PDF 原檔：產業_SEMICON2026矽光子論壇_Soitec簡報_20260831_original.pdf
原始內容
saitec
Advancing TFLN & InP Silicon Photonics Hybridization to Enable Next-Generation High-Speed Modulators.
Yannick LARVOR | Head of Photonics & Sensing Segment SOITEC
Silicon Photonics Summit, Aug 31st, 2026
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Agenda [讀者資訊已遮蔽] [讀者資訊已遮蔽]
| 01. | Soitec introduction |
|---|---|
| 2 | Optical Interconnects market trends |
| 3 | Photonics SOI: a universal SiPh host platform |
| 4 | Enhancing SiPh with heterogeneous integration |
| 5 | LNOI & InPOSi material platforms |
| 6 | Takeaways |
Soitec introduction
Soitec: a unique position in the value chain
Bulk Materials
1992
Soitec is founded
471
4 800
Patents in 2025
Active patents
~2 100
Employees
€592M
Revenue (Fiscal year 2026)
Final Markets
Smart Cut TM and SOI substrates
Industrial footprint
France & Singapore operations
150mm
200mm
300mm
300mm
30 years of high-volume manufacturing experience
SOITEC PASIR RIS
SINGAPORE
PR1
SOI 300mm
Optical Interconnects market trends
AI Data Centers network are scaling through optics
Scale-out & Scale-across have already moved to 100% optics 2027 → Scale-up interconnects steadily moving to optics
Optical interconnects use case mapping
seitec
Photonics Interposer : the next opportunity
Use a package - scale active silicon photonics interposer to connect chiplets
Photonics SOI: a universal SiPh host platform
Soitec Photonics SOI products portfolio
Soitec Photonics SOI value proposition
Material uniformity and quality for high - performance Photonics
Enhancing SiPh with heterogeneous integration
Why Silicon Photonics hybridization?
Next generation optical interconnects must improve on three main fronts
Soitec offering for hybrid/heterogeneous integration
Three platforms for standalone or heterogeneous integration to unlock next-gen photonics devices
LNOI & InPOSi material platforms
LNOI motivations
Need for faster, power - efficient modulators for next gen optical interconnects
- Demand for 1.6 optical transceivers is accelerating and emergence of 3.2T modules from 2028 onwards
- Doubling lane speed from 200G to 400G request new modulation material.
TFLN (LNOI) provides energy efficiency and bandwidth to enhance SOI/SiPh Reliability and Scalability vs. InP, BTO, Polymer…
LNOI platform offer for TFLN devices
Integration schemes and respective benefits
Product configuration:
- X- cut LN
- High resistivity Si handle
- Trap - rich option for RF performance
150
scaling- mm
200
mm up
| SmartCut TM LNOI | ThinBOX~ 0.5-2 µ m | ThickBOX~ 4-10 µ m |
|---|---|---|
| Integration architecture | Heterogeneous integration on SOI PICs (W2W, D2W, µTP) | Monolithic platform Standalone PICs |
| Keybenefits | Higher yield for LN transfer CMOS compatibility | Reduce RF modulator loss Improves optical edge coupling |
InPOSi motivations
Need to scale InP material towards CMOS - like usage
Material scarcity
Make several InPOSi wafers from one InP bulk
Manufacturability & integration/packaging
Improve manufacturability & integration thanks to :
- Reduction in mechanical fragility
- Higher Structural Stiffness (Minimized Bow & Warp)
- Only Si backside grinding
Thermal
Thermal Conductivity:
Silicon is 2x better than InP & thinning possible <<100um
Enablements:
- Increase laser power density
- Improve laser wavelength drift over temperature and thermal electro coupler design
Device
Explore performances improvement
Optimize process flows.
J. Acol Phrs. 138. 105305 (2025)
Soitec is partnering with InP supply chain leaders to demonstrate InPoSi benefits across materials, device performance, packaging, and thermal management.
InPOSi technology substrate platform
Takeaways
- Photonics for AI scaling starts at material level: Reducing optical bottleneck to maximize GPU utilization and slash cost-per-token.
- Soitec substrates roadmap enabling silicon photonics hybridization:
- Photon-SOI: nm-level top Silicon uniformity for a universal silicon photonics host
- Photon-LNOI: Unlocks 400G/lane while enabling ~15% power savings (at pJ/bit level)
- InPOSi: Enable native III-V lasers and active devices onto CMOS lines, improving yield, cost and thermal performance.
- Proven industrial HVM scale: Soitec multi-site SOI manufacturing securing high-yield volume for hyperscalers.
- Bright future for Silicon Photonics: Powering high-volume AI datacom today, while establishing the material foundation for emerging new segments (e.g LIDAR, biosensing, quantum …)
Thank you
Let's accelerate the Silicon Photonics market adoption together !
Part of this work is supported by European CHIPS JU Project 'Starlight'
Chipsjü
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