PDF 原檔：報告_OCP2026_貿聯_448G高速互連_20261015_original.pdf
講者公開簡報（OCP 官方 Recorded Content 頁提供下載）。文字以 PyMuPDF 逐頁抽取，
### p<n>為頁碼；圖表內容見原檔。
圖片清單（已驗證 2026-10-19）
| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_貿聯_448G高速互連_20261015_p4.png |
p4 | 真資料圖 | 「copper wall」規格表：PAM4／PAM6／PAM8 的 bits per symbol 2／2.585／3、symbol rate 224／173／150GBd、Nyquist 112／87／75GHz、相對 PAM4 SNR 0／-4.4／-7.4dB，附眼圖縮圖 |
報告_OCP2026_貿聯_448G高速互連_20261015_p9.png |
p9 | 真資料圖 | taping pitch 造成 notch：ΔL 4.0／1.6／1.0mm 對應共振約 25–30／62–72／≥100GHz；右側 30AWG dual drain ParaLink（92Ω）SDD21 曲線與約 22GHz 附近 notch 放大圖，並附共振頻率公式 |
報告_OCP2026_貿聯_448G高速互連_20261015_p10.png |
p10 | 真資料圖 | ParaLink 85cm 去嵌入後量測：SDD21 曲線至 110GHz 約 -14dB，另有 SDC21 與 SDD11 曲線；dual drain、92Ω、標示 Ready for 448G |
報告_OCP2026_貿聯_448G高速互連_20261015_p11.png |
p11 | 真資料圖 | Paralink 39AWG 搭 Rosenberger TeraNano 的 CPC（近晶片銅纜）：五種 ASIC 到 IO connector／CPC connector 佈局剖面圖；TeraNano 10mm x 18mm 供 32 對差分、mating height <6mm；PCB（Megtron 6 約 -35dB/m @20GHz）對比 Paralink 優於 -15dB/m；OSFP cage chip-to-module 實物 |
報告_OCP2026_貿聯_448G高速互連_20261015_p12.png |
p12 | 真資料圖 | CPC 系統 SDD21 量測（Rosenberger 來源、PCB3 500mm 四組樣品），標出 224G PAM4 56GHz、448G PAM6 86.7GHz、448G PAM4 112GHz 三條虛線；曲線在 56GHz 約 -21dB、86.7GHz 約 -30dB、112GHz 約 -40dB；右側為 no-drain AWG39 截面與測試治具照 |
原始內容
p1
© 2026 BizLink Group. All Rights Reserved Confidential How can high-speed interconnect solutions drive next generation AI data centres at 448G and beyond? Dr. Hendrik Coldenstrodt Chief Technology Officer Computing and Transportation Business Group BizLink Group 1
p2
© 2026 BizLink Group. All Rights Reserved Confidential Compute power has been growing exponentially One constant across all applications – AI factories need high data rates 2 Robi Rahman and David Owen (2024), "The training compute of notable AI models has been doubling roughly every six months". Pu blished online at epoch.ai. Retrieved from 'https://epoch.ai/data-insights/compute-trend-post-2010' [online resource]. Accessed 10 Oct 2026. Epoch AI, 'Data on machine learning hardware'. Published online at epoch.ai. Retrieved from 'https://epoch.ai/data/machine-learning- hardware' [online resource]. Accessed 10 Oct 2026.
p3
© 2026 BizLink Group. All Rights Reserved Confidential Copper connectivity facing growing challenges 3 „There will always be a place for copper“ (?) • Keeping PAM 4 coding will push Nyquist frequency past 100 GHz • Denser coding tightens SNR requirements • Cable weight and size • Things getting crowded • Need higher density • Require tighter bends • Avoid impeding on airflow • Passive copper for low power consumption • Heat management using liquid cooled connectors
p4
© 2026 BizLink Group. All Rights Reserved Confidential Pushing towards 448G 4 How does the “copper wall” look like PAM 4 PAM 6 PAM 8 Bits / symbol 2 2.585 3 Symbol rate 224GBd 173GBd 150GBd Nyquist frequency 112GHz 87GHz 75GHz SNR vs. PAM 4 0dB -4.4dB -7.4dB Considerations for a copper solution • Keeping PAM 4 coding will push Nyquist frequency past 100 GHz • IL will already be difficult for copper at lower frequencies Denser coding with challenges on its own • Tighter SNR requirements • Increased return loss and cross-talk influence Other constraints making things difficult • Dense packing and tighter bends • Operational environments • Assembly/system margins
p5
© 2026 BizLink Group. All Rights Reserved Confidential One can only improve what one can measure 5 Need a well-defined measurement system to get reliable (reproducible) measurements Sample preparation, e.g. ● Length of stripped wire ● Stripping symmetry Sample installation, e.g. ● Positioning on pads ● Forces of clamps Measurement setup, e.g. ● PCB design and symmetry ● De-embedding Stripped length [mm] 1.0 0.8 0.6 IL @53GHz [dB] -16.4 -15.0 -14.7
p6
© 2026 BizLink Group. All Rights Reserved Confidential Woven flat cables 6 ● Flat configuration: up to 24 high-speed pairs. ● Patented woven design for reduced diameter and increased flexibility. ● Excellent electrical performance due to low strain weaving ● Woven structure improving airflow (no need for lamination) ● Easy to separate in assembly. ● Customization possible (e.g. flat-round-flat) For flexible internal and external high-speed interconnects
p7
© 2026 BizLink Group. All Rights Reserved Confidential Design details of woven flat cables 7 Ethernet and PCIe with parallel pair: ● 26AWG to 34AWG silver plated copper wire with FEP or PE insulation and different foil and taping configurations Combinations with fibre optics, power delivery, and coaxial cables possible Versatility and flexibility Stranded tinned copper wires Enabling tight bends vs. Traditional mesh
p8
© 2026 BizLink Group. All Rights Reserved Confidential Double-helix design ● Fixed, small distance between wires ● Low intrinsic torsion – highly flexible 8 ● Small distance between wires. ● Low dielectric constant εr ● Solid εr > Foamed εr ● “Yarn” solution like extreme foam high εr ● Replacing the wire insulation with thin insulating yarn (e.g. PE, FEP, ePTFE, PP) ● Coupling of signal wires at sweet-spot It’s all about symmetry and dielectric constant How do we improve signal integrity Measured significantly better flexibility
p9
© 2026 BizLink Group. All Rights Reserved Confidential Overcoming bandwidth limitations on cable design Removal of notch effect in 30AWG dual drain Paralink pair with design impedance 92Ω 9 ΔL Taping pitch ΔL [mm] 4.0 1.6 1.0 App. Resonance [GHz] ~25-30 ~62-72
=100 ●Taping pitch causing periodic perturbations ●Notch filter type response at resonance ●Shorter pitch for higher frequencies pushes limits of manufacturability Δ𝑓= 𝑐 2 ⋅𝑑⋅ 𝜀𝑟 Tackling the notch filter
p10
© 2026 BizLink Group. All Rights Reserved Confidential ParaLink cable to 110GHz – de-embedded results 10 ● Enhanced Paralink design ● Showing results for dual drain version with design impedance 92Ω ● Smooth and improved electrical parameters Ready for 448G © 2026 BizLink Group. All Rights Reserved Confidential
p11
© 2026 BizLink Group. All Rights Reserved Confidential Building an ultra-slim cable for up 448G CPC 11 Paralink 39AWG use case with Rosenberger TeraNano ● Need ultra-slim cable to move closer to ASIC ● Working with ● Their small form factor TeraNano 10mm x 18mm for 32 differential pairs Mating height <6mm ● BizLink’s Chip-to-module with OSFP cage and boardside connector Source: PCB routing losses, e.g. Megtron 6 IL ~-35dB/m @20GHz vs. Paralink better than -15dB/m
p12
© 2026 BizLink Group. All Rights Reserved Confidential CPC system performance up to 110GHz 12 No-drain AWG 39 cable with inner jacket. Performance for 448G at PAM4 and PAM6 © 2026 BizLink Group. All Rights Reserved Confidential Custom test fixture Source: Source:
p13
© 2026 BizLink Group. All Rights Reserved Confidential Optical interconnect solutions… Low loss and high-density patch cords with (multi-)fibre connectors 13 ● SM, MM, and PM ● SC, LC, FC, ST, and more ● MTP, MPO, MMC, SN, and more ● Break-/Fan-outs ● Typical MPO and MMC IL<0.1dB MMC patch cord Multiple options
p14
© 2026 BizLink Group. All Rights Reserved Confidential …for NPO and CPO 14 Fibre attach units, shuffle boxes, and alignment Fibre shuffle box Fibre attach units
p15
Dr. Hendrik Coldenstrodt Chief Technology Officer CTBG E-Mail: hendrik_coldenstrodt@bizlinktech.com Contact