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報告_OCP2026_Amphenol_FIT_立訊_TE_400G每通道光模組連接器_20261015

PDF 原檔:報告_OCP2026_Amphenol_FIT_立訊_TE_400G每通道光模組連接器_20261015_original.pdf

講者公開簡報(OCP 官方 Recorded Content 頁提供下載)。文字以 PyMuPDF 逐頁抽取,### p<n> 為頁碼;圖表內容見原檔。

圖片清單(已驗證 2026-10-19)

檔名 頁 分類 親眼所見內容
報告_OCP2026_Amphenol_FIT_立訊_TE_400G每通道光模組連接器_20261015_p5.png p5 真資料圖 Amphenol Introducing XPO:64 高速通道、電氣熱插拔、單一 48V 電源、整合液冷、MPO-16 相容、線性模組 <90W;附模組爆炸圖
報告_OCP2026_Amphenol_FIT_立訊_TE_400G每通道光模組連接器_20261015_p7.png p7 真資料圖 Amphenol 量測:XPO vs OSFP1600 介面頻寬(SDD21 插損與 SDD11 回波損耗,0~100GHz);XPO 在 70GHz 以上插損衰減較 OSFP1600 平緩
報告_OCP2026_Amphenol_FIT_立訊_TE_400G每通道光模組連接器_20261015_p10.png p10 真資料圖 Pluggable IO 介面插損世代比較(10G 到 224G 範例與 XPO 448G);XPO 448G 曲線至約 120GHz 仍在 -2dB 內
報告_OCP2026_Amphenol_FIT_立訊_TE_400G每通道光模組連接器_20261015_p22.png p22 真資料圖 立訊 Luxshare-Tech 448G 被動通道零件:OPTAMAX 雙軸纜(92ohm,31AWG 損耗 6.6/10.0/19.0 dB/m @26.56/56/110GHz)、KOOLIO CPC、NEXUS 纜線背板(樣品)、OSFP 448G Airchannel(樣品)
報告_OCP2026_Amphenol_FIT_立訊_TE_400G每通道光模組連接器_20261015_p32.png p32 真資料圖 TE AdrenaLINE MegaLane 模組應用:可擴 x8/x16/x32/x64、電源與高速隔離、上中下冷板(4/8/4mm)夾兩個模組的剖面
報告_OCP2026_Amphenol_FIT_立訊_TE_400G每通道光模組連接器_20261015_p33.png p33 真資料圖 TE MegaLane SI 效能:差分阻抗約 92ohm、回波損耗、插損(至約 120GHz 以內平坦)、FEXT/NEXT 串擾;註明含 0.5mm 走線、模組卡墊、連接器與 2mm 纜線,非已授權 OCP 規格貢獻

原始內容

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400 G/Lane Optics Module Connectors Lightning Talks

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Sam Kocsis Director of Standards and Technology Amphenol 400G XPO Optics

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• Beyond 200G Pluggable Optics • Introducing XPO • The 448G Frontier • Re-Introducing XPO Overview

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Beyond 200G Pluggable Optics Primary implementation bottlenecks beyond 224G: 1. ASIC Package, BGA Breakout performance 2. Pluggable IO performance

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Introducing XPO • 64 high-speed lanes • Electrically hot-pluggable • Single 48V power supply • Integrated liquid cooling • MPO-16 compatible interfaces • Less than 90W (Linear Module)

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XPO Advancing Architectures Advantages of CPO Goals of XPO Best channel Reach (Optical) Density Better C2M channel Supports all optical technologies Matched faceplate density

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XPO Performance

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The 448G Frontier IO Bandwidth drives Modulation Like XPO, Innovation expected at 448G!

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Re-Introducing XPO • Reuse mechanical/thermal infrastructure • Preserve card edge interface • Tighten tolerance loops • Further reduce the pad pitch • Offset high-speed lanes to limit crosstalk • XPO @448G?

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The 448G Frontier and XPO

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• 448G IO is going to be challenging • One solution may not fit all • 448G solutions needed for PAM-6 …and PAM-4 • Where to find additional information (URL links) • IEEE 802.3dv | https://www.ieee802.org/3/dv/ • OIF | https://www.oiforum.com/ • XPO MSA | https://xpomsa.com/ • Amphenol | https://www.amphenol-cs.com/ Call to Action

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Terry Little Sr. Development Engineering Manager Foxconn Interconnect Technology XPO (eXtra Dense Pluggable Optics): Fast-forward to 448 Gbps

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XPO (eXtra-dense Pluggable Optics) Introduction Today, we are proud to introduce our XPO (eXtra-dense Pluggable Optics) platform—a fully integrated, high-density “pluggable” connectivity architecture. We will discuss a scalable path forward from today’s 224 Gbps solutions, to the next-generation 448 Gbps AI and high- performance computing systems. I would like to acknowledge the leadership and vision of Andy Bechtolsheim, Co-founder and Chief Architect of Arista Networks, and the contributions of the XPO MSA member companies in advancing the next generation of high-density optical interconnect technology. Key highlights include: • High-density “Card-edge” connector for next-generation AI infrastructure, thus keeping the same existing XPO connector form factor. • Builds upon the proven 224 Gbps architecture to provide a scalable path to 448 Gbs.

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Fast-forward to 448 Gbps XPO

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XPO “Fast-forward” to 448 Gbps Traditional 224G “Cantilever Beam” Contact Geometry The New 448G XPO system connector Objectives: The mechanical objective is to maintain the same XPO “Card-Edge” Form Factor. (0.56mm pitch) The electrical objective is to minimize undesirable stub effects at high frequencies. High-speed interfaces are sensitive to: •Stub length •Impedance discontinuities •Reflection-induced insertion loss • Traditional “Cantilever Beam Contact Geometry produces un-desirable IL “roll-off” at high frequency.

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XPO Card-edge 448G Simulation Results--Differential Impedance Cable Cable Solder AIC Mating Mating Mating impedance mating Cable solder 224G 81.93Ω 85.04Ω 448G 89.00Ω 92.00Ω 224G XPO 448G XPO

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Assuming 448 Gb/s per electrical lane and ignoring FEC/encoding overhead: For a practical PAM6 implementation using 5 bits encoded across 2 PAM6 symbols—2.5 bits/symbol: • Symbol rate: 448 ÷ 2.5 = 179.2 GBd • Nyquist frequency: 179.2 ÷ 2 = 89.6 GHz So, the anticipated targets are approximately: • 448G PAM4: 112 GHz • 448G PAM6: 87–90 GHz • Actual baud rate and Nyquist frequency will be slightly higher when line-coding or FEC overhead is included. XPO Card-edge 448G Simulation Results--Differential Insertion Loss 224G XPO 448G XPO

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Diff5/11 Diff6/12 Diff1/7 Diff2/8 Diff3/9 Diff4/10 XPO Card-edge 448G Simulation Results--Differential Return Loss 224G XPO 448G XPO Assuming 448 Gb/s per electrical lane and ignoring FEC/encoding overhead: For a practical PAM6 implementation using 5 bits encoded across 2 PAM6 symbols—2.5 bits/symbol: • Symbol rate: 448 ÷ 2.5 = 179.2 GBd • Nyquist frequency: 179.2 ÷ 2 = 89.6 GHz So, the anticipated targets are approximately: • 448G PAM4: 112 GHz • 448G PAM6: 87–90 GHz • Actual baud rate and Nyquist frequency will be slightly higher when line-coding or FEC overhead is included.

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XPO Card-edge 448G Simulation Results—SCD21 • SCD21:448G XPO Rev.A1 delivers the optimal performance. 224G XPO 448G XPO

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448G XPO Path-forward is critical 448G solutions are needed to support both PAM-6 and PAM-4 modulations Additional information: XPO MSA | https://xpomsa.com/ IEEE 802.3dv | https://www.ieee802.org/3/dv/ FIT | https://www.fit-foxconn.com/ Call to Action

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Robbie Xu Head of US Sales and Marketing, Luxshare-Tech Luxshare-Tech 448G CPC, Backplane and IO

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448G Passive Channel Building Blocks End to End interconnect KOOLIO CPC: Bandwidth support of 448G PAM4 (Ready) - Pushing the boundaries of ongoing innovation • Full ecosystem continuity: Supports pluggable IO and high-speed backplane architectures • 0 stub, 360-degree shielding, industry highest density • mSAP/substrate capable, bandwidth 100GHz+ OSFP 448G Airchannel (Sample) OSFP-like size interface, pluggable module • Leverage Backplane technology, bandwidth>100GHz • Support Both Passive and Active module OPTAMAX 448G Twinax (Ready) Frequency (GHz) 31 AWG Loss (dB / m) 26.56 6.6 56 10.0 110 19.0 • 92ohm ,Bandwidth >100GHz ,Drainless & Drian optional • Insertion loss & Bending Performance:Leading the industry 31AWG 2m measurement data 448G KOOLIO CPC measurement Results NEXUS 448G Cable Backplane (Sample) Unique mating interface, robust mechanical design 448G NEXUS Cable Backplane Simulation Result • 92ohm, Bandwidth >100GHz ,cable to cable interconnect • Coaxial-like structure, fully shielding and Surface Contact Mating 448G OSFP Airchannel Simulation Result

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448G Channel Simulation 1m 27awg 300mm 31awg 300mm 31awg Simulated Channel The CPC to IO to CPC loss is ~28dB at 106GHz  For a total of 1.6m of twin-ax ( 2 x 300mm 31awg CPC to IO cable + 1m 27awg IO to IO cable), excluding substrate losses Return loss is under -15dB at 98GHz Crosstalk is generally kept below the 60dB level -15dB@90GHz

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448G CPC to Backplane to CPC Measurement • Clean response out to 90GHz • No resonance until just at 110GHz • Cleared manufacturing process issues Twinax Test Fixture 330mm 31awg Twinax Mated VH-VR Conn Twinax Test Fixture 940mm 27awg Twinax Mated VR-VH Conn 330mm 31awg Twinax

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448G CPC Form Factor and Configurations 8p2c Configuration 8p6c Configuration 17.84mm 6.66mm 9.75mm 8p8c Configuration 17.84mm 13.46mm 13.55mm 17.84mm 16.98mm 15.45mm

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448G Backplane Enables 448G Cable Cartridge 10 20 30 40 50 60 70 80 90 100 110 0 120 -9 -8 -7 -6 -5 -4 -3 -2 -1 -10 0 freq, GHz dB SDD21 NEXUS 448G 27AWG~31AWG Cabled VH-VR solution Frequency IL 53GHz -0.8dB 90GHz -1.8dB Vertical Header (Cartridge) Vertical Receptacle (to CPC) -80dB@0~120GHz 10 20 30 40 50 60 70 80 90 100 110 0 120 -120 -100 -80 -60 -40 -20 -140 0 freq, GHz dB PSXT -15dB@78GHz -10dB@100GHz

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448G HSIO OSFP with Innovative BP Interface SI frequency beyond 110GHz 448G RAF (8pair*2 Row) Mated Plug-Receptacle Pluggable Module Sample Pluggable Module Receptacle Sample

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Summary and Call to Action • Improvements to the Luxshare CPC-448G design and manufacturing process have made significant SI performance • Clean response up to the observable 110GHz bandwidth • First sample of BP and HSIO Connection (31awg-27awg) • Results are promising showing channel nearly capable of 110GHz • Also working on cable-to-PCB right-angle connector variant • What are your thoughts/preferences on • 92ohm vs 85ohm • So far, we have both 92ohm and 85ohm move in parallel • Industry and Eco-system needs to define the mainstream impedance when 448G system design kicks off • 448G PAM-6 vs 448G PAM-4 • Link to Luxshare-Tech Technologies and Contact • https://en.luxshare-tech.com • robbie.xu@luxshare-ict.com

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Matthew Ho Principal System Architect, TE Connectivity 400G/Lane Optics Module Connectors OCP SPECIAL FOCUS: PHOTONICS

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• Existing OSFP lacks a clear path to 448G • Challenges of 448G IO o Suitable electrical interface at 448G PAM4 o Scalable form factor o Supports cabled host Motivation

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• Novel stubless interface • Cabled host twinax lands at footprint • Fully shielded pairs at the module AdrenaLINE MegaLane – Mating Interface Mated Interface Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification.

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• Scalable interface (x8/x16/x32/x64) • Power isolated from high speeds • Dual sided cold plates AdrenaLINE MegaLane – Module Application Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification.

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AdrenaLINE MegaLane - SI Performance Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification.

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• Tell us your form factor preference (x8/x16/x32/x64) • North Star: 448G PAM4 Performance • TE's MegaLane shows credible path with sim and measured data • Read about USFP adopting TE MegaLane • https://nvidianews.nvidia.com/news/nvidia-and-cisco-introduce- new-pluggable-optics-form-factor-to-scale-ai-factories • Get to know MegaLane more in depth • TE Contact: matthew.ho2@te.com Call to Action TE Connectivity, TE, TE (logo), TE connectivity (logo), and AdrenaLINE MegaLane are trademarks.

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Thank You!