PDF 原檔：報告_OCP2026_AyarLabs_緯穎_機櫃級高功率ELSFP_20261015_original.pdf
講者公開簡報（OCP 官方 Recorded Content 頁提供下載）。文字以 PyMuPDF 逐頁抽取，
### p<n>為頁碼；圖表內容見原檔。
圖片清單（已驗證 2026-10-19）
| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_AyarLabs_緯穎_機櫃級高功率ELSFP_20261015_p2.png |
p2 | 真資料圖 | 從機櫃到 ELSFP 分工圖：緯穎提供 L11 液冷機櫃、L10 液冷運算托盤、冷板；Ayar Labs 提供 ELSFP＋光引擎（8 通道 × 23 dBm、主動 TEC、多供應商雷射晶粒） |
報告_OCP2026_AyarLabs_緯穎_機櫃級高功率ELSFP_20261015_p5.png |
p5 | 真資料圖 | 100 多顆 ELSFP 在 −20 dB 背反射下的分布直方圖：平均輸出 23.4 dBm、SMSR 53 dB、線寬 0.16 MHz、平均 RIN −158 dB/Hz，與規格線對照 |
報告_OCP2026_AyarLabs_緯穎_機櫃級高功率ELSFP_20261015_p6.png |
p6 | 真資料圖 | ELSFP 冷板：彈簧片加耐用 TIM、上下兩層冷板在 1OU 高度內容納 20 個背對背 ELSFP，進出水口剖面圖 |
報告_OCP2026_AyarLabs_緯穎_機櫃級高功率ELSFP_20261015_p8.png |
p8 | 真資料圖 | 20 顆 ELSFP 熱驗證：雷射晶粒溫度 50±1°C，冷卻液 45°C、1.3 LPM，附逐顆溫度與功率差折線／長條圖與測試台照片 |
原始內容
p1
Rack-Ready High-Power ELSFPs A Co-Development to Support CPO Deployment in AI Scale-Up and Scale-Out Datacenters Nandita Aggarwal Sr. Manager, Laser Engineering, Ayar Labs Willie Chen Technical Supervisor, Wiwynn
p2
From liquid-cooled rack to ELSFP L11 rack Wiwynn Liquid-cooled rack housing the compute trays L10 tray Wiwynn Liquid-cooled compute tray hosting CPO and front-panel ELSFP slots Parallel-flow manifold serving multiple ELSFP modules; flexible TIM ELSFP + Optical Engine Ayar Labs 8 × 23 dBm channels, active TEC control, multi-vendor laser die ● Wiwynn defined the boundary conditions (Coolant flow, coolant temp, pressure, splits in the cooling architecture, thermal resistance stack up etc) ● Ayar Labs designed the laser solution using those boundary conditions Cold plate Wiwynn
p3
Co-optimized module thermals • Active TEC inside the ELSFP holds every laser at its set point • Joint Ayar Labs / Wiwynn CFD (Computational Fluid Dynamics) and simulation across plate + module • Surface temperature non-uniformity cut by >3x • Uniform surface → lower TEC power, longer lifetime and higher predictability
p4
100+ ELSFPs tested ● Ayar Labs designed ELSFPs were tested in Wiwynn’s cold plate ● Test conditions: ○ 50 oC laser die temperature ○ -20dB back reflection ○ All lasers ON 8 × 23 dBm channels per module 45 °C coolant inlet -20dB OBR optical back reflection to the system 100+ Modules characterized
p5
Distributions over 100+ ELSFPs, with -20dB OBR 23.4 dBm mean output power · σ 0.32 dB 53 dB mean SMSR · σ 1.5 dB 0.16 MHz mean linewidth · σ 0.04 MHz −158 dB/Hz mean average RIN · σ 0.8 dB/Hz Every laser meets spec with margin. SMSR >47 dB (spec >40 dB), linewidth <0.37 MHz (spec <1 MHz), RIN <−154 dB/Hz (spec <−150 dB/Hz), all measured at 50 °C die temperature with −20 dB back-reflection. Representative RIN spectrum, single channel: stays below −150 dB/Hz up to 26.5 GHz
p6
Cold plate designed for a pluggable ELSFP Uniform surface temperature profile Same surface temperature profile across all the 20 ELSFPs with ~45°C inlet coolant Resilient TIM on a metal spring sheet Tested for 100s of repeated insertions without any TIM wear-out; no re-application in the field Compact design for high density systems Cooling 20 belly-to-belly ELSFPs within 1OU height ELSFP Cold Plate : Resilient TIM Spring Sheet Copper Plate 1OU inlet outlet Top side cold plate Bottom side cold plate Belly-to-belly ELSFP ports < Rear view >
p7
Two design challenges: thermal contact and hot spots 1. Thermal contact through a cage opening Challenge: The ELSFP cage limits the contact area, and the soft TIM could be damaged during ELSFP insertion Solution: A graphite resilient TIM supported by a beryllium-copper spring sheet, pressed against the copper plate 2. Heat builds up at the centre of the plate Challenge: With uniform fin gap, the middle ELSFPs ran hotter, resulting in a surface temperature variation of 2.9 °C across the cold plate Solution: Localized fin gaps redistribute the flow, dropping the temperature variation to 0.8 °C ELSFP Spring Sheet < Side View Cross Section > Resilient TIM Cold Plate ELSFP Cage Uniform fins (left) vs Localized fins (right) Low High Medium Medium Heat accumulation Implement localized fin pitch Uniform Temperature Distribution ELSFPs ELSFPs Liquid Channel
p8
Thermal validation result across 20 ELSFPs 50 ±1 °C Laser die temperature, all 20 ELSFPs 45°C, 1.3 LPM Coolant supply temperature and flow rate Top-side ELSFPs shown; bottom side follows the same pattern. Better cold-plate flatness will reduce surface variation further.
p9
Takeaways for the SROI community Serviceable by design Front-pluggable ELSFP with highly repeatable behavior due to clever thermal & TIM design Thermally co-designed Wiwynn cold plate + Ayar Labs ELSFP: ≤0.8 °C non- uniformity at 45°C inlet By the numbers statistics 23 dBm class, σ ≈ 0.3 dB across , >150dB/Hz RIN, sub-MHz LW, >40dB SMSR, >100 ELSFP modules Let’s align Open to working with OCP on ELSFP thermal interface and cold-plate requirements
p10
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