PDF 原檔:報告_OCP2026_Microsoft_Google_Meta_板上400V800V供電需求_20261015_original.pdf
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| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_Microsoft_Google_Meta_板上400V800V供電需求_20261015_p5.png |
p5 | 真資料圖 | 板上電源生態演進時間軸 2012–2020:12V→48V 兩級(48V-12V 第一級+多相 TLVR 第二級)、48V-PoL 單級、Nvidia DGX-2 首款 48V GPU,右端箭頭指向 +/-400V/800V 方案 |
報告_OCP2026_Microsoft_Google_Meta_板上400V800V供電需求_20261015_p6.png |
p6 | 真資料圖 | 方案一方塊圖:+/-400V/800V 輸入 tray→PDB 轉 50V(12kW 全磚/6kW 半磚/3kW 四分之一磚)→Modular Fixed Ratio IBC 供 Lateral VR/VPWR 給 ASIC,另一路 50V→Modular Regulated 12V Brick 供 POL VR 與 12V 負載 |
報告_OCP2026_Microsoft_Google_Meta_板上400V800V供電需求_20261015_p7.png |
p7 | 真資料圖 | 方案二方塊圖:Power Entry Board(Hotswap、EMC filter、輸入電容、內含 Modular 12V Brick)直接把 +/-400V/800V 降到 12V 供 POL VR;高壓另走 Custom PDB 到 ASIC |
報告_OCP2026_Microsoft_Google_Meta_板上400V800V供電需求_20261015_p10.png |
p10 | 真資料圖 | +/-400V/800V DC-DC 模組規格表(50V 固定比 vs 12V 固定比/穩壓):TDP、效率、暫態 >150% TDP 50ms、輸出電容、800V 加強絕緣等 |
原始內容
p1
Lu Jian (LJ) Onboard Power Technical Lead Manager, Google Sachin Madhusoodhanan Senior Power Engineer, Google James Sun Principal Systems Engineering Manager, Microsoft Shengwen Xu Power Systems Engineer, Meta Michelle Badal Global Commodity Manager / OCP Workstream Contact, Google +/-400V / 800V On-Board Power Delivery Requirements ] RACK & POWER
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• Background • Onboard power ecosystem evolution: Industry, Google, Meta and Microsoft • +/-400V/800V to 50V or 12V Specifications • Onboard power design quality challenges • Power Entry onboard power qualification requirements • Call to Action and Next Steps • Open Discussion Agenda
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● Unified specifications proved essential for resilient, multi-vendor supply chains during the 12V to 48V transition. ● In 2024: Google, Microsoft, Meta, and industry members released the 48V Design and Qualification Checklists through OCP. ● Today: High-density AI workloads require exceptional dynamic load handling and supply shortages highlight the need for design-driven supply chain resilience. ● Transitioning from 48V to +/-400V/800V on-board power delivery enables higher power density, end-to-end efficiency, and better power quality directly at the ASIC level. ● Call to Action: Google, Meta, and Microsoft are launching a new OCP Workgroup in Q4 2026 to create standardized power module specifications and qualification criteria, targeting a 2H 2027 release. Background
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Enable Technology & Improve Supply Chain Efficiency Strategies to enhance technology enablement and supply chain security following recent IC shortages: ● Standardize Specifications: Simplify requirements for IC suppliers to streamline production and boost overall output efficiency. ● Ensure Supply Continuity: Secure a reliable technology pipeline to and improved supply and supply chain operations. ● Drive Business Demand: Strengthen market demand for these solutions to support long-term business health. ● Improve Resiliency: Mitigate risk by qualifying multiple partners, effectively eliminating single points of failure. ● Standardize Footprints: Implement common hardware layouts to ensure cross-vendor compatibility and operational flexibility.
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2012 2016 2020 Legacy 2-stage solution: 1st stage isolated & regulated 48V-12V, leveraged from legacy telecom industry. 48V systems 12V systems Google 48V architecture first announced at OCP. 1-stage solution: 48V-PoL direct conversion 2018 48V-PoL 1-stage solutions released. Google 48V STC based 2-stage architecture disclosed at APEC 2017 48V 2-stage ecosystem established: 1st stage 48V-12V (discrete non-isolated fixed ratio & regulated converters) 48V 2-stage ecosystem further evolved: 1st stage 48V-bus (12V or lower, modularized non- isolated fixed ratio & regulated converters); 2nd stage multiphase TLVR adopted by mainstream servers for fast transients. Nvidia first 48V GPU (DGX-2) + 48V-PoL 1-stage solutions (custom VRM module designs) Industry Onboard Power Ecosystems Overtime +/-400V/800V solutions
p6
+/-400V/800V Onboard Power Evolution +/-400V/800V to 50V PDB as 1st stage Beyond 48V Power Distribution Board (PDB) 12kW Full Brick, 6kW Half Brick, 3kW Quarter Brick ● Scalable High Voltage Full, Half and Quarter bricks. ● Enabling ecosystem development. ● Existing 48V downstream VR design. ● Lesser isolation requirements for +/-400V before transitioning to 800V. ● Power quality & reliability. ● Enable common footprint & optionality.
p7
+/-400V/800V Onboard Power Evolution +/-400V/800V to 12V Beyond 48V Power Distribution Board (PDB) ● PDB densification - Higher tray power density. ● +/-400V/800V closer to ASIC - Higher end-to-end efficiency. ● Modular 12V brick design for lateral power. ● Higher isolation requirements for 800V (reinforced). ● Power quality & reliability. ● Vendor ecosystem. ● Enable common footprint & optionality.
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Pros & Cons: Discrete vs. Modular Implementation 1st stage solutions Parameter Discrete Modular Power Density W/mm2 Lower Higher, depending on the solution can be up to 2x Efficiency ~98% Decimal points higher Decimal points lower - OPEX impact System Design and Implementation Larger board space, no redundancy Enables another vertical placement, +1 redundancy, cold plate cooling, multi sourcing, etc.
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Top-view Benefits of Quality Partnership Industry-wide collaboration on standard ±400VDC/800VDC power solutions expands reusable ecosystem components and enables scalable, high-quality AI data center architectures. Greater adoption enhances design flexibility, standardizes qualification, and reinforces reliability and supply chain resilience for both internal and external platforms. Standardized qualification methodologies enhance product stability, robustness, and long-term reliability.
p10
+/-400V/800V DC-DC Module Key Specifications Vout 50V (fixed ratio) 12V (fixed ratio)/12V (regulated) TDP 12kW (Full Brick); 6kW (Half Brick); 3kW (Quarter Brick) 3kW (fixed ratio, Quarter Brick)/2.5kW (regulated, Quarter Brick) Vin nominal +/-400V/800V Vin tolerance +/-10% Height 14mm Vout ratio tolerance (DC+AC) +/-3% Parallel operation Passive droop current sharing with impedance match (fixed ratio) Passive droop current sharing with impedance match (fixed ratio)/ Active current sharing (regulated) Efficiency target
98.5% peak; >98% for 25%-100% of full-load 96.5% peak; >95.5% for 25%-100% of full-load Transient power Supports >150% TDP for 50ms Output capacitance 500uF/kW 5mF/kW Isolation Yes, 800V Reinforced Protection Vin UVP/OVP, Vout UVP/OVP, OCP and OTP Start-up Supports pre-biased start-up PMBUS & Blackbox Yes & Yes Footprint (Soldering method) MSL Rating DOSA Compliant 3 or Better EMC & Safety compliance IEC/EN/UL/CSA 62368-1
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Onboard Power Quality Requirements Below is an outline of the requirements for modular power design to enhance scalability and reliability while enabling multi-vendor sourcing and reducing qualification burdens. The primary objectives and technical requirements include: ● Design Architecture: Modular solutions with a common footprint are preferred and accelerate design and validation, improve quality, and minimize system redesign during multi-vendor sourcing. ● Performance Specifications: Defined requirements for output voltage regulation, ripple/noise, transient response, startup/shutdown sequencing, current sharing, and fault recovery. ● Compliance & Safety: All designs must comply with +/-400V/800V IEC/UL 62368-1 safety and EMC standards for high-voltage delivery. ● EMC Standards: Performance must meet rigorous conductive and radiative emission standards. ● AI Workload Stability: Power quality must remain stable under system-level dynamic loading conditions representative of high-density AI environments. ● Efficiency: Enhanced efficiency shall be achieved through integrated power and thermal co-design. Power quality performance must be maintained when modules operate in parallel to ensure consistent reliability.
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Call to Action We invite industry members to the “+/-400V/800V Onboard Power Delivery” OCP Workgroup to: Join in finalizing, developing and implementing the +/-400V/800V power module solution specification and qualification criteria proposed by Google, Microsoft and Meta for target availability starting 2H27. Workgroup participation types: Extended Workgroup and Core Workgroup. Where the Core Workgroup is expected to assign resources for the review, finalize development of qualification criteria, specification and worksheets Next Steps: ●If interested request to join by emailing mbadal@google.com by October 30th! ●Target first meeting is in Q4’26 to discuss the timeline of the workgroup activities End customer and supply base
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Additional Contributors Acknowledgment Google: o Chee Chung - Senior Director Engineering o Gregory Sizikov - Senior Manager Engineering o Mobashar Yazdani - Senior Manager Global Commodity Management o Ali Eltoukhy - Senior Manager Global Commodity Management, Power Microsoft: o Hao Yang, Category Sourcing Director Meta o Dan Kim, Commercial Sourcing Manager o Anthony Chan, Power Systems Engineer
p14
Open Discussion