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報告_UBS_ASIC與CPU產業_20260922

更新 2026-09-24

PDF 原檔:報告_UBS_ASIC與CPU產業_20260922_original.pdf

圖片清單(已驗證 2026-09-24)

檔名 size 分類 親眼所見內容
報告_UBS_ASIC與CPU產業_20260922_001.png 22.3KB 真資料圖 Figure 9:Industry CoWoS capacity 柱狀圖,Q123-Q427E 逐季,2027 年底達約 270kwpm
報告_UBS_ASIC與CPU產業_20260922_002.png 25.4KB 真資料圖 Figure 10:TSMC vs. non-TSMC CoWoS capacity 雙柱對比圖,Q123-Q427E,non-TSMC(ASE/Amkor)占比逐季提升
報告_UBS_ASIC與CPU產業_20260922_003.png 29.3KB 真資料圖 Figure 11:Industry CoWoS capacity vs. Nvidia's volume 雙柱對比圖,Q123-Q427E
報告_UBS_ASIC與CPU產業_20260922_004.png 17.2KB 真資料圖 Figure 12:CoWoS demand from major customers 堆疊柱狀圖(Nvidia/AMD/Google TPU-Broadcom/Google TPU-MediaTek/Amazon Trainium-Alchip/Amazon Trainium-Marvell/Meta/OpenAI/Microsoft/Others),2023-2027E
報告_UBS_ASIC與CPU產業_20260922_005.png 24.3KB 真資料圖 Figure 14:N3 demand by Cloud AI vs. smartphones/PCs 堆疊柱狀圖+TSMC's N3 capacity 折線,Q126-Q427E,Cloud AI 占比持續上升
報告_UBS_ASIC與CPU產業_20260922_006.png 24.1KB 真資料圖 Figure 15:N3 capacity share by client in 2026E 圓餅圖(Apple 38%/Nvidia 11%/Broadcom 11%/Qualcomm 7%/Intel 7%/MediaTek 3%/Others 23%)
報告_UBS_ASIC與CPU產業_20260922_007.png 24.7KB 真資料圖 Figure 16:N3 capacity share by client in 2027E 圓餅圖(Nvidia 30%/Broadcom 17%/Apple 14%/MediaTek 6%/Intel 3%/Qualcomm 2%/Others 28%),Cloud AI(Nvidia/Broadcom/MediaTek)占比較 2026E 明顯提升
報告_UBS_ASIC與CPU產業_20260922_008.png 42.2KB 真資料圖 Figure 21:GPTC's 12M forward PE band 折線圖,Dec-14~Aug-26,Average=16.6x/+1std=24.9x/-1std=8.3x;2026 中股價本益比高點近 50x

原始內容

UBS Global I/O Semiconductors

ASICs and CPUs move to center stage, driving the next wave o CoWoS expansion

Stronger and diversifying CoWoS capacity expansion in 2027-2

Following UBS Taiwan Summit (Day 1, Day 2&3) and our CoWoS industry analysis, we are urther raising CoWoS industry capacity to 270kwpm rom 260kwpm end-2027E, up rom 160kwpm end-2026E. Current visibility suggests requirement or urther CoWoS capacity expansion in 2028, even with Intel's EMIB-T and TSMC's CoPoS ramping or large package AI accelerator in 2028-29. We believe the trend re lects more robust Cloud AI chip demand, especially rom CPUs and ASICs, which we think should mostly stay at CoWoS in 2028-29. The migration toward larger package with heterogenous integration also consumes a lot more capacity. Meanwhile, CoWoS supply continues to diversi y, thanks to improving capabilities o OSATs and larger capacity requirement. For CoW, we view ASE's expansion to be more aggressive to reach 70kwpm capacity end o 2027E rom 20kwpm end o 2026E, vs TSMC / Amkor's CoW capacity at 180kwpm / 20kwpm end o 2027E. For WoS, as we recently highlighted, TSMC could introduce a new OSAT partner or mass production in 2028 on top o its collaboration with ASE.

ASIC efforts bearing fruit

A ter several years o investment, the large hyperscalers and AI natives are making solid progress on custom silicon or accelerator and CPU into 2027. On accelerator, Microso t's Maia 300 per ormance appears to be competitive, and we estimate Maia 200/300 units o 50/350k in 2027, up rom ~100k o total Maias in 2026. OpenAI's Jalapeño may also ramp to 600-700k units in 2027E rom 150k in 2026E. Meta's MTIA also targets higher volume to ~450k units in 2027, although visibility seems lower than Microso t and OpenAI. Large projects such as Google TPUs and Amazon Trainium are on track to reach our estimates o 9m / 3.2m packages in 2027 rom 4.1m / 2.5m in 2026E.

Upside to Nvidia and AMD's demand

We raise Nvidia's AI GPU production units in 2027 rom 8.2m to 8.8m with higher Rubin estimates and ~200k Rubin CPX units. Rubin Ultra with similar package architecture and HBM de-spec may ramp more smoothly and quickly rom mid 2027. We li t AMD's CoWoS demand in 2027E by 11% to actor in more robust ramp o the Venice server CPU, which may reach 5mn in 2027E vs our prior estimate o 4mn. We keep AMD's accelerator units at 1.9mn or 2027E due to tight supply.

Stock recommendations

Along the semiconductor supply chain or Cloud AI, our top picks are TSMC (the industry's leading Cloud AI oundry), MediaTek (design services or Google TPU with new ASIC opportunity; Key Call Buy), and ASE (advanced packaging & testing). We estimate backend, including advanced packaging, to reach ~12%/16% o TSMC sales in 2026/27E. TSMC's advanced packaging sales should sustain ~50% CAGR growth in 2026-30E even with Intel's EMIB competition. Critical equipment suppliers or advanced packaging & testing could also bene it rom aster CoWoS expansion and the trend toward larger and more complicated package structure, and we like All Ring, GPTC, Chroma, Hon Precision, and ASMPT. We lower our price target or GPTC rom NT $5,000 to NT$4,300, based on the same 33x average 2027-28E PE. We lower our GPTC EPS estimates by 25%/21%/8% in 2026/27/28E as we actor in lower tool unit or sales recognition in 2026 and lower ASP assumption. Maintain Buy as we believe GPTC will be a key bene iciary o advanced packaging capacity expansion. We like Aspeed or its strong BMC outlook, and Alchip or its Amazon Trainium3 and Trainium4 opportunities.

Equities

Asia

Semiconductors

Sunny Lin

Analyst

sunny.lin@ubs.com +886-2-8722 7346

Randy Abrams

Analyst

randy.abrams@ubs.com +886-2-8722 7338

Nicolas Gaudois

Analyst

nicolas.gaudois@ubs.com +65-6495 5148

Timothy Arcuri

Analyst

timothy.arcuri@ubs.com

+1-415-352 5676

Jerry Su

Analyst jerry.su@ubs.com +886-28-722 7306

Ryan Sun

Analyst

ryan-za.sun@ubs.com +886-2-8722 7267

Christine Chen, CFA Associate Analyst christine.chen@ubs.com

+886-2-8722 7352

Shingo Hirata, CFA Analyst

shingo.hirata@ubs.com +81-3-5208 6224

Diana Chang

Analyst

diana.chang@ubs.com +886-2-8722 7335

Jimmy Yoon

Analyst

jimmy.yoon@ubs.com +65-6495 4617

Figure 1: Valuation comparison

Company name Ticker Rating Market cap (US$m) Price target (LC) Share price (LC) EPS growth (%) - 2026E EPS growth (%) - 2027E P/E (x) - 2026E P/E (x) - 2027E P/BV (x) - 2026E P/BV (x) - 2027E ROE (%) - 2026E ROE (%) - 2027E Dividend yield (%) - 2026E Dividend yield (%) - 2027E
Foundry
TSMC 2330.TW Buy 2,004,651 3,650 2,460 64.5 36.9 22.6 16.5 8.4 6.1 43.4 42.7 0.9 1.2
Fabless
Alchip 3661.TW Buy 9,048 6,600 3,540 130.9 38.3 22.1 16.0 4.4 3.7 24.4 25.3 1.0 0.9
Aspeed 5274.TWO Buy 22,915 22,000 19,290 81.8 73.9 102.1 58.7 65.5 39.8 77.5 84.3 0.4 0.7
GUC 3443.TW Buy 30,096 6,700 7,150 106.2 86.3 123.3 66.2 53.1 32.8 50.2 61.4 0.2 0.3
MediaTek 2454.TW Buy 237,389 6,500 4,710 2.2 168.4 69.7 26.0 16.9 13.0 25.5 56.5 1.1 1.1
Semi-backend
ASE 3711.TW Buy 89,175 835 638 102.4 63.8 33.7 20.5 6.4 5.4 21.2 28.5 1.0 1.9
KYEC 2449.TW Buy 11,200 325 292 40.5 61.9 31.9 19.7 5.8 4.9 19.9 26.9 2.0 2.0
Equipment
All Ring 6187.TWO Buy 3,831 1,700 1,250 98.6 57.4 41.2 26.2 13.1 10.2 35.6 43.9 0.9 1.7
ASMPT 0522.HK Buy 8,882 200 168 97.3 47.7 33.4 22.6 3.8 3.5 11.8 16.0 0.8 1.6
Chroma ATE 2360.TW Buy 30,616 2,960 2,290 63.6 37.5 50.5 36.7 27.9 20.3 57.6 64.0 0.4 0.9
GPTC 3131.TWO Buy 2,245 4,300 2,445 29.6 66.7 41.5 24.9 25.8 16.1 45.5 79.6 1.9 1.7
Hon Precision 7769.TW Buy 36,978 10,000 6,540 71.1 85.5 50.1 27.0 16.0 11.7 35.8 50.1 0.8 1.4

Source: LSEG, UBS estimates. Note: Priced as o 18 Sept 2026.

Figure 2: Total CoWoS interposer wafer demand

Interposer Wafer Demand (kps) Q126 Q226 Q326E Q426E Q127E Q227E Q327E Q427E 2024 2025 2026E 2027E
Nvidia 128 154 231 286 274 300 342 374 174 444 799 1,290
AMD 11 11 30 77 91 122 124 138 37 42 129 475
ASICs and others 79 98 106 110 173 216 233 242 147 193 393 865
Google TPU - Broadcom 60 76 195 338
Google TPU - MediaTek 0 0 21 182
Amazon Trainium - Alchip 26 5 71 131
Amazon Trainium - Marvell 17 38 21 3
Meta 7 8 9 41
OpenAI 0 0 8 70
Microsoft 1 1 7 29
Others 37 65 62 72
Total 218 264 367 473 538 637 700 755 358 679 1,321 2,630

Source: Company data, UBS estimates

Figure 3: Breakdown of CoWoS demand

ASIC vendor as a % of CoWoS wafers demand 2024 2025 2026E 2027E
Google 17% 11% 16% 20%
Broadcom 17% 11% 15% 13%
MediaTek 0% 0% 2% 7%
Amazon 12% 6% 7% 5%
Alchip 7% 1% 5% 5%
Marvell 5% 6% 2% 0%
Meta 2% 1% 1% 2%
Intel / Habana 2% 1% 0% 0%
Microsoft 0% 0% 1% 1%
OpenAI 0% 0% 1% 3%
Tesla 0% 0% 0% 0%
Others 8% 9% 5% 3%
Total ASIC 41% 28% 30% 33%
GPU vendors as a % of CoWoS wafers demand
Nvidia 49% 65% 60% 49%
AMD 10% 6% 10% 18%
Total GPU 59% 72% 70% 67%
Total 100% 100% 100% 100%

Source: Company data, UBS estimates

Figure 4: Nvidia's supply chain build units

Nvidia Supply Chain Build Units (k chips) Q126 Q226 Q326E Q426E Q127E Q227E Q327E Q427E 2024 2025 2026E 2027E
Ampere 0 0 0 0 0 0 0 0 134 0 0 0
Hopper 180 251 215 100 0 0 0 0 4,086 1,402 747 0
Blackwell B200/B300 and GB200/GB300 1,703 1,855 1,715 953 350 111 81 0 314 5,520 6,225 542
Rubin R200 and VR200 0 70 678 1,399 1,676 1,814 1,497 844 0 0 2,148 5,832
Rubin R300 and VR300 0 0 0 0 0 137 639 1,416 0 0 0 2,193
Rubin CPX 0 0 0 26 61 71 40 45 0 0 26 217
Vera CPU 0 100 428 1,054 1,025 1,180 1,543 1,754 0 0 1,582 5,502
Total 1,883 2,276 3,036 3,532 3,112 3,313 3,800 4,060 4,534 6,921 10,728 14,286

Source: Company data, UBS estimates

Figure 5: AMD's supply chain build units

AMD Supply Chain Build Units (k chips) Q126 Q226 Q326E Q426E Q127E Q227E Q327E Q427E 2024 2025 2026E 2027E
MI300 + MI325X + MI308X+MI355X 163 170 87 89 93 82 15 4 544 626 510 194
MI400 0 0 38 225 295 433 415 369 0 0 263 1,510
MI500 0 0 0 0 0 0 66 177 0 0 0 242
Venice CPU 0 0 400 900 1,000 1,300 1,300 1,400 0 0 1,300 5,000
Others 1 1 1 2 2 3 3 4 11 4 6 13
Total 164 171 526 1,217 1,390 1,817 1,799 1,954 555 630 2,079 6,960

Source: Company data, UBS estimates

Figure 6: ASIC's supply chain build units

ASIC Supply Chain Build Units (k chips) 2024 2025 2026E 2027E
Google TPU - Broadcom 2,045 2,565 3,680 5,000
Google TPU - MediaTek 0 0 467 4,000
Amazon Trainium - Alchip 1,000 176 1,780 3,080
Amazon Trainium - Marvell 600 1,335 686 85
Meta 348 421 165 445
Microsoft 26 34 104 400
OpenAI 0 0 150 650
Others 251 188 64 0
Total 4,270 4,719 7,096 13,660

Source: Company data, UBS estimates. Note: Others include Intel's Habana, Tesla's Dojo, etc.

Figure 7: SoIC volume

SoIC (kps) Q126 Q226 Q326E Q426E Q127E Q227E Q327E Q427E 2024 2025 2026E 2027E
SoIC volume 14 17 23 29 44 52 57 61 20 42 83 214

Source: Company data, UBS estimates

Figure : TSMC's back-end sales analysis

TSMC's backend sales (US$m) Q126 Q226 Q326E Q426E Q127E Q227E Q327E Q427E 2024 2025 2026E 2027E
Sales from adv packaging 2,704 3,247 4,437 5,766 6,295 7,462 8,347 9,258 5,240 8,899 16,154 31,362
Sales from bumping & testing 919 1,019 1,162 1,278 1,329 1,462 1,609 1,705 2,348 3,156 4,379 6,105
Total TSMC's backend sales 3,623 4,266 5,599 7,044 7,624 8,924 9,956 10,963 7,588 12,056 20,533 37,467
% of TSMC's sales 10.1% 10.6% 12.3% 14.0% 14.6% 15.5% 15.7% 16.3% 8.4% 9.8% 11.9% 15.6%

Source: Company data, UBS estimates

Figure 9: Industry CoWoS capacity

報告_UBS_ASIC與CPU產業_20260922_001

Source: Company data, UBS estimates

Figure 10: TSMC vs. non-TSMC CoWoS capacity

Source: Company data, UBS estimates. Note: Non-TSMC CoWoS capacity includes ASE and Amkor.

Figure 11: Industry CoWoS capacity vs. Nvidia's volume

Source: Company data, UBS estimates

Figure 13: N3 supply & demand analysis

Client Products Die size (mm2) N3 - Q126E N3 - Q226E N3 - Q326E N3 - Q426E N3 - 2026 demand (k) capacity N3 - Q127E requirement N3 - Q227E (kwpm) N3 - Q327E N3 - Q427E N3 - 2027 demand (k)
Nvidia Rubin 1,628 0 2 15 31 141 37 40 33 19 384
Rubin Ultra 1,628 0 0 0 0 0 0 4 16 36 169
Vera CPU 800 0 1 5 11 51 11 13 17 19 178
Broadcom Google - TPU v7 Ironwood 1,400 6 11 16 21 158 14 8 6 0 85
Google - TPU v8i 1,400 0 0 2 4 18 7 17 25 35 250
Meta - MTIA v3 1,600 0 1 1 2 11 2 2 3 3 29
OpenAI 1,600 0 0 0 3 10 3 3 3 3 32
AMD MI355 840 2 2 1 1 17 1 1 0 0 7
Alchip Amazon - Trainium 3 1,600 0 4 12 23 115 24 18 12 6 181
Marvell Amazon - Trainium 2.5 1,600 0 0 0 2 6 0 0 0 0 2
MediaTek Google - TPU v8t 800 0 0 1 4 15 9 11 11 13 129
Other CPUs / accelerators and products like networking Other CPUs / accelerators and products like networking Other CPUs / accelerators and products like networking 2 4 10 20 109 22 23 25 33 310
Capacity requirement - Cloud AI (kwpm) Capacity requirement - Cloud AI (kwpm) Capacity requirement - Cloud AI (kwpm) 9 24 62 122 652 130 140 151 167 1,763
% of N3 demand % of N3 demand % of N3 demand 7% 18% 38% 64% 36% 69% 72% 73% 76% 73%
Apple iPhone's apps processor 110 43 43 39 22 442 13 11 9 10 128
Mac's processor 165 10 10 8 7 106 7 6 6 6 74
iPad's M processor for Pro & Air 160 14 12 12 8 135 11 10 8 8 111
iPad's A17 Pro processor 104 2 2 1 1 15 3 2 2 2 30
Qualcomm Flagship smartphone SoC 120 17 13 9 3 129 5 5 4 3 51
MediaTek 5G smartphone SoC 120 5 4 3 1 39 2 2 2 1 19
Intel Outsourced PC CPUs 100 15 15 8 8 137 8 8 5 4 70
Others like Bitcoin, tablet, ARM based PC CPU Others like Bitcoin, tablet, ARM based PC CPU Others like Bitcoin, tablet, ARM based PC CPU 10 10 20 20 180 10 10 20 20 180
Capacity requirement - Consumer and other devices (kwpm) Capacity requirement - Consumer and other devices (kwpm) Capacity requirement - Consumer and other devices (kwpm) 116 109 100 69 1,183 60 53 55 53 663
% of N3 demand % of N3 demand % of N3 demand 93% 82% 62% 36% 64% 31% 28% 27% 24% 27%
Total N3 demand Total N3 demand Total N3 demand 125 133 162 191 1,834 190 193 206 220 2,426
TSMC's N3 installed capacity TSMC's N3 installed capacity TSMC's N3 installed capacity 120 130 150 170 1,710 170 185 195 210 2,280
Capacity utilisation Capacity utilisation Capacity utilisation 104% 102% 108% 113% 107% 112% 104% 106% 105% 106%

Source: Company data, UBS estimates. Note: kwpm stands or thousands o wa ers per month.

Figure 12: CoWoS demand from major customers

報告_UBS_ASIC與CPU產業_20260922_004

Source: Company data, UBS estimates

kwpm

Figure 14: TSMC is accelerating N3 capacity expansion to meet strong demand from cloud AI

Source: Company data, UBS estimates

Figure 15: N3 capacity share by client in 2026E

Source: Company data, UBS estimates

Figure 16: N3 capacity share by client in 2027E

Source: Company data, UBS estimates

Figure 17: Summary of major advanced packaging equipment vendors

Product category Ticker Company name Market cap (US$m) Share price (LCY) Stock YTD performance P/E (x) - 2026E P/E (x) - 2027E P/E (x) - 2028E Major equipment offering(s)
Die attach 0522.HK ASMPT 8,882 HKD 168.1 117.0% 33.4 22.6 18.2 • Die bonder for on-substrate (mass reflow) • Thermo-compression bonder (Chip-to-substrate/Chip-to- wafer) • Hybrid bonder
Die attach BESI.AS BE Semiconductor Industries 16,518 € 186.7 39.6% 43.1 28.5 18.5 • Hybrid bonder • Thermo-compression bonder • Flip chip bonder
Die attach 042700.KS Hanmi Semiconductor 16,206 KRW 236,000.0 85.2% 70.0 44.5 37.2 • Thermo-compression bonder
Die attach KLIC.O Kulicke and Soffa 6,383 $83.1 82.5% 21.5 14.1 15.5 • Thermo-compression bonder (Chip-to-substrate/Chip-to- wafer) • Ball bonder in InFO
Die attach 6590.T Shibaura Mechatronics 1,698 JPY 3,790.0 0.1% 16.4 12.4 8.7 • Die bonder for chip-on-wafer (mass reflow) • Hybrid bonder
3131.TWO Grand Process Technology 2,245 TWD 2,445.00 56.7% 41.5 24.9 15.1 • Wet process cleaning tool
Wet process 3583.TW Scientech 1,848 TWD 702.00 110.2% 35.3 23.7 16.7 • Wet process cleaning tool • Temporary bonding/debonding system
Underfill 6187.TWO All Ring 3,831 TWD 1,250.00 243.4% 41.2 26.2 16.0 • Underfill dispenser • Automated optical inspection (AOI) tool
Underfill NDSN.O Nordson Corporation 17,819 $311.6 29.6% 26.2 24.1 21.8 • Underfill dispenser
Metrology 2360.TW Chroma ATE 30,566 TWD 2,290.00 195.5% 51.4 34.3 26.4 • Redistribution layer measurement
Temporary bondingSMHNn.DE Temporary bondingSMHNn.DE SÜSS MicroTec 1,493 € 68.1 73.9% 34.5 21.4 16.1 • Temporary bonding/debonding system

Source: Company data, LSEG, UBS estimates. Share price in local currency. Note: Asian stocks priced as o 18 Sept 2026; non-Asian stocks priced as o 18 Sept 2026. EPS estimates or non-covered (Kulicke and So a, Shibaura Mechatronics, Scientech, Nordson Corporation) companies are based on LSEG consensus orecasts.

Forecast changes - GPTC

Figure 1 : Revisions to our earnings estimates - GPTC

(NT$m) New - 2026E New - 2027E New - 2028E Old - 2026E Old - 2027E Old - 2028E Change - 2026E Change - 2027E Change - 2028E
Revenue 8,072 13,052 20,473 10,363 15,873 22,521 -22% -18% -9%
- YoY chg (%) 24% 62% 57% 59% 53% 42%
Gross profit 3,163 5,776 9,233 4,239 7,106 10,167 -25% -19% -9%
- Gross margin 39.2% 44.3% 45.1% 40.9% 44.8% 45.1% 2% 1% 0%
Operating profit 1,720 3,557 5,884 2,419 4,407 6,338 -29% -19% -7%
- Operating margin 21.3% 27.3% 28.7% 23.3% 27.8% 28.1% 2% 1% -1%
Pre-tax profit 2,132 3,555 5,878 2,815 4,432 6,355 -24% -20% -8%
Reported net profit 1,703 2,844 4,702 2,251 3,545 5,084 -24% -20% -8%
- Net margin 21.1% 21.8% 23.0% 21.7% 22.3% 22.6%
Reported EPS (NT$) 58.90 98.17 162.32 78.45 123.59 177.23 -25% -21% -8%
- YoY chg (%) 30% 67% 65% 73% 58% 43%

Source: UBS estimates

Figure 19: Our revised earnings estimates vs. consensus - GPTC

(NT$m) UBS - 2026E UBS - 2027E UBS - 2028E Consensus - 2026F Consensus - 2027F Consensus - 2028F Difference - 2026E Difference - 2027E Difference - 2028E
Revenue 8,072 13,052 20,473 8,129 12,480 15,772 -1% 5% 30%
- YoY chg (%) 24% 62% 57% 25% 54% 26%
Gross profit 3,163 5,776 9,233 3,149 5,242 6,840 0% 10% 35%
- Gross margin 39.2% 44.3% 45.1% 38.7% 42.0% 43.4%
Operating profit 1,720 3,557 5,884 1,744 3,300 4,617 -1% 8% 27%
- Operating margin 21.3% 27.3% 28.7% 21.4% 26.4% 29.3%
Pretax profit 2,132 3,555 5,878 2,147 3,327 4,644 -1% 7% 27%
Net profit 1,703 2,844 4,702 1,736 2,644 3,681 -2% 8% 28%
- Net margin 21.1% 21.8% 23.0% 21.4% 21.2% 23.3%
Basic EPS (NT$) 58.90 98.17 162.32 60.08 91.19 126.84 -2% 8% 28%
- YoY chg (%) 30% 67% 65% 32% 52% 39%

Source: Visible Alpha, UBS estimates

Figure 20: UBS earnings forecasts - GPTC

(NT$m) 2025 Q126 Q226 Q326E Q426E 2026E Q127E Q227E Q327E Q427E 2027E 2028E 2029E 2030E
Revenue 6,514 1,596 1,727 2,283 2,466 8,072 2,813 3,172 3,484 3,583 13,052 20,473 25,888 29,837
- YoY chg (%) 60% 29% 6% 53% 15% 24% 76% 84% 53% 45% 62% 57% 26% 15%
- QoQ chg (%) -26% 8% 32% 8% 14% -61% 24% 13%
Gross profit 2,681 539 671 921 1,032 3,163 1,240 1,401 1,542 1,592 5,776 9,233 11,684 13,464
- Gross margin 41.2% 33.8% 38.9% 40.3% 41.9% 39.2% 44.1% 44.2% 44.3% 44.4% 44.3% 45.1% 45.1% 45.1%
Operating profit 1,636 210 365 532 613 1,720 762 862 950 983 3,557 5,884 7,542 8,989
- Operating margin 25.1% 13.2% 21.1% 23.3% 24.9% 21.3% 27.1% 27.2% 27.3% 27.4% 27.3% 28.7% 29.1% 30.1%
Pre-tax profit 1,690 580 406 533 612 2,132 762 862 949 982 3,555 5,878 7,532 8,979
Net profit 1,327 463 324 427 490 1,703 609 689 759 786 2,844 4,702 6,026 7,183
- YoY chg (%) 57% 81% 57% 40% -13% 28% 32% 113% 78% 60% 67% 65% 28% 19%
- QoQ chg (%) -18% -30% 32% 15% 24% -60% 25% 14%
Basic EPS (NT$) 45.45 16.11 11.18 14.72 16.90 58.90 21.03 23.80 26.21 27.12 98.17 162.32 208.00 247.95
- YoY chg (%) 56% 84% 58% 42% -12% 30% 31% 113% 78% 60% 67% 65% 28% 19%
- QoQ chg (%) -16% -31% 32% 15% 24% -60% 25% 14%

Source: Company data, UBS estimates

Figure 21: GPTC's 12M forward PE band (x)

Source: LSEG, UBS

Valuation Method and Risk Statement

Tech investing involves risk. It is di icult or the investment community, UBS included, to project the inancial results o tech companies, as their operating models are highly volatile and unpredictable, and they compete in a highly dynamic marketplace. In addition to their low predictability, valuing tech stocks can be challenging because neither traditional nor nontraditional valuation measures have provided much insight into how tech stocks trade. We value GPTC based on PE methodology.

Downside risks include: 1) slower-than-expected CoWoS capacity expansion; 2) competitors achieving technological advancements; 3) geopolitical uncertainty; and 4) worse-thanexpected AI growth.

Quantitative Research Review

UBS Global Research publishes a quantitative assessment o its analysts' responses to certain questions about the likelihood o an occurrence o a number o short term actors in a product known as the 'Quantitative Research Review'. The views or this month can be ound below. Views contained in this assessment on a particular stock re lect only the views on those short term actors which are a di erent time rame to the 12-month time rame re lected in any equity rating set out in this note. For previous responses please make re erence to (i) previous UBS Global Research reports; and (ii) where no applicable research report was published that month, the Quantitative Research Review which can be ound at https://neo.ubs.com/quantitative, or contact your UBS sales representative or access to the report or the Quantitative Research Team on ubs-quant-answers@ubs.com. A consolidated report which contains all responses is also available and again you should contact your UBS sales representative or details and pricing or the Quantitative Research Team on the email above.

Grand Process Technology

Question Response
1. Is the industry structure facing the firm likely to improve or deteriorate over the next six months? Rate on a scale of 1-5 (1 = getting worse, 3 = no change, 5 = getting better, N/A = no view) 4
2. Is the regulatory/government environment facing the firm likely to improve or deteriorate over the next six months? Rate on a scale of 1-5 (1 = getting tougher 3 = no change, 5 = getting better, N/A = no view) 3
3. Over the last 3-6 months in broad terms have things been improving/no change/getting worse for this stock? Rate on a scale of 1-5 (1 = getting a lot worse, 3 = not much change, 5 = getting a lot better, N/A = no view) 3
4. Relative to the current CONSENSUS EPS forecast, is the next company EPS update likely to lead to: (1 = negative surprise vs consensus, 3 = in-line with consensus, 5 = positive surprise vs consensus expectations, N/A = no view) 3
5. What's driving the difference?
6. Relative to YOUR current earnings forecast, is there relatively greater risk at the next earnings result of:(1 = downside skew risk to earnings, 3 = equal upside or downside risk to earnings, 5 = upside skew risk to earnings, N/A = no view) 3
. What's driving the difference?
8. Is there an upcoming catalyst for the company over the next three months? No Catalyst
9. Is there an actual or approximate date for the catalyst?
10. Is the catalyst date an actual or approximate date?
11. What is the catalyst?