PDF 原檔：報告_OCP2026_緯穎_AI工廠基礎設施挑戰_20261015_original.pdf
講者公開簡報（OCP 官方 Recorded Content 頁提供下載）。文字以 PyMuPDF 逐頁抽取，
### p<n>為頁碼；圖表內容見原檔。
圖片清單（已驗證 2026-10-19）
| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_緯穎_AI工廠基礎設施挑戰_20261015_p3.png |
p3 | 真資料圖 | 全球製造據點地圖：台北總部（設計中心）、台南（主機板）與 Luzhu, Taiwan（機櫃整合）、柔佛馬來西亞（主機板）、布爾諾捷克（機櫃整合）、胡亞雷斯墨西哥（主機板）、美國德州 Socorro（機櫃整合），並標資料中心點位 |
報告_OCP2026_緯穎_AI工廠基礎設施挑戰_20261015_p6.png |
p6 | 真資料圖 | HVDC 電網到晶片供電拓撲：35kVAC 電網經變壓器或固態變壓器（SST）到排內電源櫃，HVDC 匯流排進 IT 櫃；板上兩條路徑：HVDC→50V 全磚→50V→12V→12Vin VPD，及新概念 HVDC→6V 模組→6Vin VPD |
報告_OCP2026_緯穎_AI工廠基礎設施挑戰_20261015_p7.png |
p7 | 真資料圖 | 下一代 VPD 與冷板整合四種剖面：底側 cavity PCB、cut-out PCB、頂側 cavity、PIVR/IVR，VR 與雙面冷板的相對位置 |
報告_OCP2026_緯穎_AI工廠基礎設施挑戰_20261015_p8.png |
p8 | 真資料圖 | 散熱演進（冷板→冷板蓋→晶片上冷卻）與緯穎三項創新：雙面冷板、3D 列印微通道、鑽石基材；標示 6,000W+ 高功率散熱與 0.5U 高密度 |
報告_OCP2026_緯穎_AI工廠基礎設施挑戰_20261015_p10.png |
p10 | 真資料圖 | 緯穎×Ayar Labs 光互連機櫃（影片截圖）：32 個 AI 運算托盤連接 64 顆 ASIC，光頻寬超過 800 TB/s；可見托盤前端光學連接與黃色光纖 |
報告_OCP2026_緯穎_AI工廠基礎設施挑戰_20261015_p13.png |
p13 | 真資料圖 | 緯穎攤位實景與展出清單：Vera Rubin NVL72、AMD Helios 機櫃（Instinct MI455X）、雙面冷板／鑽石微通道／晶片上冷卻／輕量化 DLC、機櫃級 CPO（TSMC COUPE 光引擎托盤現場展示） |
原始內容
p1
Tony Wen Vice President, Engineering Management, Wiwynn Building the AI Factory: Overcoming the Infrastructure Challenges of AI at Scale
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Liquid-cooled POD Integration Server & Storage Rack Integration Unleash the Power of Digitalization Ignite the Innovation of Sustainability Wiwynn in Numbers 2.6x Revenue (USD) Growth 2024-2025, 2025: 30.6B 49% Revenue CAGR 2021-2025 1.9x Rack Shipment Growth 2024-2025 3 1.6x Whitepaper Growth 2025 vs 2026, 2026: 19 1.2x Patent Growth 2025 vs 2026
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Taipei, Taiwan Global Manufacturing Footprint Brno, Czech Motherboard Rack Integration Design Center Datacenter Tainan Juarez, Mexico Johor, Malaysia Socorro, TX, USA Luzhu, Taiwan Tainan, Taiwan Taipei, Taiwan HQ Brno, Czech Johor Malaysia Juarez, Mexico Socorro, TX, USA
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4 It’s how we lead the supply chain of the AI age
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Shaping the Future of AI Infrastructure Through Industry Co-Design 5 AI Infrastructure Co-Design IC Design System Design & Manufacturing Semiconductor & Packaging Hyperscalers
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In-Row Power Rack | Sidecar IT Rack HVDC Transforming Grid-to-Chip Power Delivery 6 35k VAC Electrical Grid Transformer Power Generator VAC Customized designs to enable higher power density and efficiency by minimizing the low-voltage, high-current path to the xPU. HVDC Power Bus HVDC AI Server PDB HVDC HSC HVDC to 50V Full Brick Converter xPU Board 50V to 12V Module 12Vin VPD for xPU Rails PDB HVDC HSC xPU Board 6Vin VPD for xPU Rails HVDC to 6V Module New Design Concept HVDC Solid-state Transformer
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Innovative Board Design: Next-Gen VPD to Integrate Power & Cooling 7 Integrating power and cooling into one thinner, more efficient design — delivering higher density and lower power loss. VPD with Bottom side Cavity PCB PCB VR GPU | XPU Cold-plate Cold-plate PCB VR GPU | XPU Cold-plate Cold-plate VPD with Cut-out PCB GPU | XPU PCB VR Cold-plate Cold-plate VPD with Top side Cavity Cold-plate Cold-plate PCB VR PIVR/IVR GPU | XPU
p8
Thermal Innovations: Scaling AI Compute Beyond the Power Limit Increase Rack Density to Support More AI Chips High-Power Cooling to Support Next-Generation AI Diamond-Based Materials 3D-Printed Micro-channels Precision Flow-Channel Design to Improve Cooling Efficiency Double Sided Cold Plates Cold Plate Cold Plate Lid PCB TIM1 Die Substrate Cold Plate Lid PCB Die Substrate Lid On-chip Cooling PCB TIM2 TIM1 Die Substrate Lid Cold Plate Improve Thermal Conductivity and Eliminate TIM Direct Dual-Sided Cooling for VPD Applications Cooling Trend: Shortening the Thermal Path Between Coolant and Chip Wiwynn Innovations
p9
Connectivity: Scaling the AI Factory with CPO
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CPO Innovations for AI Scale-up | Wiwynn x Ayar Labs 10
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Empowering Talent to Fuel Technical Upgrades 12 Consecutive Years at OCP Summits 60+ Workshop speeches 17 Workstream participations 40+ Whitepaper publications 2017 2018 2019 … 2016 2015 2 1 1 2 2 2 2024 2025 2023 2 2 2 4 5 5 1 10 1 2 1 Expo Hall + Executive Track Engineering Workshop Future Symposium 2026 2 12 2
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Demonstrate Wiwynn’s Technology on Rack, System and Components Level Next-Generation AI Rack Solutions • NVIDIA Vera Rubin NVL72, AI Factory Solutions • AMD Helios Rack with Instinct MI455X GPUs Innovative Thermal Solutions • Double-sided Cold Plate for VPD + Cavity PCB • Diamond Microchannel • On-Chip Cooling • Lightweight DLC Rack-Level CPO Solutions • Rack architecture with ecosystem • World 1st working TSMC COUPE IC in Tray : LIVE demo
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Wiwynn Booth at #C74 C74 Entrance Entrance
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Call to Action • Visit Wiwynn at #C74 to explore the new platforms and technologies • Join Wiwynn workshop, speeches and future symposium panels. • Browse Wiwynn website and download whitepapers Wiwynn Whitepapers Wiwynn @ OCP Summit 2026
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（本頁無可抽取文字，內容在圖中）