PDF 原檔：報告_OCP2026_緯創_負壓兩相水沸騰冷板_20261015_original.pdf
講者公開簡報（OCP 官方 Recorded Content 頁提供下載）。文字以 PyMuPDF 逐頁抽取，
### p<n>為頁碼；圖表內容見原檔。
圖片清單（已驗證 2026-10-19）
| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_緯創_負壓兩相水沸騰冷板_20261015_p2.png |
p2 | 真資料圖 | 最大局部熱點熱通量（W/mm²）2023～2028 趨勢（2025 約 3.3，虛線外推至 2027 年末約 7.5）；晶片尺寸 2026 約 5000 mm²（5.5 倍光罩）、2027 約 8000 mm²（9.5）、2028 約 12000 mm²（14） |
報告_OCP2026_緯創_負壓兩相水沸騰冷板_20261015_p3.png |
p3 | 真資料圖 | 45°C 熱物性比較表：空氣、DLC（PG25）、泵驅兩相 R-515B、泵驅兩相水；水潛熱 2400 kJ/kg、飽和壓力 1.4 psi，R-515B 潛熱 146、126.3 psi |
報告_OCP2026_緯創_負壓兩相水沸騰冷板_20261015_p5.png |
p5 | 真資料圖 | 實驗迴路：冷板（含假熱源）→歧管→散熱器（風扇）→儲槽（接真空裝置）→過濾器→泵→歧管，回冷板，各點裝 P/T 感測 |
報告_OCP2026_緯創_負壓兩相水沸騰冷板_20261015_p6.png |
p6 | 真資料圖 | 單相水 vs 兩相水冷板熱阻（R case, K/W）對流量曲線：2000W、40 cm² 低流量時兩相優 7%；2000W、6.5 cm² 時優 15%；兩相條件入水約 30°C、出口 1.64 psi（飽和 48.3°C） |
報告_OCP2026_緯創_負壓兩相水沸騰冷板_20261015_p7.png |
p7 | 真資料圖 | 冷板熱阻分解：2000W、6.5 cm²、0.8 LPM 下，過冷段 51.8%、沸騰 17.8%、基座 10.5%、TIM 19.9% |
原始內容
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COOLING: COLD PLATE Ken LC Cheng Engineer, Wistron Corporation A Novel Liquid Cooling Solution: A Negative-Pressure Two-Phase Water-Boiling Cold Plate with Enhanced Thermal Performance
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• GPU local heat flux increases exponentially • Chip size increases concurrently, leading to a sharp rise in the amount of coolant required Cooling Demands Continue to Increase ~ 5000 mm2 Size: Year: ~ 8000 mm2 ~ 12000 mm2 2026 2027 2028 14-Reticle 9.5-Reticle 5.5-Reticle Heat Flux (W/mm2)
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Thermal Properties of Negative Pressure Water Boiling • Water latent heat depends on operating pressure (saturation temperature), but remains an order of magnitude higher than typical refrigerants.
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Characteristics of Negative Pressure Water Boiling • Water-Based Two-Phase Cooling combines the high cooling performance of phase-change heat transfer with the low cost, high sustainability, and infrastructure compatibility of water.
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Experimental Setup • The large temperature difference available during water vapor condensation creates the possibility of rejecting heat directly to ambient air under certain operating conditions.
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Thermal Performance Comparison * Two-phase water cooling (P2P) • T_inlet ≒ 30ºC • P_outlet ≒ 1.64 psi (saturation T = 48.3ºC) * Single-phase water cooling (P1P) • T_inlet ≒ 30ºC • P_outlet ≒ 15.3 psi Boundary Conditions Performance improved by 15% Performance improved by 7%
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Cold Plate Thermal Resistance • The thermal resistance is decomposed into several components
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Key Advantages Intrinsic Leak-Safe Operation Because the system operates below atmospheric pressure, a breach tends to draw air into the loop rather than forcing coolant outward Reduced Coolant Flow and Pumping Energy By utilizing water's latent heat of vaporization, large amounts of heat can be transported with lower coolant flow rates and potentially reduced pumping requirements Water-Based, Sustainable, and Infrastructure-Friendly Water offers low cost, broad availability, environmental sustainability, and compatibility with existing liquid-cooling ecosystems
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Potential Applications • Distributed AI Infrastructure Negative-pressure water-boiling cooling is particularly attractive for distributed AI infrastructure, where cooling efficiency, pumping power, leakage risk, and infrastructure simplicity are often more critical than in hyperscale data centers. →→→ Smaller Cooling Loops / Higher Energy Efficiency / Simpler Infrastructure
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• Current Challenges Pressure-Sensitive System Behavior Sub-atmospheric water boiling systems are sensitive to pressure variations, which directly affect saturation temperature and boiling performance Scalability to Large Cooling Networks As the number of cooled devices increases, pressure drop, flow distribution, and system control become increasingly challenging, potentially requiring multiple cooling loops Technology Maturity Further validation is needed for long-term reliability, pressure control strategies, startup/shutdown operation, and large-scale deployment • Future Opportunities High Cooling Performance at Low Flow Rate • Supporting future multi-kW AI processors • Enabling ultra-high heat flux cooling closer to silicon • Lowering coolant flow requirements and pumping energy • Providing an leak-safe path toward next-generation cooling architectures Challenges and Future Opportunities
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• Negative-pressure water-boiling cooling offers: • A potential path beyond conventional single-phase cooling • Improved Energy Efficiency • Intrinsic Leak-Safe Operation • We welcome collaboration on: • AI/HPC server platforms • Cold plate development • Reliability validation • System integration Exploring the Future of AI Cooling Together Let’s Connect: Ken_LC_Cheng@wistron.com
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Thank You!