報告_OCP2026_Promersion_液冷市場更新_20261015

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圖片清單（已驗證 2026-10-19）

原始內容

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Rolf Brink CEO, Promersion Liquid Cooling Market Update: Industry Dynamics- Adoption Signals- and the Road to Scale Cooling Environments

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Independent across the whole thermal path PROMERSION B.V. · LIQUID COOLING STRATEGY DEVELOPMENT WHO WE WORK WITH ACQUISITION IT envelope Silicon vendors ODM/OEM & integrators Fluid chemistry TRANSPORT the seam Component & supply chain vendors/developers REJECTION facility envelope Data center operators & colocation Connected to every player, owned by none TRACK RECORD Chair OCP Immersion Project, co-architect of OCP cooling communities since 2018 Co-author Thermal Boundaries in AI Infrastructure, OCP whitepaper On track Liquid cooling market forecasting since 2024 Independent by design: no hardware, no fluids, no facilities to sell. https://promersion.com Vertically integrated operators & investors FROM INDUSTRY EDUCATION TO DECISION ASSURANCE Industry training How the industry really works Industry analytics Market clarity from real adoption Due diligence Technical and market durability, validated Strategy & alignment Ambition made executable Decision assurance Critical calls free of bias and lock-in

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10.0% 11.2% 15.3% 29.0% 26.0% 22.0% 20.2% 17.0% 15.0% 14.3% 12.7% 11.3% 10.9% 8.9% 0% 5% 10% 15% 20% 25% 30% 35% $0 $500 $1,000 $1,500 $2,000 $2,500 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 2032 2033 2034 2035 Billions DC Market size forecast Growth rate CAGR 2025-2035: 15.7% DC MARKET SIZE FORECAST UPDATE (IN BILLIONS OF US$) © Promersion B.V. 2026

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10.0% 11.2% 15.3% 29.0% 26.0% 22.0% 20.2% 17.0% 15.0% 14.3% 12.7% 11.3% 10.9% 8.9% 0% 5% 10% 15% 20% 25% 30% 35% $0 $500 $1,000 $1,500 $2,000 $2,500 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 2032 2033 2034 2035 Billions DC Market size forecast Growth rate CAGR 2025-2035: 15.7% DC MARKET SIZE FORECAST UPDATE (IN BILLIONS OF US$) • Multi-GW Hyperscale AI campuses (50–200 kW/rack) • NVIDIA supply ramps (GB200/NVL72) • 2023/24 Grid pre-allocations physical builds • China pushes homegrown GPU ecosystems into mass deployment © Promersion B.V. 2026

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10.0% 11.2% 15.3% 29.0% 26.0% 22.0% 20.2% 17.0% 15.0% 14.3% 12.7% 11.3% 10.9% 8.9% 0% 5% 10% 15% 20% 25% 30% 35% $0 $500 $1,000 $1,500 $2,000 $2,500 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 2032 2033 2034 2035 Billions DC Market size forecast Growth rate CAGR 2025-2035: 15.7% DC MARKET SIZE FORECAST UPDATE (IN BILLIONS OF US$) • Multi-facility simultaneous global buildout • Non-elastic demand for AI capacity • Liquid cooling mass inflection • Hyperscale shift to internal platform development © Promersion B.V. 2026

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10.0% 11.2% 15.3% 29.0% 26.0% 22.0% 20.2% 17.0% 15.0% 14.3% 12.7% 11.3% 10.9% 8.9% 0% 5% 10% 15% 20% 25% 30% 35% $0 $500 $1,000 $1,500 $2,000 $2,500 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 2032 2033 2034 2035 Billions DC Market size forecast Growth rate CAGR 2025-2035: 15.7% DC MARKET SIZE FORECAST UPDATE (IN BILLIONS OF US$) • AI shift from “land grab” to “fleet refresh” • Liquid cooling normalization • Power constraints slow expansion • Steadier absorption of expansion in new regions © Promersion B.V. 2026

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10.0% 11.2% 15.3% 29.0% 26.0% 22.0% 20.2% 17.0% 15.0% 14.3% 12.7% 11.3% 10.9% 8.9% 0% 5% 10% 15% 20% 25% 30% 35% $0 $500 $1,000 $1,500 $2,000 $2,500 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 2032 2033 2034 2035 Billions DC Market size forecast Growth rate CAGR 2025-2035: 15.7% DC MARKET SIZE FORECAST UPDATE (IN BILLIONS OF US$) • AI architectures mature • Hardware refresh cycles stabilize • Power grid expansion plateaus • Efficiency improvements slow capex intensity © Promersion B.V. 2026

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0 kW 10 kW 20 kW 30 kW 40 kW 50 kW 60 kW 70 kW 80 kW 90 kW 100 kW GLOBAL AVERAGE RACK DENSITY GROWTH 2010-2035 (IN KW PER RACK) © Promersion B.V. 2026

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0 kW 500 kW 1000 kW 1500 kW 2000 kW 2500 kW 3000 kW 3500 kW 4000 kW Global Average Low density High density Peak densities RACK DENSITY DISPERSION 2010-2035 (IN KW PER RACK) © Promersion B.V. 2026 The average rack no longer exists

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0 kW 500 kW 1000 kW 1500 kW 2000 kW 2500 kW 3000 kW 3500 kW 4000 kW Global Average Low density High density Peak densities RACK DENSITY DISPERSION 2024-2035 (IN KW PER RACK) © Promersion B.V. 2026 • D2C cooling moves from niche to necessity • D2C and Door Heat Exchangers are Combined to extend thermal headroom

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0 kW 500 kW 1000 kW 1500 kW 2000 kW 2500 kW 3000 kW 3500 kW 4000 kW Global Average Low density High density Peak densities RACK DENSITY DISPERSION 2010-2035 (IN KW PER RACK) © Promersion B.V. 2026 • D2C cooling matures • Cooling Infrastructure supply chains struggle to keep up • Rack densities continue to grow

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0 kW 500 kW 1000 kW 1500 kW 2000 kW 2500 kW 3000 kW 3500 kW 4000 kW Global Average Low density High density Peak densities RACK DENSITY DISPERSION 2010-2035 (IN KW PER RACK) © Promersion B.V. 2026 • Expected transition to 800VDC power architecture • D2C Supply ecosystem matures to scale • Increasing platform densities challenge D2C capabilities • Immersion Cooling expected to move from niche to necessity

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0 kW 500 kW 1000 kW 1500 kW 2000 kW 2500 kW 3000 kW 3500 kW 4000 kW Global Average Low density High density Peak densities RACK DENSITY DISPERSION 2010-2035 (IN KW PER RACK) © Promersion B.V. 2026 • Rack, power and cooling densities force full re-architecture of datacenter and IT infrastructure • Fully hybridized and application optimized IT cooling becomes the norm

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133% 50% 484% 137% 62% 30% 25% 20% 19% 18% 17% 16% 15% 13% 146% 72% 42% 3% 18% 45% 250% 125% 65% 45% 31% 20% 18% 15% 0% 100% 200% 300% 400% 500% 600% $0 $10 $20 $30 $40 $50 $60 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 2032 2033 2034 2035 BILLIONS Cold plate Immersion Cold plate growth % Immersion growth % GLOBAL LIQUID COOLING MARKET SIZE FORECAST UPDATE (IN BILLIONS OF US$) © Promersion B.V. 2026

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The silicon sets the clock PACKAGE POWER OF LEADING PROCESSORS, W 0 1,000 2,000 3,000 4,000 2008 2010 2012 2014 2016 2018 2020 2022 2024 2026 2028 2030 Leading AI accelerators (GPU class) Leading server CPUs Frontier trend since 2020 Single-phase cold plate wall, ~4 kW ≈ 2.3 kW Leading accelerator package power on 2026 roadmaps ~ 4 kW Physics wall of single-phase cold plate on a reticle- class die ≈ 2029 Year the post-2020 frontier trend reaches that wall Data: Thermal Boundaries in AI Infrastructure chart set (vendor TDP disclosures).

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Transitions are forced, not chosen SHARE OF TOP-TIER ACCELERATOR TDP SHIPPED ON COLD PLATE, % 0 20 40 60 80 100 2018 2020 2022 2024 2026 2028 Cold plate share Inflection: air can no longer hold the hottest part “An ecosystem exhausts every option that preserves its current architecture before it accepts one that changes it.” THE LEAST-DISRUPTION LAW Under 10% to above 90% in about 24 months. Air did not lose a comparison. It ran out of room. Source: Thermal Boundaries in AI Infrastructure, an OCP whitepaper from Promersion, Oracle, Avayla and Meta. CC BY-SA 4.0.

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The thermal path ACQUISITION Heat off the component Cold plate, immersion, in-chip IT envelope · 2-3 year clock TRANSPORT Heat from IT to the facility Manifolds, quick disconnects, CDU, loops The seam · shared territory REJECTION Heat out, or to reuse Chillers, dry coolers, towers, heat reuse Facility envelope · decades Source: Thermal Boundaries in AI Infrastructure, an OCP whitepaper from Promersion, Oracle, Avayla and Meta. CC BY-SA 4.0. ACQUISITION TRANSPORT REJECTION

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“Cooling” now means three jobs ACQUISITION Heat off the component Cold plate, immersion, in-chip IT envelope · 2-3 year clock TRANSPORT Heat from IT to the facility Manifolds, quick disconnects, CDU, loops The seam · shared territory REJECTION Heat out, or to reuse Chillers, dry coolers, towers, heat reuse Facility envelope · decades “Cooling” in the air era “Cooling” in the liquid era THE LIQUID ERA - the seam becomes shared territory THE AIR ERA - one handoff Chip Chassis Rack manifold CDU Facility loop Heat rejection Heated air leaves the rack — the only crossing Many parties co-design across the seam. Every crossing is a new dependency interface Vertically integrated operator — spans the entire path (the fast clock) Silicon vendor IT OEM & system integrators (heatsinks, fans inside) Facility infrastructure & operations Silicon vendor IT OEM & rack integrators Cold plate systems receding Immersion systems (tank incorporates chassis) Facility infrastructure (CDU & sidecars now in the whitespace) expanding Same word, three jobs, three different buyers. Source: Thermal Boundaries in AI Infrastructure, an OCP whitepaper from Promersion, Oracle, Avayla and Meta. CC BY-SA 4.0. ACQUISITION TRANSPORT REJECTION

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Two industries, two clocks TRANSPORT ONE FACILITY, MANY IT GENERATIONS 2026 2029 2032 2035 2038 2041 IT envelope refresh every 2-3 years IT generation IT generation IT generation IT generation IT generation IT generation The seam must fit both Re-specified at every IT generation, bound to a facility that does not change Facility envelope built for 10-20 years One facility Buyer Platform, OEM, ODM Owner, operator, MEP Standards home OCP, OEM specifications ASHRAE, codes, local regulation Business model Product cycles, design wins Projects, long-life assets Different buyers, different standards, different clocks: two industries, not one market. Source: Thermal Boundaries in AI Infrastructure, an OCP whitepaper from Promersion, Oracle, Avayla and Meta. CC BY-SA 4.0. ACQUISITION REJECTION

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Strength does not cross the seam 1 Organisations run on one clock. Processes, sales motions and incentives are tuned to product cycles or to long-life projects, rarely both. 2 Adjacency is not synergy. Across the seam looks like a short step on a diagram. In practice it is a different market: buyers, qualification, standards, cadence. 3 The seam rewards interfaces, not ownership. Value forms where one server can be cooled by many facilities, and one facility can host many servers. First question: which side of the seam are you on, and which clock do you run? © Promersion B.V. 2026 ACQUISITION TRANSPORT REJECTION

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Recommended additional reading PUBLISHED ON LINKEDIN · DEC 10, 2024 THE RISE OF NECESSITY: WHAT COLD PLATE ADOPTION MEANS This article explains why the adoption of cold plate cooling is not driven by preference or optimization, but by necessity. It outlines how IT platform evolution, power density growth, and architectural constraints are forcing a structural shift in cooling choices, and what this inevitability means for the future role of immersion cooling. PUBLISHED ON LINKEDIN · JAN 28, 2025 PROJECTING THE COOLING LANDSCAPE OF 2030 This article looks beyond the initial inflection point and explores how the cooling ecosystem is likely to evolve toward 2030. It outlines a more fragmented and diverse landscape, where air, cold plate, and immersion cooling coexist, each aligned to specific workloads, power densities, and operational models. PUBLISHED ON LINKEDIN · SEP 2, 2026 WHERE COOLING STOPS MAKING SENSE: THERMAL BOUNDARIES This article opens the Thermal Boundaries series, built on the OCP whitepaper of the same name. It introduces the three boundaries every cooling method eventually meets, efficiency, economic and physics, and the avoidance zone between them, where most of the industry's cost and risk quietly accumulates. Together these form the vocabulary for reading any cooling technology as a position on a map rather than a contestant in a bake-off. promersion.com/articles/ Thermal Boundaries Article Series

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Rolf Brink CEO, Promersion Mohan J. Kumar Architect OCI, Oracle Steve Mills Technical Lead, AI hardware & data center design, Meta Kelley Mullick CEO, Avayla Thermal Boundaries in AI Infrastructure Cooling Environments

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Air's efficiency boundary COOLING OVERHEAD CLIMBS WITH DEVICE POWER 0 5 10 15 20 25 30 35 40 100 200 300 400 500 600 700 800 900 1000 1100 Fan power share % Device power (W) Efficiency boundary: the knee, where fan share turns superlinear (~15% here) Air physics boundary (chassis airflow limit) early trend, continued The superlinear penalty

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Cold plate is entering its avoidance zone ACQUISITION TRANSPORT REJECTION WHERE THE THREE BOUNDARIES SIT, BY POWER PER RETICLE-CLASS DEVICE 0 kW 1 kW 2 kW 3 kW 4 kW 5 kW 6 kW Single-phase cold plate avoidance zone Two-phase cold plate avoidance zone Leading accelerator, 2026 roadmaps: ≈ 2.3 kW Efficiency boundary Economic boundary Physics boundary Still possible, no longer sensible. The longer the stretch, the larger the bill. Source: Thermal Boundaries in AI Infrastructure, an OCP whitepaper from Promersion, Oracle, Avayla and Meta. CC BY-SA 4.0. Accelerator marker: Promersion, from the paper's chart set.

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Same heat, two different jobs A handful of extreme hotspots and a large distributed load – each method owns the boundary the other cannot reach

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White Paper Spotlight: Thermal Boundaries in AI Infrastructure Matching cooling technologies to compute through the power inflection — OCP OSAI Strategic Initiative / Cooling Environments, Aug 2026 Three boundaries — efficiency, economics, physics — bound every cooling method; the “avoidance zone” between them explains why transitions are delayed Least-disruption law: a new method is adopted only when the old one can no longer do the job — not simply because it's better ≈4,000 W projected physics boundary per reticle for single- phase cold plate on current silicon roadmaps 1 Efficiency boundary cooling cost eats into output 2 Economic boundary “avoidance zone” begins here 3 Physics boundary method can no longer work Conclusion: no single technology wins — the industry needs an interoperable, multi-technology toolkit matched to the heat, site, and moment. Scan to download

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Steve Mills Technical Lead, AI hardware & data center design, Meta Rolf Brink CEO, Promersion Liquid Cooling Bazaar Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask! With all OCP Cooling Environments volunteer leaders Made possible by:

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Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

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The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

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https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

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Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

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The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

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https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

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Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p62

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p63

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p64

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p65

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p66

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p67

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p68

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p69

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p70

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p71

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p72

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p73

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p74

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p75

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p76

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p77

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p78

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p79

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p80

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p81

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p82

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p83

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p84

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p85

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p86

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p87

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p88

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p89

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p90

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p91

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p92

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p93

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p94

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p95

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p96

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p97

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p98

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p99

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p100

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p101

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p102

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p103

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p104

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p105

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p106

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p107

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p108

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p109

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p110

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p111

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p112

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p113

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p114

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p115

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p116

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p117

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p118

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p119

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p120

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p121

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p122

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p123

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p124

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p125

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p126

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p127

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p129

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p130

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p131

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p132

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p133

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p134

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p135

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p136

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p137

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p138

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p139

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p140

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p141

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p142

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p143

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p144

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p145

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p146

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p147

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p148

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p149

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p150

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p151

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p152

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p153

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p154

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p155

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p156

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p157

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p158

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p159

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p160

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p161

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p162

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p163

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p164

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p165

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p166

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p167

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p168

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p169

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p170

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p171

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p172

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p173

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p174

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p175

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p176

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p177

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p178

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p179

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p180

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p181

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p182

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p183

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p184

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p185

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p186

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p187

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p188

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p189

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p190

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p191

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p192

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p193

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p194

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p195

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p196

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p197

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p201

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p202

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p203

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p204

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p205

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p206

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p208

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p209

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p210

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p211

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p213

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p214

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p215

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p216

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p217

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p218

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p219

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p220

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p221

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p222

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p223

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p224

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p225

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p226

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p227

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p228

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p229

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p230

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p231

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

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Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p233

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p234

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p235

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p236

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p237

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p238

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p239

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p240

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p241

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p242

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p243

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p244

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p245

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p246

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p247

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p248

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

p249

Introductions: Cooling Environments Role Lead Co-lead CE Top Project John Fernandes (Meta) Sean Sivapalan (NVIDIA) OCP Steering Committee Steve Mills (Meta) Cooling Environments Everything you always wanted to know about liquid cooling, but were afraid to ask!

p250

Introductions: Immersion Project leadership Body Lead Co-lead Immersion Project Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Technical committees Fluids Committee Kris Fletcher (Independent) Spencer Kerns (Chevron Phillips Chemical) ITE Committee Austin Hipes (Unicom Engineering) Pending Reliability Committee Samantha Yates (Intel) Brian Kinkade (Fuchs) Solutions Committee Amy Short (Denvr Dataworks) Kevin Gero (Murata Power Solutions), Andy Young (Asperitas) Support teams Community Enablement Gemma Reeves (Alfa Laval) Community Outreach Allison Boen (Alcatex) Rachel Bielstein (Baltimore Aircoil Company) Industry Liaison Kelley Mullick (Avayla) Maryam Mohagheghi (HF Sinclair) OCP Projects Liaison OPEN OPEN Immersion Challenges Rolf Brink (Promersion) Jessica Gullbrand (Eaton) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p251

Immersion Project mailing lists Everything you always wanted to know about liquid cooling, but were afraid to ask!

p252

Introductions: Immersion workstreams Workstream Lead Co-lead Fluids: Fluid Cleaning Guidelines Roma Surís (Submer) JanElsa Carty (Shell) Fluids: Fluid Lifecycle Management Alex McManis (Eneos) OPEN Fluids: Oxidation Methodology Spencer Kerns (Chevron Phillips Chemical) Vanja Boyd (ExxonMobil) Fluids: Specifications Kris Fletcher (Independent) Peter Cooper (Promersion) ITE: Advanced Cooling Techniques Andy Richenderfer (Lubrizol) Florian Hudelmaier (Wieland) ITE: Design Guidelines for ITE Austin Hipes (Unicom Engineering) Peter Liu (Independent) ITE: Signal Integrity Tina Bao (TE Connectivity) Kai Wang (Intel) Reliability: Component Compatibility Beau Van Vaerenbergh (Oleon) Brian Kinkade (Fuchs) Reliability: Material Compatibility Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Reliability: Server Thermochemical Reliability Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Solutions: FMEA Nicholas Beardsley (GRCooling) Khaled Morsy (Bureau Veritas) Solutions: Hardware Management Mick Jones (Vertiv) Closed Solutions: Immersion Requirements Amy Short (Denvr Dataworks) Peter Cooper (Promersion) Solutions: Power Distribution Oriol Chavanel (Submer) Kevin Gero (Murata Power Solutions) Solutions: TCO Andy Young (Asperitas) Eduard Roytman (Microsoft) Everything you always wanted to know about liquid cooling, but were afraid to ask!

p253

Immersion mailing lists: Fluids & ITE Everything you always wanted to know about liquid cooling, but were afraid to ask!

p254

Immersion mailing lists: Solutions Everything you always wanted to know about liquid cooling, but were afraid to ask!

p255

Immersion mailing lists: Reliability Component Compatibility Material Compatibility Thermochemical Reliability Everything you always wanted to know about liquid cooling, but were afraid to ask!

p256

Introductions: Door Heat Exchanger Project Lead Co-lead Door Heat Exchanger Jabari George (JMGE) Martin Doerrich (Rittal GmbH) Workstreams Aluminum Heat Exchanger Integration in Data Centers Lionel Faure (Valeo) Mohamad Hynano (OVHCloud) Advancing AALC Systems with Sidecar Cooling Solutions Rajesh Kasukurthy (AMD) Door HX Interfaces for ORV3 Juan Carlos Cacho Alonso (Rittal GmbH) TCS Flow Control Andres Parraga Coleman (Grundfos) Door HX Project Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p257

Introductions: Heat Reuse Project Lead Co-lead Heat Reuse Jaime Comella (AQ Compute) Bharath Ramakrishnan (Microsoft) Workstreams Reference Designs David Sickinger (NREL) Mark Smith (Alfa Laval) Economics Jack Kolar (Dataquarium) Peter Terenius (Uppsala University), Gemma Reeves (Alfa Laval) Policies David Gardiner (DGA) Otto Van Geet (NREL) Heat Reuse Wiki Mailing List Everything you always wanted to know about liquid cooling, but were afraid to ask!

p258

Introductions: Cold Plate Project Lead Co-lead Cold Plate Emily Clark (Dell) Berhanu Wondimu (Intel) Workstreams Coolant Fluids Philip Yu (Veolia) Keegan Yaroch (DOW), Lilach Butchmits (Zutacore) UQD/UQDB Specification Rev. 2.0 Elizabeth Langer (CPC) Travis Gaskill (NVIDIA) Fluid Velocity Cheng Chen (Meta) Harsha Bojja (Microsoft) BMQC (CLA) Vijay Mohan (Meta) Glenn Charest (Meta) PBMC (CLA) Vijay Mohan (Meta) Glenn Charest, John Fernandes (Meta) Mailing List Cold Plate Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p259

Introductions: CDU Project (formerly ACF) Co-leads Co-leads CDU John Menoche (Vertiv), Hussam Kabbani (Google) Matt Koukl (AEI), Pardeep Shahi (NVIDIA) CDU Subproject Everything you always wanted to know about liquid cooling, but were afraid to ask!

p260

The floor is yours EVERYTHING YOU ALWAYS WANTED TO KNOW ABOUT LIQUID COOLING, BUT WERE AFRAID TO ASK! Any question Cold plate, immersion, door HX, CDU, heat reuse, fluids, materials, telemetry and everything in between. The front rows answer Project and workstream leaders take the mic for their own area. Bring the hard ones Open problems are welcome. If nobody has solved it yet, we will say so. You set the agenda What we struggle to answer shows where the gaps are, and feeds the next cycle of work. Ask anything. Every question tells us where the next cycle of work should go.

p261

https://dcoffsiteevents.com/ forever-fluid-ocp RSVP NOW! Invited by: “LIVE during OCP”

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Open Discussion