PDF 原檔：報告_OCP2026_TE_電源密度與頻寬_20261015_original.pdf
講者公開簡報（OCP 官方 Recorded Content 頁提供下載）。文字以 PyMuPDF 逐頁抽取，
### p<n>為頁碼；圖表內容見原檔。
圖片清單（已驗證 2026-10-19）
| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_TE_電源密度與頻寬_20261015_p2.png |
p2 | 文字卡 | Driving 800VDC through the Racks（右側僅兩張 TE 連接器產品照）：800VDC 帶來的六項連接需求（Touch Protection、Creepage and Clearance、Controlled Mating、Interlocks、De-energized Maintenance、Connector Condition Monitoring）；800V Sidecar、800V IT Rack Busbar 250kW 至 1.6MW 可擴深度、Compact Mating（sense 與 precharge 在 35mm 匯流排寬度內）；備註產品僅供參考、非已授權之 OCP 規格貢獻 |
報告_OCP2026_TE_電源密度與頻寬_20261015_p3.png |
p3 | 真資料圖 | One Sidecar Architecture, Two Paths：Path A 高壓 IT 機櫃（HV 匯流排連接器、HV 匯流排、機櫃對機櫃連接）與 Path B 50V IT 機櫃（液冷匯流排、BB4000、Multi-Beam HV to LV 連接器）；右側 1OU 機櫃對機櫃電源連接，標示更高電流、液冷／氣冷、整合訊號（interlock、presence、溫度） |
報告_OCP2026_TE_電源密度與頻寬_20261015_p4.png |
p4 | 真資料圖 | 運算托盤俯視圖與連接器：1 Power input via IT-Gear；2 托盤內終端含 ELCON Micro+、RAPID LOCK、ELCON Mini、ICCON socket insert、12/48V MPIC；註明 IT Gear、ELCON Micro+、RAPID LOCK 與 ICCON 提供 50V 與高壓版本 |
報告_OCP2026_TE_電源密度與頻寬_20261015_p7.png |
p7 | 真資料圖 | 光學邊界內移示意：DAC／可插拔光學（faceplate I/O）、NPO（機箱內光學 I/O，ASIC–OE–光學）、CPO（ASIC 旁 OE 加 FAU）三列，標出各自可維修範圍（Serviceable）；右側三點 Protect high-value compute、Create separable interfaces、Lock in optical precision |
報告_OCP2026_TE_電源密度與頻寬_20261015_p8.png |
p8 | 真資料圖 | 被動光路三段：Chip↔Fiber 的 Fiber Array Unit（含 2D M×N）、Fiber↔Fiber 的連接器與轉接器（標示 SENKO、US Conec、3M partnership）、System 的 fanout／backplane／光纖組件；兩處標 Illustrative |
原始內容
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Solving Power Density and Bandwidth Challenges in AI Infrastructure Executive Session OCP Global Summit 2026 Gaurav Jain, Sr. Dir., Product Management Ram Kasiraman, Sr Mgr., Product Management
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Driving 800VDC through the Racks Lower Current, Smaller Conductors, Lower Resistive Losses 800VDC CREATES NEW CONNECTION REQUIREMENTS • Touch Protection • Creepage and Clearance • Controlled Mating • Interlocks • De-energized Maintenance • Connector Condition Monitoring 1MW AND BEYOND Building blocks for next-generation 800V rack architectures TE IS DRIVING 800V POWER 800V IT RACK BUSBAR 250kW to 1.6MW scalable depth options COMPACT MATING Sense and precharge fit within 35mm busbar width NOTE: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed contributions to any OCP specifications LEARN MORE AT TE PRESENTATION Enabling 1MW+ IT Rack Power with an Open Rack Busbar Interface Thursday, Oct 15 I 10:15 AM SJCC – Concourse Level, 230A 2 800V SIDECAR High Power scalable options for Busbar and PSU
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One Sidecar Architecture, Two Paths to the Compute Load Sidecar Separates Power Conversion from Compute. Output Architecture Determines Where Final Conversion Occurs TE AT EVERY CRITICAL INTERFACE AC Whip • Shelf I/O • HV Busbar Connector • Rack-to-Rack • Vertical Busbar • IT Gear HIGH-VOLTAGE IT RACK 50V IT RACK PATH B PATH A High Vol busbar Rack-to-rack connections Liquid-cooled busbar BB4000 High Vol busbar connector MULTI-BEAM HV to LV Connector 1OU Rack-to-Rack Power Connection Designed for air- and liquid-cooled 800V architecture HIGHER CURRENT More power per conductor cross-section LIQUID-/AIR- COOLED Architecture scales with the thermal envelope INTEGRATED SIGNAL Interlock, presence and temperature options INDUSTRY-LEADING
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TE AT EVERY CRITICAL INTERFACE AC Whip • Shelf I/O • HV Busbar Connector • Rack-to-Rack • Vertical Busbar • IT Gear HIGH-VOLTAGE IT RACK 50V IT RACK PATH B PATH A High Vol busbar Rack-to-rack connections Liquid-cooled busbar BB4000 Inside the Compute Tray Power input via IT-Gear 1 Terminating in the Tray 2 RAPID LOCK Connector ELCON Micro+ Connector 12/48V MPIC ELCON Mini connectors ICCON Socket Insert High Vol busbar connector MULTI-BEAM HV to LV Connector IT Gear, ELCON Micro+, RAPID LOCK connectors & ICCON socket inserts available in 50V and High Voltage One Sidecar Architecture, Two Paths to the Compute Load Sidecar Separates Power Conversion from Compute. Output Architecture Determines Where Final Conversion Occurs
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Helping You Design for Power Integrity, Safety and Sensing at the Interface POWER INTEGRITY Power density requires: • More shielding • Lower loop inductance • B-field and voltage-drop control Smart Power CONNECTORS BECOME PART OF THE CONTROL/PROTECTION ARCHITECTURE SENSING Clean Power LOWER INDUCTANCE Higher current demands: • Reduced voltage droop • Low inductance and low resistance for the last-mile connectors Failures Become Predictable SAFETY CONNECTORS BECOME PART OF THE CONTROL/PROTECTION ARCHITECTURE See TE's Smart Power — TE Booth D3 Help anticipate failures by measuring: • Temperature, presence, current and conditions Enhance safety using: • Touch-safe geometry, sequencing, interlock and de-energized service LEARN MORE AT TE PRESENTATION “Reducing Parasitics, Improving Performance: The Case for Low Inductance” Tuesday, Oct 13 3:40 PM SJCC – Concourse Level – 212 Improving compute performance 5
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AI Economics Are Reshaping The Interconnect AI demands are driving larger compute fabrics … 6 Cross-rack scale-up Scale-up Scale-out Spine switch (CPO / OCS) BANDWIDTH DENSITY More lanes at higher speeds stressing electrical channels REACH Larger domains require longer high-bandwidth links ENERGY / BIT Equalization and retiming power rise with speed + distance AI Economics More tokens per dollar Larger Compute Domains More GPUs/accelerators acting as one system Higher Bandwidth / Radix More data across more connections … increasing the burden on interconnect AI Scale is Pushing Electrical I/O to its Limits, Moving the Optical Boundary Closer to Compute Architecture Evolution
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Moving Optics Inward Redefines The Service Model CREATE SEPARABLE INTERFACES Enable low-loss, repeatable optical disconnect and reconnect PROTECT HIGH-VALUE COMPUTE Service optics and lasers without replacing the ASIC/package LOCK IN OPTICAL PRECISION Establish alignment in manufacturing; enable passive, repeatable remating DAC through Pluggable Optics I/O at faceplate ASIC ASIC Copper Copper Copper OR Optics Pluggable Pluggable Serviceable CPO Optical I/O adjacent to ASIC Optical engine ASIC ASIC Optics OE OE Serviceable Optical engine FAU FAU Optical boundary is moving from faceplate to package Serviceability must be engineered into the path NPO Optical I/O inside chassis Optical engine ASIC ASIC Optics OE OE Serviceable Optical engine As Optics Moves Inward, the Passive Optical Path becomes Integral to System Architecture
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Scaling the Passive Optical Path – From Chip to System CHIP FIBER ATTACH Fiber Array Unit (FAU) Precisely couple high-density (including 2D M×N) fiber arrays to photonic engines PRECISION • DENSITY • AUTOMATION FIBER FIBER CONNECT Connectors & Adapters Create low-loss, separable optical interfaces for assembly, service, and upgrade LOW LOSS • RELIABILITY • SERVICEABILITY SYSTEM INTERCONNECT ROUTE Fanouts, Backplanes, & Fiber Assemblies Distribute and manage high fiber counts across boards, racks and systems ROUTING • DENSITY • SYSTEM INTEGRATION partnership partnership partnership Illustrative Illustrative 8
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9 FusionForge: Precision Fiber Termination At Scale PERFORMANCE BY DESIGN • Sub-micron precision and ±1deg PM clocking • Epoxy-free optical interface • Repeatable optical interface HIGH DENSITY WITH GEOMETRY FREEDOM • Flexible 1D & 2D array architectures • Tight pitch and high channel counts • Adaptable across photonic & coupling architectures AUTOMATION BUILT FOR SCALE • Automated alignment and laser termination • Repeatable process with higher throughput (vs. manual labor) HIGH-DENSITY FIBER ARRAY PRECISION ALIGNMENT AUTOMATED LASER TERMINATION
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10 How TE is Engineering the Future of AI 01 Ecosystem Co-Innovation Accelerate innovation through ecosystem collaboration 02 Scalability for Growth Translate innovation into repeatable execution 03 Sustainable Engineering Design for performance, efficiency and lifecycle impact • Ecosystem partnerships spanning second-sourcing, co-development, and standards influence • Proven cross-licensing experience • Committed design partnership from concept to ramp • Global footprint expansion • Operations and engineering scalability • High-performance product portfolios • Committed to quality and rapid ramp • Enhanced manufacturing engineering processes • Product engineering sustainability – material, processes, lifecycle • Energy efficiency across engineering and operations PARTNER • SCALE • SUSTAIN
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© 2026 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. 11
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TE, TE Connectivity, TE connectivity (logo), EVERY CONNECTION COUNTS, ELCON, ICCON, RAPID LOCK, and FusionForge are trademarks owned or licensed by the TE Connectivity plc family of companies. Other product names, logos, and company names mentioned herein may be trademarks of their respective owners. While TE has made every reasonable effort to ensure the accuracy of the information in this document, TE does not guarantee that it is error-free, nor does TE make any other representation, warranty or guarantee that the information is accurate, complete, correct, reliable or current. TE reserves the right to make any adjustments to the information contained herein at any time without notice. TE EXPRESSLY DISCLAIMS ALL IMPLIED WARRANTIES REGARDING THE INFORMATION CONTAINED HEREIN, INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. In no event will TE be liable for any direct, indirect, incidental, special or consequential damages arising from or related to recipient’s use of the information. It is the sole responsibility of recipient of this information to verify the results of this information using their engineering and product environment. Recipient assumes any and all risks associated with the use of the information. Antenna performance may vary. TE is a component manufacturer, and customer and/or end-user is responsible for all end-use compliance and regulatory requirements, as well as suitability for end use determinations (including determining suitability of any mounting/adhesive solution). These marketing materials do not constitute an offer or agreement of sale, and TE Connectivity shall be bound by and subject to only those terms and conditions set forth in a written agreement referencing specific products and signed by an authorized representative of TE. ©2026 TE Connectivity. All Rights Reserved.