC

400G

Tx+GB

18 B1

dol

PIC

400G

Tx+GB

(c)

dol

(c)

CWDM / DWDM

• SiPh Platform

21

Source: Silicon Photonics 2025 - Focus on SOl, SiN, LNOI, InP platforms, report Yole Group

The first high-density pluggable

module systems with the 204.8T TH7 chip in 2027.

• SiPh Light Source (Micro LED)

22

Fiber coupler

Micro-optics e.g., 20x20 channels

at 2 Gbps each for 800G

Figure 3: MOSAIC's high-level WaS architecture and key com- ponents.

Outout Inouti Multicore Micro LED CPO:145 7CPOLt#s

Imaging

Fiber

Row Switch

MicroLED-based Optical Channel (e.g. 400x2G)

88888

NIC / · SWITCH

BEEBB, BBBBB

BBB8B 88888

Rack Switch

SWITCH

Ref :TrendForce, Microsoft

1045 (PCle) Micro LED VCSEL CWE# (75% 7CPO)

1

10-50

100

1,000

EML

40,000

• SiPh Liaht Source (WDM Laser)

Guide™: External WDM laser

IHE3071163E200GHZA

20

0

-20

-40

-60

Power (dBm)

1300

Ref :Lightmatter, 曲博科技教室

23

• SiPh Transmission (THz waveguide)

Data In

(Electrical)

mmWave

E- Tube Core

Dielectric Core

Antenna mmWave

Data Out

(Plastic Waveguide)

Antenna

Metal Cladding

24

• (Electrical)

• SiPh Transmission (THz waveguide)

e - Tube

16

1.6 Tb/s cable Direct-attach cable 14 12

10

8

6

4

2

1x e-Tube

Energy Efficiency

26

Thank you for your attention !