報告_OCP2026_UNICOM_浸沒式IT設備工作組_20261015

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圖片清單（已驗證 2026-10-15）

原始內容

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By Austin Hipes (UNICOM Engineering) Austin.Hipes@ocproject.net Immersion-ITE Technical Committee Chair IT Equipment Workstreams Update Cooling Environments Immersion Project

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The ITE Committee concentrates on the specific needs and challenges associated with integrating IT equipment with immersion cooling technologies. This includes designing IT hardware that is optimized for advanced cooling methods, assessing the impact of cooling technologies on IT equipment performance, and developing guidelines for IT equipment installation, configuration, and maintenance in environments using immersion cooling solutions. ITE Design Guidelines Workstream leads: Austin Hipes (UNICOM Engineering) and Peter Liu (ASMC) 2nd Monday 8:00-9:00am PT / 17:00-18:00 CET / 23:00-24:00 CST Zoom link ITE Advanced Cooling Techniques Workstream leads: Andy Richenderfer (Lubrizol), Florian Hudelmaier (Wieland) 1st Wednesday 8:00-9:00am PT / 17:00-18:00 CET / 23:00-24:00 CST Zoom link Signal Integrity Workstream leads: Kai Wang (Intel) and Tina Bao (TE) Each 1st Monday 8:00-9:00am PT / 10:00-11:00am CT / 17.00-18.00 CET Zoom link Workstreams at a Glance

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Immersion cable specification work is underway • Component validation project for immersion ITE • Peter Liu has offered to lead the project under ITE Design Guidelines • Additional component classifications can follow New Project: Immersion Cable & Component Validation Data cables and connectors operating below the dielectric-fluid surface

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• Revision 2.0x refresh is underway • Last update was made in December 2020 • Numerous industry changes • Larger community • Wider adoption of immersion cooling • Higher power silicon available today • Customers are looking for a degree of standardization and interoperability • Major refresh underway • Participation needed across the industry • Server OEMs & Integrators • ITE Customers • Silicon manufacturers • Immersion Solutions Providers • Regulatory organizations • Fluid providers • Etc. Why the ITE Guidelines Needs a Major Refresh

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• Last update was made in December 2020 • Numerous industry changes • Larger community • Wider adoption of immersion cooling • Higher power silicon available today • Customers are looking for a degree of standardization and interoperability • Refresh underway • Sections 1, 2, 3 & 4 wrapping up (under review) • Section 5 under development (Best Practices & Principals) • Working document: • Participation needed across the industry • Server OEMs & Integrators • ITE Customers • Silicon manufacturers • Immersion Solutions Providers • Regulatory organizations • Fluid providers • Etc. ITE Design Guidelines: Revision 2.0x Progress Guidelines 2.0x

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Focused on thermal optimization techniques and design optimizations for high TDP silicon (>500W). For fluid, thermal solution, and ITE designers. First Reference Design for Targeted Flow Heatsink published https://www.opencompute.org/documents/ocp-spec-targeted-flow-efficiency-heat-sink-v1-0-pdf Advanced Cooling Techniques: Current Focus ACT Miroboard

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First project under development Thermal Performance Test Specification Developing reference test platform and methods for fluids, heatsinks, and TIMs for industry use and comparison Thermal Performance Test Specification Outline.docx Specification authoring has begun (sections covered) • Hardware • Instrumentation • Componentry • Controls, Protocols, and Test Matrix • Benchmarking • Opportunities for OCP members to submit SPECs for thermal solutions for publication • Eg. Targeted Flow Heatsinks, hybrid immersion cold-plates, etc ACT Project: Thermal Performance Test Specification

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Continued testing of SI Margin Testing of DDR / PCIe / Ethernet / Optical • Good results overall, but margins are shrinking in same cases • Crosstalk can be reduced in other cases, such as DDR5 • Focus beginning on frequencies >32GHz (e.g. 224G PAM4 @ 56 GHz) • Focus on higher frequency test results for next whitepaper revision Research Into Acceptable Test Methods • Frequences Required • Test Methodologies and Equipment • Resonator Cavitary Types • Temperatures • Frequency Test Points Signal Integrity Update

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New System Emissions (EMI) comparisons, measured in air and immersion environments contributed. https://drive.google.com/file/d/1gihfAcUGMkmk9S_QJm75hCDz_VDQ0jhM/view?usp=sharing Signal Integrity Whitepaper: New EMI Evidence

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Advanced Cooling Techniques Volunteers needed with experience and interest in the design, testing, and validation of thermal solutions and techniques for immersion cooling of silicon >500W. Design Guidelines for ITE Volunteers needed with experience in immersion ITE design, testing, and validation. Help establish industry guidelines and standards for the development, integration, deployment, and servicing of immersion ITE. Signal Integrity Volunteers needed with experience and interest in SI testing, SI simulation, PCB/cable/connector design in immersion environments. Explore and understand how immersion affects SI and how to mitigate possible negative impacts. Get Involved: Join the ITE Workstreams