PDF 原檔：報告_OCP2026_NVIDIA_MGX電源機櫃參考設計_20261015_original.pdf
講者公開簡報（OCP 官方 Recorded Content 頁提供下載）。文字以 PyMuPDF 逐頁抽取，
### p<n>為頁碼；圖表內容見原檔。
圖片清單（已驗證 2026-10-19）
| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_NVIDIA_MGX電源機櫃參考設計_20261015_p3.png |
p3 | 真資料圖 | 點對點與共用母線電力路徑流程圖：415/480 VAC 100A×2→AC PDU→AC/DC Power Shelf 或 BBU/CBU→800 VDC 母排→DC PDU→800 VDC 125A→運算機櫃 DCDC→54 VDC 母排→Tray |
報告_OCP2026_NVIDIA_MGX電源機櫃參考設計_20261015_p4.png |
p4 | 真資料圖 | MGX 電源系統總覽：左為 Power Rack 內 7RU Power Shelf（PSU+BBU）堆疊，12×100A AC whip 輸入，經 125A DC cross cable 連到右側運算機櫃的 1U 90 kW DC/DC Power Shelf（800V→54V）；右側附 100A AC whip、125A 交叉線與 110 kW BBU+PSU Shelf 實物圖 |
報告_OCP2026_NVIDIA_MGX電源機櫃參考設計_20261015_p9.png |
p9 | 真資料圖 | 800 VDC 157/125A 連接器應用圖：Power Center 到運算機櫃（110 kW AC/DC shelf 對 95 kW DC/DC shelf、UL 1682 盲插、UL 817A 互連線纜 ≤15.2 m）與 Tap Box 到運算機櫃的硬接線 drop cord（1.5–4.5 m），機櫃總額定最大 380 kW |
報告_OCP2026_NVIDIA_MGX電源機櫃參考設計_20261015_p10.png |
p10 | 真資料圖 | 第二代電源機櫃：100% 液冷、儲能 65→100 J/kW、含 BBU 880 kW、90 秒維持時間，16×100A AC whip 輸入，附 DC/DC Power Shelf（95 kW 1RU）與 110 kW BBU+PSU Shelf 前後視圖 |
報告_OCP2026_NVIDIA_MGX電源機櫃參考設計_20261015_p13.png |
p13 | 真資料圖 | Power Center 機櫃前後視圖與叢集配置：中間 800 VDC 液冷母線，兩側各 7 個 GPU 機櫃，四個 Power Center 供電；附 DC/DC Power Shelf 與連接器 |
原始內容
p1
Jared Huntington Power Architect Nvidia MGX Power Rack Reference Design ] RACK & POWER
p2
• BBUs and N+N redundancy drive the need sooner • Long term this is an adapter component Need for power racks BBU N+N
p3
Point to point vs. Common Bus Repeating Power Blocks Power Shelves or BBU/CBU
p4
• Using a point-to-point approach • BBU / non-BBU option • Bulk capacitors for power smoothing Power System Overview
p5
• 5 wire to 4 wire • Symmetrical connector design for both top and bottom feed • Move to individual conductors -> 64% reduction in bend radius • Develop new Silicone Insulation -> 50% reduction in bend radius UL 2137 (Silicone rubber) Improving Power Whips Individual Strands
p6
AC/DC Power Shelf
p7
• Best in class caps • Maximize packing • Longer caps are more energy dense Maximizing capacitance
p8
IPS • Moving to electrolytic caps for all input current shaping • Hardware backstop for longer delays allows for controlled rate of change on PFC.
p9
800 VDC 157/125A Connector
p10
• Moving to 100% liquid cooled • Increased energy storage • 65 J/kW -> 100 J/kW • 880 kW N w/ BBU • 90s holdup time Second Generation
p11
100% Liquid Cooled • 1RU = 1 PSU • Recover space from cold plate • No internal manifold • Integrated BMC
p12
• 2036A Busbar Clip • +11% RMS heating Liquid Cooled Busbar Clip
p13
Power Center Front Back
p14
• Evaluate 125 A / 157 A 800 VDC Connector as standard connector / block size • Evaluate 100 A multiconductor whip as standard interface • AC input current shaping as standard requirement for AI workloads • Liquid cooling as standard power cooling moving forward Call to Action
p15
Thank You!