PDF 原檔：報告_OCP2026_Google_AMD_Meta_開放資料中心架構_20261015_original.pdf
講者公開簡報（OCP 官方 Recorded Content 頁提供下載）。文字以 PyMuPDF 逐頁抽取，
### p<n>為頁碼；圖表內容見原檔。
圖片清單（已驗證 2026-10-19）
| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_Google_AMD_Meta_開放資料中心架構_20261015_p4.png |
p4 | 真資料圖 | Open DC 密度基線表：Blended 12 kW/ft（2027）→25 kW/ft（2028+）；Peak IT 125→350 kW/ft（液冷 115→335）；Cluster 12 MW 下限→24 MW 偏好 |
報告_OCP2026_Google_AMD_Meta_開放資料中心架構_20261015_p6.png |
p6 | 真資料圖 | 列配置與間距規格：熱通道 54 吋、冷通道（面對面）82 吋、機櫃高 100 吋、深 71 吋、運輸通道 12 呎；天花板 2 busway 最低 18 呎 |
報告_OCP2026_Google_AMD_Meta_開放資料中心架構_20261015_p7.png |
p7 | 真資料圖 | 熱管理限制：Peak IT 液冷 335 kW/ft、氣冷 15 kW/ft；最大流速 3 m/s；管徑 1–4 吋在 1 lpm/kW（ΔT 15°C）與 1.5 lpm/kW（ΔT 10°C）下可支援 kW 對照表（如 2 吋 365／243 kW、4 吋 1459／972 kW） |
報告_OCP2026_Google_AMD_Meta_開放資料中心架構_20261015_p8.png |
p8 | 真資料圖 | Google 配置示意：4-busway 或 2-busway 剖面與等角圖，aisle pitch 23 呎或 26 呎，列功率密度對應 blended 25 kW/ft，列可支援至 800 kW 的 IT 機櫃 |
報告_OCP2026_Google_AMD_Meta_開放資料中心架構_20261015_p9.png |
p9 | 真資料圖 | NVIDIA 4 列 12.5 MW 區塊等角圖：最多 120 個 24 吋機櫃或 96 個 32 吋機櫃、每列最多 4 MW 冷卻、4 條 5000A busway（800VDC 轉換）、列長 68 呎、2 條水管（12 吋氣冷、24 吋溫水） |
報告_OCP2026_Google_AMD_Meta_開放資料中心架構_20261015_p11.png |
p11 | 真資料圖 | 建築模塊建議四欄：Row Infrastructure（高 16–18 呎、4 busway 或 2）、TAP Boxes（415/480V AC 與 125A/250A DC）、Row Manifolds（最大 4 吋、整合隔離閥）、Hot Aisle Containment（NVIDIA，4 MW/列） |
原始內容
p1
Ayan Majumdar HW Lead - Google Mike Sabotta Solutions Architect for Cloud and HPC system design - NVIDIA Moe Ghamary System Architect, Data center engineering-Google Paul Artman Director System Design - AMD Mike Edie Lead System Engineer - Meta Next-Generation ML Infrastructure: The Open DC Architecture AI OPEN DATA CENTER
p2
Panel Discussion Ayan Majumdar HW Lead - Google Maureen Tate Senior Solutions Architect for Datacenters - NVIDIA Moe Ghamary (Moderator) System Architect, Data center engineering-Google Paul Artman Director System Design - AMD Mike Edie Lead System Engineer - Meta
p3
• Rapid ML advancement requires evolving data center infrastructure. Google, Meta, NVIDIA, and AMD established the Open DC working group to develop a minimum set of standards for AI factories for 2028 and beyond • This initiative empowers the ecosystem to efficiently deploy mega-scale AI factories through collaborative, open-source standards. Next- Generation ML infrastructure boltPower Managing power densities from 125 kW/ft to 350 kW/ft with unified interfaces for redundancy. dns Physical Architectural guidelines for liquid-cooled environments, supporting >70-inch rack depths and >80-inch cold aisles. ac_unit Thermal Scaling advanced liquid cooling systems to support high-TDP accelerators.
p4
Establishes a unified timeline target spanning hardware deployments from 2027 through 2028. Unified Power & Cluster Density Metric Baseline 2027 Baseline Target 2028+ Target Blended DC Capacity Baseline 12 kW/ft 8 kW/ft Air-cooled 8kW/ft liquid-cooled 25 kW/ft 15 kW/ft Air-cooled 25 kW/ft liquid-cooled Peak IT Density 125 kW/ft 115 kW/ft liquid-cooled 350 kW/ft 335kW/ft Peak liquid-cooled Cluster Size Baseline 12 MW Minimum threshold 24 MW Preferred design baseline
p5
• Cluster capacity baselines (12-24 MW) • Minimum of 4 power blocks per data hall. • Supports high weight distributions for heavy high-density racks: • Maximum Rack Weight Limit: • 8,000 lbs (3,629 kg) over 28” W x 48” D (711 x 1219 mm). • Peak IT Weight (ML Rack + Sidecar): • 15,000 lbs (6,804 kg) over 56” W x 48” D (1422 x 1219 mm). Facility & Infrastructure Specifications
p6
Aisle Pitch Recommendation • Maintains recommended 24’ aisle pitch with front-justified racks in the cold aisle. Transport Aisle Clearance • 12’ transport aisle clearance to a design recommendation. Ceiling Height • 18 ft (5.5m) minimum for 2-busway configurations. 4-busway configurations/additional trays may require additional height. Row Layout & Clearance Dimensions Minimum Physical Boundaries Hot Aisle Width 54” (1372mm) Cold Aisle Width (Face-to-Face) 82” (2083mm) Rack Height 100” (2540mm) Rack Depth 71” (1803mm) Material Transit Aisle 12’ (3658mm)
p7
• Recommend a Peak IT Density power for sizing cooling for pod for ML racks • 335kW/ft liquid cooling and 15 kW/ft of air cooling • Recommend a Blended power approach for sizing cooling for pod for network, storage, xPU • 25 kW/ft liquid cooling and 15 kW/ft of air cooling • Recommend max fluid velocity 3 m/s based on ASHRAE standard • Multiple industry workstreams to test to enable support for higher velocities • Power support is a function of fluid velocity, inlet TCS temperature, and delta T Thermal Management & Cooling Limits Note: 1. Fluid speed based on ASHRAE Handbook—Fundamentals, Chapter 33: Pipe Sizing specify the limit as 10fps (3m/sec) 2. Industry available quick connects currently available at maximum 2” and preferred connection type currently. Diameter (inches) 1lpm/kW (delta T of 15°C) 1.5 lpm/kW (delta T of 10°C) 1 91 KW 61 KW 2 365 KW 243 KW 3 820 kW 547 KW 4 1459 KW 972 KW
p8
●AI standards designed to support different design manifestations Potential Configurations - Google ●4-busway or 2-busway configuration → driven by ceiling height restrictions ●23’ or 26’ aisle pitch depending on room constraints ●Row power density matching blended DC density of 25 kW/ft (blended ML, C&S, NW, Auxiliary) ●Rows Capable of supporting upto 800kW per IT racks ●Cooling capacity right sized to the power delivered within the row
p9
Potential Configurations - NVIDIA (4 row, 12.5MW block) Block Attributes •Up to 120 – 24” Racks or 96-32” Racks •Up to 4 MW of cooling per row •4- 5000 AMP Busways (800VDC transition) •Rows are 68’ Long •Space shown 98’ x 48’ (5000 SQFT) •Pairs of rows are on 24’ pitch •In-Row close coupled air cooling Water Feeds Two Water Feeds: • 12” – For Air-cooling • 24” – Warm Water Isolation Valves Fast Acting Isolation valves (IE: Leak Defense by Watts) Power Feeds 4 Power Feeds 5000 Amp AC or Future 800VDC
p10
Close Coupled Cooling - NVIDIA Configured Heights (Examples) ● 18’ – 4 Busways, 3 Cable tray, Local secondary loop ● 17’ – 4 Busways, 3 Cable tray ● 16’ – 4 Busways, 2 Cable tray Cooling Coils 8” Row Manifold for DLC 3 layers of cable tray 4 to make 3 busways (5000 Amp) 96” 54” 54” 24ft 17ft (16-18ft)
p11
Building Blocks - Recommendations Row Infrastructure ● 16’–18’ high ● 34.6’ Long (example) ● 4 Busways (4 to make 3) or 2 Busways ● 3 network trays ● Supports secondary manifold TAP Boxes ● Dual outputs ● Fits busways 18” apart ● Supports 415/480V AC (60A, 100A, 200A, 250A) ● 800VDC support (125A DC and 250A DC) ● Shunt trip support ● Direct power shelf connect Row Manifolds ● Up to 4” connection (6 locations) ● Configurable for 2” or 4” sizes ● Integrated isolation valves ● Built-in drip pans ● In-rack-CDU support option Hot Aisle Containment (NVIDIA) ● Supports 2 water temperatures ● 15kW Air Cooling / foot / side ● 6” main for Air (2.4 MW/pair) ● Dual 8” mains (4 MW/Row) ● Fully serviceable from underside ● 4200 CFM fans per foot
p12
• Adopt the minimum AI standards in base building design to support next generation ML payloads - Help create specifications for the building blocks that meet these standards - Help standardize the sub-systems and components! • Review v0.7 Open DC standard and provide feedback • Monthly feedback sessions starting in November. • v1.0 has future additions coming up - partnering with other workstreams to resolve next generation specifications • LVDC Workstream • Cooling Workstream Call to Action
p13
Thank You!