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260701_3711_3131_ubs_cloud-AI

更新 2026-07-02

PDF 原檔:260701_3711_3131_ubs_cloud-AI_original.pdf

圖片清單(已驗證 2026-07-02)

檔名 size 分類 親眼所見內容
_001.png 28KB 真資料圖 Figure 9 產業 CoWoS 產能柱狀圖(kwpm,Q123→Q427E 升至約 250)
_002.png 36KB 真資料圖 Figure 10 TSMC vs Non-TSMC CoWoS 產能堆疊柱狀圖
_003.png 38KB 真資料圖 Figure 11 產業 CoWoS 產能 vs Nvidia 用量估計雙色柱狀圖
_004.png 27KB 資料圖(本次不嵌) Figure 14 TSMC N3 產能加速擴充圖
_005.png 17KB 資料圖(本次不嵌) Figure 12 主要客戶 CoWoS 需求圖
_006.png 33KB 資料圖(本次不嵌) Figure 15 2026E N3 產能客戶佔比餅圖
_007.png 33KB 資料圖(本次不嵌) Figure 16 2027E N3 產能客戶佔比餅圖
_008.png 70KB 裝飾·valuation GPTC Value drivers upside/downside spectrum
_009.png 49KB 裝飾·valuation Figure 21 GPTC 12M forward PE band

嵌入對象:_001/_002/_003(CoWoS 產能)→ 供應鏈_CoWoS

原始內容

UBS Global I/O Semiconductors

Cloud AI: TSMC and ASE driving faster CoWoS expansion, unlocking larger TAM

CoWoS capacity upside in 2026-27 across TSMC and ASE

We view TSMC and broader industry CoWoS expansion as a leading indicator of cloud AI demand over the next 2-3 years. Capacity expansion over the next 12-18 months is progressing faster than we expected a month ago, suggesting stronger underlying cloud AI demand. TSMC's CoWoS capacity expansion is re-accelerating and we now expect capacity to reach 130k/180k wpm by end-2026/27 vs our prior estimates of 120k / 150k wpm. We believe this reflects a much larger advanced packaging TAM over the next several years, with a meaningful portion likely to remain on CoWoS even as Intel EMIB-T and TSMC CoPoS enter mass production in 2028. ASE has also been accelerating its fullprocess capacity expansion for 2027. We now forecast its full-process CoWoS capacity to more than double from 20kwpm at end-2026E to ~50kwpm end-2027E vs prior estimate of 40kwpm. (See our ASE note). Overall, we estimate industry CoWoS capacity may rise from 160kwpm at end-2026 to 250kwpm by end-2027.

Robust server CPU demand; Nvidia Rubin ramp to accelerate in H226

On the demand side, we believe server CPU continues to show upside into 2027. ASE's faster CoWoS expansion should be underpinned by higher AMD Venice volumes, which we estimate at 4mn units in 2027, up from 1.3mn in 2026. AMD's CoWoS demand could grow 232% in 2027E with a strong ramp of Venice server CPU and MI450/455. We also lift Nvidia's Vera CPU units to 5.5mn units in 2027 from 1.6mn in 2026, implying 57% growth in Nvidia's CoWoS demand in 2027. Rubin GPU ramp was slower in Q226 due to redesigns, but we anticipate a steep pick up in H226 to reach 2.1mn for 2026. We forecast Google TPU chipset units to rise from 4.1mn in 2026 to 9.0mn in 2027, with MediaTek expected to support 4mn units of TPU v8t capacity. Amazon Trainium 3 demand is growing and we lift 2026/27E unit estimates to 1.8mn/2.8mn (from 1.7m/2.3m). See our CoWoS supply vs demand analysis in Figure 2 T o t a l C W S i n e r p s w f d m -Figure 12 C o W S d e m a n f j r c u t s .

More diversified supply ahead, but TSMC should remain the largest player

As previously noted, we anticipate advanced packaging supply to become more diversified from 2027-28 onward. We see increasing opportunities for ASE and Amkor in H226/2027, mainly driven by server CPUs. Intel's EMIB-T is gaining traction, but we believe Intel may face resource and capacity constraints in 2028, and will likely prioritise internal products and Google/MediaTek's TPU v9 initially. Overall, we think TSMC's advanced packaging sales should sustain solid ~50% growth over the next five years on its leading market share, rising content through 3D stacking, and tech upgrades such as CoPoS and co-packaged optics.

Stock recommendations; ASE/GPTC price target raised to NT$835/$5,000

Along the semiconductor supply chain for cloud AI, our top picks are TSMC (the industry's leading cloud AI foundry), MediaTek (design services for Google TPU), and ASE (advanced packaging & testing). We estimate backend, including advanced packaging, to reach ~12%/15% of TSMC sales in 2026/27E, and our recent Q226 earnings preview raised our sales and EPS estimates on stronger cloud AI demand. MediaTek is a Buy and a Key Call. We lift our ASE price target to NT$835 from NT$660. Critical equipment suppliers for advanced packaging & testing could also benefit from the cloud AI ramp-up, and we like GPTC, Chroma, Hon Precision, and ASMPT. We raise our GPTC price target to NT$5,000 (from NT$4,000) based on 33x 2027-28E PE (vs 33x 2027E PE previously). See page 6. KYEC remains well positioned in the final test space. We like Aspeed for its strong BMC outlook, GUC for its robust Google CPU upside potential, and Alchip for its Amazon Trainium3 and Trainium4 opportunities.

Equities

Asia

Semiconductors

Sunny Lin

Analyst sunny.lin@ubs.com +886-2-8722 7346

Randy Abrams

Analyst randy.abrams@ubs.com +886-2-8722 7338

Nicolas Gaudois Analyst nicolas.gaudois@ubs.com +65-6495 5148

Timothy Arcuri

Analyst timothy.arcuri@ubs.com +1-415-352 5676

Jerry Su Analyst jerry.su@ubs.com +886-28-722 7306

Shingo Hirata, CFA Analyst shingo.hirata@ubs.com

+81-3-5208 6224

Ryan Sun

Associate Analyst ryan-za.sun@ubs.com +886-2-8722 7267

Christine Chen

Associate Analyst christine.chen@ubs.com +886-2-8722 7352

Diana Chang Analyst diana.chang@ubs.com

+886-2-8722 7335

Jimmy Yoon

Analyst jimmy.yoon@ubs.com +65-6495 4617

Figure 1: Valuation comparison

Company name Ticker Rating Market cap (US$m) Price target (LC) Share price (LC) EPS growth (%) EPS growth (%) P/E (x) P/E (x) P/BV (x) P/BV (x) ROE (%) ROE (%) Dividend yield (%) Dividend yield (%)
2026E 2027E 2026E 2027E 2026E 2027E 2026E 2027E 2026E 2027E
Foundry
TSMC 2330.TW Buy 1,961,379 3,400 2,410 50.7 39.5 24.1 17.3 8.5 6.3 40.5 41.7 0.9 1.2
Fabless
Alchip 3661.TW Buy 10,670 6,000 4,180 122.6 37.9 27.1 19.7 6.7 5.5 27.3 30.7 0.9 0.8
Aspeed 5274.TWO Buy 19,569 22,000 16,495 88.4 69.9 84.3 49.6 51.9 32.7 75.5 80.9 0.5 0.9
GUC 3443.TW Buy 20,367 6,260 4,845 84.2 99.4 93.4 46.9 37.7 23.4 46.1 61.7 0.3 0.4
MediaTek 2454.TW Buy 213,677 6,500 4,245 (3.4) 183.2 66.4 23.5 17.3 12.8 25.7 62.7 1.3 1.2
Semi-backend
ASE 3711.TW Buy 94,923 835 680 87.6 66.5 38.7 23.2 7.7 6.4 20.9 30.0 0.9 1.7
KYEC 2449.TW Buy 12,951 380 338 57.0 69.7 33.0 19.4 7.4 6.0 23.5 34.1 1.7 2.0
Equipment
ASMPT 0522.HK Buy 12,695 200 240 106.1 41.2 45.7 32.4 5.5 5.0 12.4 16.1 0.6 1.1
Chroma ATE 2360.TW Buy 28,840 2,960 2,160 63.5 37.6 47.7 34.6 21.3 16.4 51.2 53.4 0.4 0.9
GPTC 3131.TWO Buy 3,328 5,000 3,630 72.6 57.5 46.3 29.4 17.2 13.0 41.7 50.3 0.9 1.5
Hon Precision 7769.TW Buy 36,535 8,800 6,470 46.8 87.0 57.8 30.9 16.7 12.5 31.6 46.3 0.8 1.2

Source: LSEG, UBS estimates. Note: Priced as of 30 June 2026.

Figure 2: Total CoWoS interposer wafer demand

Interposer Wafer Demand (kps) Q126E Q226E Q326E Q426E Q127E Q227E Q327E Q427E 2024 2025 2026E 2027E
Nvidia 128 154 231 278 256 296 335 351 174 444 791 1,238
AMD 11 11 30 77 86 107 110 124 37 42 129 427
ASICs and others 77 97 105 108 162 202 218 226 147 193 387 809
Google TPU - Broadcom 60 76 195 338
Google TPU - MediaTek 0 0 20 182
Amazon Trainium - Alchip 26 5 72 132
Amazon Trainium - Marvell 17 38 18 4
Meta 7 8 6 25
Others 38 66 67 78
Total 216 262 365 463 504 605 664 702 358 679 1,307 2,475

Source: Company data, UBS estimates

Figure 3: Breakdown of CoWoS demand

ASIC vendor as a %of CoWoS wafers demand 2024 2025 2026E 2027E
Google 17% 11% 16% 21%
Broadcom 17% 11% 15% 14%
MediaTek 0% 0% 2% 7%
Amazon 12% 6% 7% 6%
Alchip 7% 1% 6% 5%
Marvell 5% 6% 1% 0%
Meta 2% 1% 0% 1%
Intel / Habana 2% 1% 0% 0%
Microsoft 0% 0% 0% 0%
Tesla 0% 0% 0% 0%
Others 8% 9% 5% 5%
Total ASIC 41% 28% 30% 33%
GPU vendors as a %of CoWoS wafers demand
Nvidia 49% 65% 61% 50%
AMD 10% 6% 10% 17%
Total GPU 59% 72% 70% 67%
Total 100% 100% 100% 100%

Source: Company data, UBS estimates

Figure 4: Nvidia's supply chain build units

Nvidia Supply Chain Build Units (k chips) Q126E Q226E Q326E Q426E Q127E Q227E Q327E Q427E 2024 2025 2026E 2027E
Ampere 0 0 0 0 0 0 0 0 134 0 0 0
Hopper 180 251 215 100 0 0 0 0 4,086 1,402 746 0
Blackwell B200/B300 and GB200/GB300 1,703 1,855 1,715 953 350 111 81 0 314 5,520 6,226 543
Rubin R200 and VR200 0 70 678 1,339 1,544 1,797 1,450 672 0 0 2,087 5,463
Rubin R300 and VR300 0 0 0 0 0 137 639 1,416 0 0 0 2,191
Vera CPU 0 100 428 1,054 1,025 1,180 1,543 1,754 0 0 1,582 5,502
Total 1,883 2,275 3,036 3,446 2,919 3,226 3,713 3,841 4,534 6,921 10,641 13,699

Source: Company data, UBS estimates

Figure 5: AMD's supply chain build units

AMD Supply Chain Build Units (k chips) Q126E Q226E Q326E Q426E Q127E Q227E Q327E Q427E 2024 2025 2026E 2027E
MI300 + MI325X + MI308X+MI355X 163 170 87 89 93 82 15 4 544 626 508 194
MI400 0 0 38 225 295 433 415 369 0 0 263 1,513
MI500 0 0 0 0 0 0 66 177 0 0 0 242
Venice CPU 0 0 400 900 900 1,000 1,000 1,100 0 0 1,300 4,000
Others 1 1 1 2 2 3 3 4 11 4 6 12
Total 164 171 526 1,216 1,291 1,518 1,498 1,653 555 630 2,077 5,961

Source: Company data, UBS estimates

Figure 6: ASIC's supply chain build units

ASIC Supply Chain Build Units (k chips) 2024 2025 2026E 2027E
Google TPU - Broadcom 2,045 2,565 3,680 5,000
Google TPU - MediaTek 0 0 450 4,000
Amazon Trainium - Alchip 1,000 176 1,800 3,100
Amazon Trainium - Marvell 600 1,335 605 145
Meta 348 421 175 425
Others 277 222 192 190
Total 4,270 4,719 7,072 13,590

Source: Company data, UBS estimates. Note: Others include Intel's Habana, Microsoft's Maia, Tesla's Dojo, etc.

Figure 7: SoIC volume

SoIC (kps) Q126E Q226E Q326E Q426E Q127E Q227E Q327E Q427E 2024 2025 2026E 2027E
SoIC volume 14 17 23 29 41 49 54 57 20 42 82 202

Source: Company data, UBS estimates

Figure 8: TSMC's back-end sales analysis

TSMC's backend sales (US$m) Q126E Q226E Q326E Q426E Q127E Q227E Q327E Q427E 2024 2025 2026E 2027E
Sales from adv packaging 2,693 3,236 4,421 5,684 5,924 7,135 7,959 8,713 5,240 8,899 16,034 29,730
Sales from bumping & testing 919 1,039 1,122 1,156 1,179 1,320 1,505 1,580 2,348 3,156 4,236 5,584
Total TSMC's backend sales 3,613 4,275 5,543 6,840 7,102 8,455 9,464 10,293 7,588 12,056 20,270 35,314
%of TSMC's sales 10.1% 10.6% 12.4% 14.8% 14.7% 15.5% 15.2% 15.6% 8.4% 9.8% 12.1% 15.3%

Source: Company data, UBS estimates

Figure 9: Industry CoWoS capacity

260701_3711_3131_ubs_cloud-AI_001

Source: Company data, UBS estimates

Figure 10: TSMC vs. non-TSMC CoWoS capacity

260701_3711_3131_ubs_cloud-AI_002

Source: Company data, UBS estimates. Note: Non-TSMC CoWoS capacity includes ASE and Amkor.

Figure 11: Industry CoWoS capacity vs. Nvidia's volume

260701_3711_3131_ubs_cloud-AI_003

Source: Company data, UBS estimates

Figure 13: N3 supply & demand analysis

N3 capacity requirement (kwpm) N3 capacity requirement (kwpm) N3 capacity requirement (kwpm) N3 capacity requirement (kwpm) N3 capacity requirement (kwpm) N3 capacity requirement (kwpm) N3 capacity requirement (kwpm) N3 capacity requirement (kwpm) N3 capacity requirement (kwpm) N3 capacity requirement (kwpm)
Client Products Die size (mm2) Q126E Q226E Q326E Q426E 2026 demand (k) Q127E Q227E Q327E Q427E 2027 demand (k)
Nvidia Rubin 1,628 0 2 15 29 137 34 39 32 15 360
Rubin Ultra 1,628 0 0 0 0 0 0 4 16 36 169
Vera CPU 800 0 1 5 11 51 11 13 17 19 178
Broadcom Google - TPU v7 Ironwood 1,400 6 11 16 21 158 14 8 6 0 85
Google - TPU v8i 1,400 0 0 2 4 18 7 17 25 35 250
Meta - MTIA v3 1,600 0 0 0 0 2 1 1 2 3 19
OpenAI 1,600 0 0 0 3 11 3 4 4 1 36
AMD MI355 840 2 2 1 1 17 1 1 0 0 7
Alchip Amazon - Trainium 3 1,600 0 4 12 23 116 24 18 12 6 181
Marvell Amazon - Trainium 2.5 1,600 0 0 0 2 7 0 0 0 0 2
MediaTek Google - TPU v8t 800 0 0 1 4 15 9 13 12 9 129
Other CPUs / accelerators and products like networking Other CPUs / accelerators and products like networking 2 4 10 20 106 21 24 25 31 302
Capacity requirement - Cloud AI (kwpm) Capacity requirement - Cloud AI (kwpm) 9 23 61 120 639 125 142 150 155 1,717
%of N3 demand %of N3 demand 7% 17% 37% 65% 35% 68% 73% 74% 74% 72%
Apple iPhone's apps processor 110 43 43 39 22 442 13 11 9 10 128
Mac's processor 165 10 10 8 7 106 7 6 6 6 74
iPad's Mprocessor for Pro & Air 160 14 12 12 8 135 11 10 8 8 111
iPad's A17 Pro processor 104 2 2 1 1 15 3 2 2 2 30
Qualcomm Flagship smartphone SoC 120 17 13 9 3 129 5 5 4 3 51
MediaTek 5G smartphone SoC 120 5 4 3 1 39 2 2 2 1 19
Intel Outsourced PC CPUs 100 19 19 11 4 161 8 8 8 5 85
Others like Bitcoin, tablet, ARM based PC CPU Others like Bitcoin, tablet, ARM based PC CPU 10 10 20 20 180 10 10 15 20 165
Capacity requirement - Consumer and other devices (kwpm) Capacity requirement - Consumer and other devices (kwpm) 120 113 104 65 1,206 60 53 53 55 663
%of N3 demand %of N3 demand 93% 83% 63% 35% 65% 32% 27% 26% 26% 28%
Total N3 demand Total N3 demand 129 136 165 185 1,845 185 195 204 210 2,379
TSMC's N3 capacity TSMC's N3 capacity 120 130 150 170 1,710 175 180 185 190 2,190
Capacity utilisation Capacity utilisation 107% 105% 110% 109% 108% 105% 108% 110% 110% 109%

Source: Company data, UBS estimates. Note: kwpm stands for thousands of wafers per month.

Figure 14: TSMC is accelerating N3 capacity expansion to meet strong demand from cloud AI

260701_3711_3131_ubs_cloud-AI_004

Source: Company data, UBS estimates

Figure 12: CoWoS demand from major customers

260701_3711_3131_ubs_cloud-AI_005

Source: Company data, UBS estimates

Figure 15: N3 capacity share by client in 2026E

260701_3711_3131_ubs_cloud-AI_006

Source: Company data, UBS estimates

Figure 16: N3 capacity share by client in 2027E

260701_3711_3131_ubs_cloud-AI_007

Source: Company data, UBS estimates

Thesis Map UBS Research THESIS MAP a guide to our thinking and what´s where in this report

Pivotal Questions

UBS VIEW

EVIDENCE

WHAT´S PRICED IN?

Upside/Downside Spectrum

Company Description

Q: Can advanced packaging sustain strong growth from cloud AI and increasing chiplet design into N2?

Yes. Advanced packaging has gained importance amid greater system integration and rising performance demands. We expect robust CoWoS capacity expansion to continue in 2026-27, while faster expansion by OSATs such as ASE should benefit GPTC, given its higher share in OSATs. We expect TSMC to ramp up CoWoS capacity from 70kwpm at end-2025 to 130kwpm/180kwpm by end-2026/27. We think OSAT's CoWoS capacity could reach 70kwpm by end-2027. We forecast GPTC's tool shipments to grow 22%/50% in 2026/2027.

Q: Will competitors cause GM headwinds?

Unlikely. We believe GPTC is well positioned versus competitors, given its strong track record in developing new technologies and its ability to maintain solid GM. Over the past 10+ years, despite competition from Scientech in InFO (integrated fan-out) and CoWoS, GPTC has sustained GM above 40% through technology leadership and continuous product roll-outs. Now, with advanced packaging proliferating amid faster technology upgrades and more design types, we expect GPTC to benefit over the next few years, supported by its strong industry position and leading market share in SoIC, panel-level packaging and CPO, among others. GPTC's GM has come under slight pressure in 2025-26 as it outsources some module assembly to meet strong demand. However, we expect its GM to gradually recover toward the mid-40% range by 2027-28.

GPTC is a Taiwanese semiconductor equipment supplier specialising in wet processing tools for advanced packaging. For 2026, we expect TSMC to contribute around 40-50% of its sales, with ASE and SPIL contributing around 25-30% combined. We are increasingly optimistic about the accelerated development of advanced packaging over the next three to four years, and believe GPTC could gain share given its superior technology capabilities. We raise our earnings estimates for 2026 and beyond to reflect a stronger outlook for CoWoS capacity expansion in 2027, as well as additional upside from CoPoS, SoIC and CPO in 2028. We forecast GPTC's tool shipments to increase substantially to ~330 units in 2027, up from 220 in 2026. We reiterate our Buy rating and raise our price target to NT$5,000 from NT$4,000, based on 33x 2027-28E PE (vs 33x 2027E PE previously). We believe a 33x PE multiple is justified by 36% long-term earnings CAGR.

In recent months, we have observed increasing signs of strengthening cloud AI demand, with several large US hyperscalers further raising their 2027 cloud capex plans, alongside TSMC accelerating N3/ N2 capacity expansion and increasing HBM-related capex.

YTD, GPTC's stock has rallied 133%, reflecting an improving cloud AI outlook for 2026 and beyond. However, we believe the significant opportunities in CoWoS, SoIC, panel-level packaging, HBM and CPO are still not fully priced in.

Value drivers (2027E/2028E) Equipment sales growth Chemical sales growth GM 2027-28E PE
NT$6,500 upside 73%/53% 14%24% 47%/47% 36x
NT$5,000 base 67%/47% 9%/19% 45%/45% 33x
NT$2,500 downside 57%/37% 5%/15% 43%/43% 20x
260701_3711_3131_ubs_cloud-AI_008

Source: UBS estimates

Founded in 1993 and headquartered in Hsinchu, Taiwan, Grand Process Technology Corp. (GPTC) is an industry leader that specializes in semiconductor wet processing equipment and chemicals. GPTC's expertise in the wet processing equipment field is recognized by major foundries and backend semiconductor companies. Its main customers include TSMC, ASE/SPIL and Chinese OSATs, with around 70% of sales concentrated in Taiwan.

Figure 17: Summary of major advanced packaging equipment vendors

Product category Ticker Company name Market cap (US$m) Share price Stock YTD performance 2026E 2027E P/E (x) 2028E Major equipment offering(s)
Die attach 0522.HK ASMPT 12,695 241.6 211.9% 46 32.6 26.5 • Die bonder for on-substrate (mass reflow) • Thermo-compression bonder (Chip-to-substrate/Chip-to-wafer) • Hybrid bonder
BESI.AS BE Semiconductor Industries 24,547 278.9 108.5% 72.2 42.5 27.5 • Hybrid bonder • Thermo-compression bonder • Flip chip bonder
042700.KS Hanmi Semiconductor 15,788 256,500.0 101.3% 76.1 48.3 40.5 • Thermo-compression bonder
KLIC.O Kulicke and Soffa 9,913 129.1 183.4% 38.4 30.5 28.7 • Thermo-compression bonder (Chip-to-substrate/Chip-to-wafer) • Ball bonder in InFO
6590.T Shibaura Mechatronics 1,860 4,620.0 22.0% 20.1 15.7 17 • Die bonder for chip-on-wafer (mass reflow) • Hybrid bonder
Wet process 3131.TWO Grand Process Technology 3,328 3,630.00 132.7% 46.3 29.4 20.5 • Wet process cleaning tool
Wet process 3583.TW Scientech 2,172 904.00 170.7% 44.2 29.7 22 • Wet process cleaning tool • Temporary bonding/debonding system
Underfill 6187.TWO All Ring 3,001 998.00 174.2% 43.1 25 17.8 • Underfill dispenser • Automated optical inspection (AOI) tool
Underfill NDSN.O Nordson Corporation 17,281 302.2 25.7% 26.1 24.1 22.3 • Underfill dispenser
Metrology 2360.TW Chroma ATE 27,776 2,160.00 178.7% 51.7 34 25.5 • Redistribution layer measurement
Temporary bonding SMHNn.DE SÜSS MicroTec 2,045 93.8 139.5% 45.9 28.8 21.6 • Temporary bonding/debonding system

Source: Company data, LSEG, UBS estimates. Share price in local currency. Note: Asian stocks priced as of 30 June 2026; non-Asian stocks priced as of 29 June 2026. EPS estimates for non-covered (Kulicke and Soffa, Shibaura Mechatronics, Scientech, All Ring, Nordson Corporation) companies are based on LSEG consensus forecasts.

Forecast changes - GPTC

Figure 18: Revisions to our earnings estimates - GPTC

New New New Old Old Old Change Change Change
(NT$m) 2026E 2027E 2028E 2026E 2027E 2028E 2026E 2027E 2028E
Revenue 10,363 15,873 22,521 10,363 15,553 20,574 0% 2% 9%
- YoY chg (%) 59% 53% 42% 59% 50% 32%
Gross profit 4,239 7,106 10,167 4,239 6,961 9,291 0% 2% 9%
- Gross margin 40.9% 44.8% 45.1% 40.9% 44.8% 45.2% 0% 0% 0%
Operating profit 2,419 4,407 6,338 2,419 4,317 5,793 0% 2% 9%
- Operating margin 23.3% 27.8% 28.1% 23.3% 27.8% 28.2% 0% 0% 0%
Pre-tax profit 2,815 4,432 6,355 2,815 4,341 5,815 0% 2% 9%
Reported net profit 2,251 3,545 5,084 2,251 3,473 4,652 0% 2% 9%
- Net margin 21.7% 22.3% 22.6% 21.7% 22.3% 22.6%
Reported EPS (NT$) 78.45 123.59 177.23 78.45 121.07 162.16 0% 2% 9%
- YoY chg (%) 73% 58% 43% 73% 54% 34%

Source: UBS estimates

Figure 19: Our revised earnings estimates vs. consensus - GPTC

UBS UBS UBS Consensus Consensus Consensus Difference Difference Difference
(NT$m) 2026E 2027E 2028E 2026F 2027F 2028F 2026E 2027E 2028E
Revenue 10,363 15,873 22,521 9,196 12,829 16,655 13% 24% 35%
- YoY chg (%) 59% 53% 42% 41% 40% 30%
Gross profit 4,239 7,106 10,167 3,770 5,654 7,602 12% 26% 34%
- Gross margin 40.9% 44.8% 45.1% 41.0% 44.1% 45.6%
Operating profit 2,419 4,407 6,338 2,191 3,621 5,101 10% 22% 24%
- Operating margin 23.3% 27.8% 28.1% 23.8% 28.2% 30.6%
Pretax profit 2,815 4,432 6,355 2,431 3,817 5,212 16% 16% 22%
Net profit 2,251 3,545 5,084 1,943 3,038 4,127 16% 17% 23%
- Net margin 21.7% 22.3% 22.6% 21.1% 23.7% 24.8%
Basic EPS (NT$) 78.45 123.59 177.23 66.58 103.98 141.25 18% 19% 25%
- YoY chg (%) 73% 58% 43% 46% 56% 36%

Source: Visible Alpha, UBS estimates

Figure 20: UBS earnings forecasts - GPTC

(NT$m) 2025 Q126E Q226E Q326E Q426E 2026E Q127E Q227E Q327E Q427E 2027E 2028E 2029E 2030E
Revenue 6,514 1,596 2,584 2,905 3,278 10,363 3,427 3,857 4,235 4,355 15,873 22,521 27,497 35,952
- YoY chg (%) 60% 29% 58% 95% 52% 59% 115% 49% 46% 33% 53% 42% 22% 31%
- QoQ chg (%) -26% 62% 12% 13% 5% -63% 24% 13%
Gross profit 2,681 539 1,059 1,213 1,427 4,239 1,512 1,706 1,912 1,976 7,106 10,167 12,665 16,556
- Gross margin 41.2% 33.8% 41.0% 41.7% 43.5% 40.9% 44.1% 44.2% 45.2% 45.4% 44.8% 45.1% 46.1% 46.1%
Operating profit 1,636 210 620 719 870 2,419 929 1,050 1,193 1,235 4,407 6,338 8,265 11,163
- Operating margin 25.1% 13.2% 24.0% 24.7% 26.5% 23.3% 27.1% 27.2% 28.2% 28.4% 27.8% 28.1% 30.1% 31.1%
Pre-tax profit 1,690 580 632 728 875 2,815 936 1,058 1,200 1,239 4,432 6,355 8,278 11,175
Net profit 1,327 463 505 582 700 2,251 749 846 960 991 3,545 5,084 6,623 8,940
- YoY chg (%) 57% 81% 145% 91% 25% 70% 62% 67% 65% 41% 58% 43% 30% 35%
- QoQ chg (%) -18% 9% 15% 20% 7% -62% 28% 17%
Basic EPS (NT$) 45.45 16.11 17.62 20.29 24.41 78.45 26.09 29.49 33.47 34.54 123.59 177.23 230.85 311.63
- YoY chg (%) 56% 84% 150% 95% 27% 73% 62% 67% 65% 41% 58% 43% 30% 35%
- QoQ chg (%) -16% 9% 15% 20% 7% -62% 28% 17%

Source: Company data, UBS estimates

Figure 21: GPTC's 12M forward PE band (x)

260701_3711_3131_ubs_cloud-AI_009

Source: LSEG, UBS

Valuation Method and Risk Statement

Tech investing involves risk. It is difficult for the investment community, UBS included, to project the financial results of tech companies, as their operating models are highly volatile and unpredictable, and they compete in a highly dynamic marketplace. In addition to their low predictability, valuing tech stocks can be challenging because neither traditional nor nontraditional valuation measures have provided much insight into how tech stocks trade.

We value GPTC based on PE methodology.

Downside risks include: 1) slower-than-expected CoWoS capacity expansion; 2) competitors achieving technological advancements; 3) geopolitical uncertainty; and 4) worse-thanexpected AI growth.

Quantitative Research Review

UBS Global Research publishes a quantitative assessment of its analysts' responses to certain questions about the likelihood of an occurrence of a number of short term factors in a product known as the 'Quantitative Research Review'. The views for this month can be found below. Views contained in this assessment on a particular stock reflect only the views on those short term factors which are a different timeframe to the 12-month timeframe reflected in any equity rating set out in this note. For previous responses please make reference to (i) previous UBS Global Research reports; and (ii) where no applicable research report was published that month, the Quantitative Research Review which can be found at https://neo.ubs.com/quantitative, or contact your UBS sales representative for access to the report or the Quantitative Research Team on ubs-quant-answers@ubs.com. A consolidated report which contains all responses is also available and again you should contact your UBS sales representative for details and pricing or the Quantitative Research Team on the email above.

GPTC

Question Response
1. Is the industry structure facing the firm likely to improve or deteriorate over the next six months? Rate on a scale of 1-5 (1 = getting worse, 3 = no change, 5 = getting better, N/A = no view) 4
2. Is the regulatory/government environment facing the firm likely to improve or deteriorate over the next six months? Rate on a scale of 1-5 (1 = getting tougher 3 = no change, 5 = getting better, N/A = no view) 3
3. Over the last 3-6 months in broad terms have things been improving/no change/getting worse for this stock? Rate on a scale of 1-5 (1 = getting a lot worse, 3 = not much change, 5 = getting a lot better, N/A = no view) 3
4. Relative to the current CONSENSUS EPS forecast, is the next company EPS update likely to lead to: (1 = negative surprise vs consensus, 3 = in-line with consensus, 5 = positive surprise vs consensus expectations, N/A = no view) 3
5. What's driving the difference?
6. Relative to YOUR current earnings forecast, is there relatively greater risk at the next earnings result of:(1 = downside skew risk to earnings, 3 = equal upside or downside risk to earnings, 5 = upside skew risk to earnings, N/A = no view) 3
7. What's driving the difference?
8. Is there an upcoming catalyst for the company over the next three months?
9. Is there an actual or approximate date for the catalyst?
10. Is the catalyst date an actual or approximate date?
11. What is the catalyst?

Required Disclosures

This document has been prepared by UBS Securities Pte. Ltd., Taipei Branch, an affiliate of UBS AG. UBS AG, its subsidiaries, branches and affiliates, including former Credit Suisse AG and its subsidiaries, branches and affiliates are referred to herein as "UBS".

For information on the ways in which UBS manages conflicts and maintains independence of its UBS Global Research product; historical performance information; certain additional disclosures concerning UBS Global Research recommendations; and terms and conditions for certain third party data used in research report, please visit https://www.ubs.com/disclosures. Unless otherwise indicated, information and data in this report are based on company disclosures including but not limited to annual, interim, quarterly reports and other company announcements. The figures contained in performance charts refer to the past; past performance is not a reliable indicator of future results. Additional information will be made available upon request. UBS Securities Co. Limited is licensed to conduct securities investment consultancy businesses by the China Securities Regulatory Commission. UBS acts or may act as principal in the debt securities (or in related derivatives) that may be the subject of this report. This recommendation was finalized on: 01 July 2026 05:38 AM GMT. UBS has designated certain UBS Global Research department members as Derivatives Research Analysts where those department members publish research principally on the analysis of the price or market for a derivative, and provide information reasonably sufficient upon which to base a decision to enter into a derivatives transaction. Where Derivatives Research Analysts coauthor research reports with Equity Research Analysts or Economists, the Derivatives Research Analyst is responsible for the derivatives investment views, forecasts, and/or recommendations. Quantitative Research Review: UBS Global Research publishes a quantitative assessment of its analysts' responses to certain questions about the likelihood of an occurrence of a number of short term factors in a product known as the 'Quantitative Research Review'. Views contained in this assessment on a particular stock reflect only the views on those short term factors which are a different timeframe to the 12-month timeframe reflected in any equity rating set out in this note. For the latest responses, please see the Quantitative Research Review Addendum at the back of this report, where applicable. For previous responses please make reference to (i) previous UBS Global Research reports; and (ii) where no applicable research report was published that month, the Quantitative Research Review which can be found at https://neo.ubs.com/ quantitative, or contact your UBS sales representative for access to the report or the Quantitative Research Team on ubs-quantanswers@ubs.com. A consolidated report which contains all responses is also available and again you should contact your UBS sales representative for details and pricing or the Quantitative Research team on the email above.