報告_OCP2026_Dell_ScaleUp光學機會_20261015

PDF 原檔：報告_OCP2026_Dell_ScaleUp光學機會_20261015_original.pdf

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圖片清單（已驗證 2026-10-19）

原始內容

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Jian Chen Network Architect, Dell Technologies Beyond Copper: Optical Opportunities for AI Scale-up Fabrics

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• The Copper Wall: A System-level Constraint • The Role of Optics in Scale-up Fabrics • The Optical Integration Continuum • CPO (Co-Packaged Optics): Benefits and System-level Tradeoffs • Optical Disaggregation • XPO (eXtra-dense Pluggable Optics) • Open CPX • Takeaways • Call to Action Agenda

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• As scale-up domains grow, the interconnect increasingly influences bandwidth, latency, power and rack-level design. • The copper wall: • At 200 Gb/s per lane, passive-copper reach is typically limited to a few meters. • At 400 Gb/s per lane and above, electrical reach is expected to become even more constrained (<1m). • This creates a fundamental system-design challenge: • Short-reach copper favors compact, single-rack topologies. • Larger scale-up domains require power-efficient connectivity across racks. • Larger scale-up domains require longer reach, lower power consumption, higher bandwidth density and manageable cable routing. The Copper Wall: a System-Level Constraint

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• Optics becomes attractive when system-level power, bandwidth and cable management dominate over transceiver cost: • Lower loss over rack-scale distances • Less dependence on retimers • Smaller and lighter cable infrastructure • Tighter integration with XPUs and switch ASICs • However, replacing every copper cable with traditional pluggable optics can introduce unacceptable power, cost and reliability trade-offs. • The transition is therefore likely to be hybrid: • Copper where reach remains practical • Optics where distance, density or power makes copper inefficient The Role of Optics in Scale-up Fabrics

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• No single technology optimizes reach, power, density, cost, manufacturability and serviceability at the same time. • The optical technologies landscape: • Silicon photonics • Indium phosphide • Thin film electro optical materials • lithium niobate (TFLN), barium titanate (BTO) • VCSELs • Emerging technologies such as µLEDs • The optical integration ranges from retimed and linear pluggable optics, to near-packaged and co-packaged optics. The Optical Integration Continuum FRO: Fully Retimed Optics LRO: Linear Receive Optics RTLR: Retimed Transmit, Linear Receive LPO: Linear Pluggable Optics NPC: Near Package Copper NPO: Near Package Optics NPX: Near-packaged Optics or Copper CPC: Co-Packaged Copper CPO: Co-Packaged Optics CPX: Co-Package Optics or Copper ELSFP: External Laser Small Form-Factor Pluggable

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• CPO reduces electrical reach, lowering power and enabling higher bandwidth density. • However, these gains come with new challenges in packaging, manufacturing, serviceability and ecosystem maturity. • CPO improves power efficiency and bandwidth density, but successful deployment requires balancing system performance with manufacturability, serviceability and ecosystem openness. CPO: Benefits and Deployment Considerations Why CPO is attractive Shorter high-speed electrical channels Lower electrical I/O and retimer power Higher bandwidth density Potential for larger scale-up domains and improved system efficiency System-level Tradeoffs More complex package, thermal and board co-design New manufacturing and test requirements Reduced field serviceability Larger “blast radius” Potential component and vendor lock-in

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• XPO is a high-density, serviceable design to preserve a pluggable ecosystem at higher bandwidth density. • The architecture separates the optical module from the switch ASIC or XPUs by using fly-over cables. • Potential system benefits include: • Higher bandwidth (8x) and front-panel density (4x) • Improved serviceability compared with CPO • Direct liquid cooling (DLC) for high-power optical modules • Support for both low-power LPO optics and higher-power coherent DWDM optics • Greater flexibility in optical technology and supplier selection Optical Disaggregation – XPO XPO module with 64 x 200G lanes (12.8T) OSFP module with 8 x 200G lanes (1.6T) Sources: Arista Cooling

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• Open CPX defines a pluggable optical engine connected through a standardized socket and electrical connector rather than permanently attaching optics to the electronic package. • Similar to CPO, Open CPX can: • Shorten high-speed electrical channels • Reduce channel loss and retiming requirements • Improve bandwidth density near the package • An Open CPX ecosystem can enable: • Multi-vendor interoperability • Independent evolution of optics and electronics • More flexible system integration Optical Disaggregation – Open CPX Sources: Open CPX MSA Type 1 Type 2

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• At future lane speed, copper will increasingly constrain the system architecture. • Optics can enable larger and more power-efficient scale-up domains. • System designers must balance bandwidth, power efficiency, interoperability and serviceability considerations when selecting among different approaches. • Open optical ecosystems are critical for scalable AI infrastructure. Takeaways

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• What the Industry Needs: • Accelerate industry standard for optical disaggregation • Preserve interoperability and serviceability as optical integration increases • Dell’s Commitment: • Active member of both XPO and Open CPX MSAs • Founding member of OCP’s Open Silicon Photonics for AI Systems (being developed under OCP’s Server) → Dell supports open, disaggregated optical solutions that preserve interoperability, serviceability and multi-vendor innovation. • Call to Action: • Work together across the industry to build open and interoperable optical solutions that can scale the next generation of AI infrastructure. Call to Action

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Thank You!