報告_OCP2026_TE_448G共封裝銅纜_20261015

PDF 原檔：報告_OCP2026_TE_448G共封裝銅纜_20261015_original.pdf

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圖片清單（已驗證 2026-10-19）

原始內容

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Sakina Naqvi System Architect, TE Connectivity Usman Saeed Principal System Architect, TE Connectivity Co-Packaged Copper at 448G: Balancing Electrical Efficiency with System Level Complexity SERVER: COMPOSABLE MEMORY SYSTEMS (CMS)

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What is Co-Packaged Copper? • As data rates increase, the distance electrical signals can travel through a conventional PCB decreases. • CPC is about using fundamental pieces of technology that we understand well and deploying them in new areas. • CPC advantages: o Shorter electrical paths o Lower signal loss o Higher bandwidth density o Cost-effective and simplified connectivity Traditional Motherboard Near Packaged Copper “NPC” Co-Packaged Copper “CPC” Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification.

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• Twinax vs. PCB Trace: o Twinax cable delivers lower loss and better cross-talk • Drainless vs. Drain Cables: o Drain cable simplifies shield termination and increases stiffness • Cable/Connector Terminations: o Maintain controlled differential impedance • Breakout Region Design: o Pin escape/fanout is often the channel limiter • Skew: o Intra-pair skew limits BER o Inter-pair to stay within de-skew budgets • Cable Loss: o Low-Dk/foam-like dielectrics and optimized shields reduce high- frequency loss System Level Considerations for CPC Assumptions: • 250 mm 30AWG cable vs. 254 mm stripline trace Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification. Magnitude, dB Frequency, GHz Insertion Loss (Twinax vs. Trace) IL @ 112 GHz ~ 4 dB IL @ 112 GHz ~ 23 dB

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System Level Challenges – Bending/Twisting • 448G is sensitive to bend radius and results in skew • Ideally, each bend would be followed by an equal and opposite bend to minimize skew • A fixed time skew consumes more timing budget at higher data rates Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification. 45-degree radial bend 0-degree radial bend (good-way bend)

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Simulated - 448G CPC/NPC to Backplane Channel (PAM6) Magnitude, dB Magnitude, dB Frequency, GHz Frequency, GHz Insertion Loss Return Loss IL @ 90 GHz ~ 6 dB IL @ 90 GHz ~ 12 dB Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification. Assumptions: o No package loss included in channel Key Takeaway: o At 448G, CPC provides lower insertion loss than NPC

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Simulated - 448G CPC/NPC to I/O Channel (PAM4) Magnitude, dB Magnitude, dB Frequency, GHz Frequency, GHz Insertion Loss Return Loss IL @ 112 GHz ~ 7 dB IL @ 112 GHz ~ 14 dB Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification. Assumptions: o No package loss included in channel Key Takeaway: o At 448G, CPC provides lower insertion loss than NPC

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• CPC solves the ASIC “escape” problem by moving high-speed signals quickly from the package into twinax cables. • Now the cable/connector system becomes part of the ASIC package itself, so all these components must be designed together. • As bandwidth and I/O density increase, the available ASIC package perimeter remains constrained, increasing connector, cable routing, and assembly complexity. • Manufacturing Considerations: o Connector tolerances become increasingly important at the system level o Cable strain needs to be managed at the package interface o Package warpage needs to be accounted for when integrating materials with different coefficients of thermal expansion High Radix Systems vs. Manufacturing Complexity Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification.

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• CPC places high-speed connectors directly within the ASIC package thermal environment • CPC design partners are accounting for package, substrate, cold-plate, and cable induced mechanical loads across thermal cycling • Temperature dependent cable loss is understood and is incorporated into channel margin Designing CPC for the ASIC Thermal Environment Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification. IL @ 90 °C ~ 2.4 dB Δ Magnitude, dB Temperature, °C Insertion Loss Key Takeaway: o Cable loss (in dB) increases 3% - 5% for every 10°C increase for a 1m cable

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CPC as a Natural Transition to CPO • CPC and CPO can share a common reference architecture for front panel or backplane connectivity • Co-Packaged Copper builds the package-level electrical, mechanical, and thermal integration practices that can support a future transition to CPO. Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification. Co-Packaged Copper Co-Packaged Optics

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• Next Steps: o Share channel-level SI data to support next-generation channel analysis and validation o Work with ecosystem partners to develop common standards and interoperability guidelines for copper and optical interconnects • Contacts: o TE 448G CPC: Rahul Sharma (sharmar@te.com) o TE System Architecture: Sakina Naqvi (sakina.naqvi@te.com) & Usman Saeed (usman.saeed@te.com) • Where to find additional information: o OCP Server Project Wiki o Server Specifications & Designs Call to Action Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification.

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