PDF 原檔：報告_OCP2026_CoolIT_無風扇伺服器周邊冷板_20261015_original.pdf
講者公開簡報（OCP 官方 Recorded Content 頁提供下載）。文字以 PyMuPDF 逐頁抽取，
### p<n>為頁碼；圖表內容見原檔。
圖片清單（已驗證 2026-10-19）
| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_CoolIT_無風扇伺服器周邊冷板_20261015_p5.png |
p5 | 真資料圖 | 機櫃密度（50 kW～1 MW）對應液冷／氣冷散熱量堆疊長條圖（70% 液冷＋30% 氣冷）：50 kW 氣冷 15 kW、250 kW 氣冷 75 kW、500 kW 氣冷 150 kW、1 MW 氣冷 300 kW；標示 >250 kW 機櫃需 100% 熱捕獲 |
報告_OCP2026_CoolIT_無風扇伺服器周邊冷板_20261015_p8.png |
p8 | 真資料圖 | 冷板涵蓋範圍：處理器（CPU、GPU、TPU、ASIC）與周邊（NIC、PSU、SSD、VRM、OSFP、QSFP、DIMM）各式冷板實物，右側為整台伺服器冷板陣列俯視 |
報告_OCP2026_CoolIT_無風扇伺服器周邊冷板_20261015_p14.png |
p14 | 真資料圖 | CoolIT 15 kW 冷板與 TTV 實物（OMNI＋SplitFlow）：15 kW TDP、1.2 LPM/kW、外殼溫度 80°C、設施水 45°C、ΔT 35°C，稱較先前 4 kW 設計約 4 倍 |
報告_OCP2026_CoolIT_無風扇伺服器周邊冷板_20261015_p18.png |
p18 | 真資料圖 | 可插拔網路與儲存冷板：騎乘式冷板（bore-riding、piston-riding、cantilevered，>15W，附 O-ring 與非 O-ring 版）與固定式冷板（<15W）實物渲染 |
報告_OCP2026_CoolIT_無風扇伺服器周邊冷板_20261015_p19.png |
p19 | 真資料圖 | 熱傳導板（Thermal Transfer Plate）實物：整片鋁板嵌銅管，涵蓋 NIC、SSD、SOCAMM、VRM；板級元件 100% 熱捕獲，含 board-referenced＋gap pad、die-referenced＋PCM、雙面、板下冷卻方式 |
報告_OCP2026_CoolIT_無風扇伺服器周邊冷板_20261015_p25.png |
p25 | 真資料圖 | 熱管理分層規格表（處理器／伺服器／機櫃／POD）：市場現況 150 W/cm²、2400W、10 kW、250 kW、9 MW；CoolIT 現況 300 W/cm²+、4000W+、15 kW+、500 kW+、30 MW+；CoolIT 規劃 500 W/cm²+、15000W+、50 kW+、1 MW+、60 MW+ |
原始內容
p1
Brad Zakaib, VP Product Engineering Fanless Servers Are Coming: The Peripheral Coldplate Roadmap Behind 100% Heat Capture
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Agenda 1. Introduction 2. Cooling the Processor 3. Cooling the Peripheral Components 4. Cooling the Server 5. Conclusions Brad Zakaib VP Product Engineering
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2023-2030 TRENDS THERMAL DESIGN POWER (TDP) TRENDS TDP is increasing with larger, multi-die packages. 0 5000 10000 15000 2022 2023 2024 2025 2026 2027 2028 2029 2030 TDP (W) Processor Thermal Trends Source: SemiAnalysis & CoolIT Average Dies per Package 1 → 14 Average Silicon Area per Package 700 → 9,000mm2 Average Heat Flux per Package 70 → 110w/cm2 ×14 ×12 ×1.6 3
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Critical Layers of Thermal Management PROCESSOR SERVER RACK POD 150W/cm² 2400W 10kW 250kW 9MW HEAT FLUX TDP LOOPS DENSITY CLUSTER MARKET TODAY Image Source: NVIDIA Image Source: NVIDIA Image Source: NVIDIA Image Source: NVIDIA 4
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Heat Dissipation (70% Liquid, 30% Air) Heat Capture is the next Challenge 700 350 175 70 35 300 150 75 30 15 0 100 200 300 400 500 600 700 800 900 1000 1MW 500kW 250kW 100kW 50kW Cooling Power (kW) Rack Density Liquid Cooled Air Cooled As rack densities grow it’s simpler and more efficient to capture 100% of the heat with liquid, avoiding the cost and complexity of air cooling. 100% Heat Capture Is required for >250kW Racks. 70% 100% 15kW easily handled by hybrid air cooling. 75kW challenging to handle with hybrid air cooling. 150kW impossible to handle with hybrid air cooling. 5
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Server Cooling Challenges Peripherals • Reaching 100% heat capture • Thermally sensitive components • Different form factors • Loop integration Processors • TDP • Heat flux / hotspots • Thermal mapping – HBMs, Dies • Building Representative TTV’s Server • Design Height & Flow routing • Modularity & serviceability • Installation time • Reliability of connections 6
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85% HEAT CAPTURE Capture heat from OSFPs and DIMMs to further boost 100% HEAT CAPTURE Capture all the heat from a server, via a coldplate array, including conductive plates. 70% HEAT CAPTURE Capture heat from the highest TDP components, typically CPUs, GPUs, TPUs and ASICs. Coldplate Loops Using modular coldplate building blocks, CoolIT can scale the amount of heat capture as required. SUPERCOMPUTE AI HPC AI GENERAL COMPUTING Scale cooling performance all the way to 100% heat capture. 7
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COOLING THE Components COOLING THE Processors COOLING THE Servers COOLING THE Peripherals Coldplate Coverage DIMMs VRMs CPUs GPUs TPUs ASICs SSDs NICs PSUs QSFPs OSFPs 8
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Agenda 1. Introduction 2. Cooling the Processor 3. Cooling the Peripheral Components 4. Cooling the Server 5. Conclusions Brad Zakaib VP Product Engineering
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Package Coldplate Thermal Stack Die TIM1 IHS Motherboard Mounting Points Fin Stack Supply/Return TIM2 10 Erosion Geometries Fin Bonding
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Reduced Pitch for Improved Performance Variable Fin Pitch Reduces Thermal Bottleneck CoolIT continues to evolve our skiving approaches to suit different applications. Fin Geometries & TIM2 11
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More heat, higher flow Increased Velocity/Shear Minimize Durability Concerns Understanding the limits on material durability Corrosion Effects- Reliability Study 12
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Low Thermal Resistance Unibody Construction Low Pressure Drop Coldplate Technologies CoolIT is renowned for designing and producing best-in-class coldplates. Industry’s best performing, most reliable coldplate. Confidential Information 13
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Scaling to 15kW 15kW validation proves mainstream approach to liquid cooling can scale beyond the next five generations of AI GPUs. • Validated at 15kW TDP using current DLC architecture • Achieved with AI-class flow rates and facility water • Demonstrates ~4× scaling from prior 4kW design on the same foundation 15kW TDP 1.2LPM/kW FLOW RATE 80°C Case Temperature 45°C Facility Water 35°C ΔT CoolIT 15kW Coldplate & TTV featuring OMNI & SplitFlow 14
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Dual Sided PCBs Conduction Through-Plane Limited Dual Sided Cooling Required Double Sided Processor Cooling 15 Confidential Information Unlocking future chip architecture with cooling for the underside power delivery. NDA ONLY
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Agenda 1. Introduction 2. Cooling the Processor 3. Cooling the Peripheral Components 4. Cooling the Server 5. Conclusions Brad Zakaib VP Product Engineering
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CPU + DIMM TWO-SIDED COOLING • Vapor Chamber or Tube-Only • Top-down Serviceability •
20-40W DIMMs (DDR5+) ONE-SIDED COOLING • Tube-Only + Clip • Maximum Serviceability • <20W DIMMs (DDR4) • CPU Cold Plate with optional Leak Detection features • Flexible hoses for easy routing, assembly, and service • DIMM Cold Plates attach to conduction plates for board-level component cooling 17
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Pluggable Networking & Storage BORE-RIDING & PISTON-RIDING CANTILEVERED RIDING RIDING COLD PLATE • Maximum Performance (>15W) • High TC Abrasion Resistant TIM • Oring and non-Oring Riding Cold Plates available • Various formfactors support unique spatial requirements FIXED COLD PLATE • Maximum Simplicity • Ultra-Compliant Abrasion Resistant TIM • <15W thermal capacity 18
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Thermal Transfer Plate Supports 100% heat capture of board-level components. Built for purpose. SSD SOCAMM VRM NICs Board-Referenced + Gap Pad Die-Referenced + PCM Two-Sided Cooling Under-Board Cooling 19
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Agenda 1. Introduction 2. Cooling the Processor 3. Cooling the Peripheral Components 4. Cooling the Server 5. Conclusions Brad Zakaib VP Product Engineering
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Coldplate Loop Architecture • A proven backbone of 6 generations of supercomputers. • Fully modular design with individual coldplates • Customize from 70-100% heat capture • Easily service electrical components 70-100% Scalable Heat Capture 21
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Fanless Server Cooling Architectures MONOLITHIC COLDPLATE ARCHITECTURE COLDPLATE LOOP ARCHITECTURE MIXED ARCHITECTURE INTEGRATED COMPONENTS CPU GPU ASIC Switch DIMM SFP SSD, SOCAMM, ETC 22
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Agenda 1. Introduction 2. Cooling the Processor 3. Cooling the Peripheral Components 4. Cooling the Server 5. Conclusions Brad Zakaib VP Product Engineering
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Heat Capture Toolkit CoolIT has a library of components that can be integrated into loops or plates to deliver 100% heat capture. 24
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CIT TOMORROW Critical Layers of Thermal Management CIT TODAY MARKET TODAY PROCESSOR SERVER RACK POD 150W/cm² 2400W 10kW 250kW 9MW HEAT FLUX TDP LOOPS DENSITY CLUSTER 300W/cm²+ 4000W+ 15kW+ 500kW+ 30MW+ HEAT FLUX COLDPLATES LOOPS DLC RACKS GROUPED CDUS 500W/cm²+ 15000W+ 50kW+ 1MW+ 60MW+ HEAT FLUX COLDPLATES LOOPS DLC RACKS GROUPED CDUS 25
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Multi-Vendor, Interoperable Ecosystem With well established suppliers, installers and operators. 2 Simple & Scalable by Design Already being deployed on mass in GW Data Centers today. 3 Effective Heat Capture at All Levels From ultra high heat flux, to long distance transportation – 1-phase wins. 1 Why Single-Phase DLC is the platform for the future. 1-Phase DLC 2-Phase DLC Immersion DIE CHIP SERVER RACK POD 26
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Brad Zakaib, VP Product Engineering Fanless Servers Are Coming: The Peripheral Coldplate Roadmap Behind 100% Heat Capture Visit our booth #E9