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報告_OCP2026_Intel_FUCHS_熱化學可靠度_20261015

PDF 原檔:報告_OCP2026_Intel_FUCHS_熱化學可靠度_20261015_original.pdf

講者公開簡報(OCP 官方 Recorded Content 頁提供下載)。文字以 PyMuPDF 逐頁抽取,### p<n> 為頁碼;圖表內容見原檔。

圖片清單(已驗證 2026-10-19)

檔名 頁 分類 親眼所見內容
報告_OCP2026_Intel_FUCHS_熱化學可靠度_20261015_p12.png p12 真資料圖 熱化學可靠度白皮書預覽:電氣短路失效模式(腐蝕沉積、導電膜、枝晶、絕緣劣化)對應硬體偵測 SIR/ECM/SEM-EDS、流體測試 ICP-MS 等與緩解策略
報告_OCP2026_Intel_FUCHS_熱化學可靠度_20261015_p13.png p13 真資料圖 熱化學可靠度里程碑時間軸:4Q26 銅腐蝕污染物門檻、2Q27 污染致熱阻變化、3Q27 PCB 環境誘發劣化、2Q28 系統級訊號完整性(DDR5);合作方含 UT Arlington、Intel、fluidIQ、Shell、ExxonMobil、Valvoline

原始內容

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Community Leadership Workstream Leadership Samantha Yates - Intel Bobby Glidwell - Magnalytix Brian Kinkade -Fuchs Punith Shivaprasad - Shell Betsy Cossette - ExxonMobil Beau Van Vaerenbergh - Oleon Immersion Reliability Community Update Cooling Environments Immersion Project

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Thermochemical Quality and Reliability Thermochemical Quality Detection of material incompatibilities between the fluid and hardware that degrade capability and performance. Material Incompatibilities Thermochemical Reliability Detection of hardware performance degradation due to deleterious reactions with fluid during the service lifetime. Fluid Contamination System Performance Degradation and Failures

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Immersion Reliability Workstreams Material Compatibility Leads: Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Meeting Time: Each 3rd Tuesday 8:00-9:00am PT 10:00-11:00am CT 17.00-18.00 CET Component Compatibility Leads: Beau VanVaerenbergh (Oleon) Brian Kinkade (Fuchs) Meeting Time: Each 1st Tuesday 8:00-9:00am PT 10:00-11:00am CT 17.00-18.00 CET Thermochemical Reliability Leads: Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Meeting Time: Each 2nd Tuesday 8:00-9:00am PT 10:00-11:00am CT 17.00-18.00 CET

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Material Compatibility Workstream Scope Workstream Leads Bobby Glidwell Director of Technology Magnalytix bobby.glidwell@ocproject.net Punith Shivaprasad Global Technical Lead: Liquid Cooling Shell punith.shivaprasad@ocproject.net Workstream Objectives ⮚Evaluate material compatibility across fluid classes ⮚Standardize testing methodologies for consistency ⮚Provide comparative reference tools for decision-making ⮚Investigate post-aging compatibility testing

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Whitepaper in Development: Material Compatibility in Immersion Cooling Rev 2.0 Updating the guidelines and creating clearer templates and guidance for every participant in the compatibility process. 01 GUIDELINES v2.0 Clarify the core document Simplify structure, definitions, and test- method guidance Incorporate v1.x lessons and community feedback Expand practical coverage across materials and fluids Make compatibility decisions clearer and more consistent 02 TOOLS UNDER DEVELOPMENT Create role-based templates Fluid manufacturers: report properties and compatibility data consistently Materials manufacturers: document composition, test results, and limits End users: capture use conditions, materials, fluids, and observations Common fields and examples make inputs easier to compare and reuse 03 GUIDANCE + NEXT STEPS Turn inputs into action Develop clear guidance for completing and using each template Consolidate document and template changes into the v2.0 draft Review usability and remaining gaps with the community Contribute examples, feedback, test results, or review expertise GOAL Version 2.0 should be easier to apply, better supported by data, and more directly tied to real immersion-system risk.

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Now Live: Material Compatibility Database THE LIVE EXPERIENCE Use the database. Compare candidates. Contribute evidence. Community-sourced screening information. Independent qualification remains essential. Compatibility answers, now easier to find. Live access to OCP wetted-material interaction data for single and two-phase immersion cooling. Search • Compare • Advise • Export • Contribute 570 compatibility observations 95 component profiles 6 fluid families Maintained by the OCP Material Compatibility Workstream SCAN TO OPEN THE TOOL Official OCP URL: [add when available]

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Material Compatibility Database: OCP Resource The roadmap focuses on reviewed contributions, versioned releases, and alignment with Material Compatibility in Immersion Cooling 2.0 guidance. NOW NEXT TOWARD V2.0 Open the public tool Search, filter, compare, export, system advice and reference guidance in one browser experience. Grow community evidence Structured submissions, OCP review and versioned releases keep contributions traceable and useful. Align with the workstream Refine application taxonomy, classifications, test conditions and mechanism tags as Version 2.0 guidance evolves. Community-sourced screening information • Independent qualification remains essential

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Component Compatibility Workstream Scope Workstream Leads Beau Van Vaerenbergh Principal R&D Engineer Oleon beau.vanvaerenbergh@ocproject.net Brian Kinkade Market Development Manager FUCHS SE brian.kinkade@ocproject.net Workstream Objectives ⮚To identify the server component and base-fluid combinations where performance of either is not outside of acceptance specifications ⮚To identify fluid contaminants values which are extracted from server components when exposed to base-fluids used for immersion cooling. -

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Whitepaper Published! Objectives • To standardize the material compatibility testing of functional server components to identify server component/base-fluid combinations where performance of the server component is not outside of vendor production acceptance specifications. • To identify fluid contaminants extracted from server components during component material compatibility testing. Key Elements • A risk-based component prioritization framework • Standardized soak conditions for single- and two-phase immersion cooling fluids • An integrated root cause analysis linking component failures to fluid contamination. • The methodology is applied to test cases such as cable assemblies and optical transceivers.

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What’s Next? ● Component & fluid selection ● Test conditions ● Qualitative risk assessment: low - medium - high ● Compile component & fluid characteristics. ● Compile component performance goals. ● Define low, medium and high-risk criteria and solicit feedback.

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Workstream Leads Samantha Yates Principal Engineer: Platform QnR Intel Corporation samantha.yates@ocproject.net Betsy Cossette Immersion Cooling Market Development ExxonMobil betsy.cossette@ocproject.net Thermochemical Reliability Workstream Scope Workstream Objectives ⮚Develop standardized thermochemical reliability test methodologies for IT hardware. ⮚Aggregate thermochemical reliability test data and failure modes from the OCP community ⮚Provide recommendations on immersion requirements

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Whitepaper in Development: Thermochemical Reliability of Server Hardware Thermochemical Reliability Failure Modes Mode Mechanism Hardware Detection Tests Fluid tests Mitigation Strategies Electrical shorts Corrosion deposits, conductive films, dendrites, insulation degradation SIR, ECM, SEM/EDS, Insulation resistance ICP-MS, electrical conductivity, water content, Dielectric breakdown voltage, particle count minimize polar contaminants & moisture ingress; corrosion-resistant materials/coatings SIR: surface insulation resistance ECM: electrochemical migration SEM: scanning electron microscopy Will IT hardware maintain reliable performance throughout its intended immersion service life? EDS: energy dispersive spectroscopy ICP-MS: Inductively Coupled Plasma Mass Spectrometry Preview: Equivalent Service Lifetime How to build an acceleration model Apply to reliability testing Assess reliability risk Extract from white paper White paper provides a framework to: Identify immersion-relevant failure modes Develop equivalent service lifetime acceleration models Execute immersion reliability testing Characterize hardware and fluid degradation Assess reliability risk over the intended service life • Component and Reliability Engineers • ODM System Designers/Engineers • Chemists Experts Needed:

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Industry-Academia Collaboration to Advance Immersion Cooling Thermochemical Reliability Copper Corrosion Contaminant Thresholds • First threshold dataset to the community • Sulfur, Halide and TAN contaminants study Environmentally Induced Degradation • Contaminant and corrosion by-product effects on PCB electrical reliability, with Magnalytix Thermal Performance Impact due to Contaminant • Thermal resistance changes due to contaminants induced copper corrosion 4Q26 2Q27 3Q27 2Q28 Signal Integrity at System Level • DDR5 and, plus fluid service lifetime models Milestone data released to the OCP community at each marker

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Beyond Cooling: Engineering for Reliability and Longevity Copper coupons aging with sulfur, acid and halide contaminants to establish critical concentrations threshold Different chemistries, three fluid Collaborators Surface analysis via XPS and chemical characterization using FTIR, ICP-OES,GCMS to identify and quantify corrosion by-products Evaluate Environmentally Induced Degradation by measuring changes in PCB electrical resistance and leakage current caused by corrosion by-products and contaminant-driven losses in surface insulation DDR5 rank margin variation vs contamination level and dielectric shift impact on high speed signaling Corrosion threshold curves, acceleration models, lifetime estimators, and safe operating windows Contamination Thresholds Analytical Characterization Functional Reliability Testing Signal Integrity Testing Fluid Service Lifetime Assessment

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Call to Action – Contributors Needed! Material Compatibility Leads: Bobby Glidwell (Magnalytix) Punith Shivaprasad (Shell) Meeting Time: Each 3rd Tuesday 8:00-9:00am PT 10:00-11:00am CT 17.00-18.00 CET Component Compatibility Leads: Beau VanVaerenbergh (Oleon) Brian Kinkade (Fuchs) Meeting Time: Each 1st Tuesday 8:00-9:00am PT 10:00-11:00am CT 17.00-18.00 CET Thermochemical Reliability Leads: Samantha Yates (Intel) Betsy Cossette (ExxonMobil) Meeting Time: Each 2nd Tuesday 8:00-9:00am PT 10:00-11:00am CT 17.00-18.00 CET

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Thank You!