報告_OCP2026_TE_1MW機櫃匯流排介面_20261015

PDF 原檔：報告_OCP2026_TE_1MW機櫃匯流排介面_20261015_original.pdf

講者公開簡報（OCP 官方 Recorded Content 頁提供下載）。文字以 PyMuPDF 逐頁抽取，### p<n> 為頁碼；圖表內容見原檔。

圖片清單（已驗證 2026-10-19）

原始內容

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Hal Loket, Technologist, TE Connectivity Aniket Singh, Global Product Manager, TE Connectivity Enabling 1MW+ IT Gear Rack Power ] RACK & POWER

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• Introduction • Interface (Design Overview) • Touch Safety & Mating Sequencing • Thermal Testing and Simulation Data • Future Technology • Call to Action Agenda Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification.

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• Rack power needs are increasing due to chip TDP and density requirements • New rack power architectures and standards needed to enable this rise • 1MW+ latest rack architectures Introduction 2MW 2MW 2021 2024 2027 100kW 1MW 1.5MW+ Rack Power Level

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• Acknowledgement: Diablo OCP standard driven by Meta, Microsoft, and Google • Voltage increase from 48V to 800V net keeps current levels in check • Primary connectivity focus is the power rack in the sidecar, AC & DC input connections • Our intent is to help fill the gap for the busbar mating interface on the IT gear rack Introduction 2MW 2MW Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification.

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800VDC DC IT Rack Busbar Interface 35mm Scalable depth 0-800VDC 250 kW – 1.6 MW+ Touch Safe Design 35mm = ORV3 width Scalable depth for higher power needs IT Rack Busbar Interface follows standard 35mm ORv3 Busbar width and enables 0-800VDC PE 0V 800V - PE cross section can be optimized to meet various fault current requirements Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification.

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200 mm 130 mm 80 mm 500 kW 750 kW 1 MW 35mm 35mm 35mm Power capacity Rated current Busbar Dimensions (LWH) 500 kW ~625 A 2134mm * 35mm * 80mm 750 kW ~937 A 2134mm * 35mm * 130mm 1 MW ~1250 A 2134mm * 35mm * 200mm Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification. 800V DC IT Rack Busbar Interface – Scalable Depth

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Busbar Connector UL 62368 Finger Probe Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification. Touch Safe Design Considerations

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• Mating and un-mating sequence staggers the power and sense pin contacts First Mate Last Break (PE) | Last Mate First Break (Sense) Connector alignment PE Pre-charge (optional) 0V 800V Presence / Sense Pin Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification. Mating Sequence

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• Current range: 625A – 1250A • T-rise simulations (<30 °C) • Ambient temperature: 55°C • Without airflow • T-rise is 29.27°C Max. Current (A) Power T-rise (°C) 625 500 kW 29.27 937 750 kW 28.22 1250 1 MW 29.76 • 1 MW / 800V • Current: 1250A • T-rise is 29.76°C Max. • T-rise is 28.22°C Max. • 500 kW / 800V • Current: 625A • 750 kW / 800V • Current: 937A 44 .5 44 .5 44 44 43 .5 PDU (Power Input) 43 .5 43 43 42 .5 PDU (Power Input) 42 .5 42 42 41 .5 41 .5 41 41 40 .5 40 .5 40 40 39 .5 2.5OU IT Tray 39 .5 39 39 38 .5 38 .5 38 38 37 .5 37 .5 37 2.5OU IT Tray 37 36 .5 36 .5 36 36 35 .5 35 .5 35 35 34 .5 2.5OU IT Tray 34 .5 34 34 33 .5 33 .5 33 33 32 .5 32 .5 32 2.5OU IT Tray 32 31 .5 31 .5 31 31 30 .5 30 .5 30 30 29 .5 2.5OU IT Tray 29 .5 29 29 28 .5 28 .5 28 28 27 .5 27 .5 27 2.5OU IT Tray 27 26 .5 26 .5 26 26 25 .5 25 .5 25 25 24 .5 2.5OU IT Tray 24 .5 24 24 23 .5 23 .5 23 23 22 .5 22 .5 22 2.5OU IT Tray 22 21 .5 21 .5 21 21 20 .5 20 .5 20 20 19 .5 2.5OU IT Tray 19 .5 19 19 18 .5 18 .5 18 18 17 .5 17 .5 17 2.5OU IT Tray 17 16 .5 16 .5 16 16 15 .5 15 .5 15 15 14 .5 2.5OU IT Tray 14 .5 14 14 13 .5 13 .5 13 13 12 .5 12 .5 12 2.5OU IT Tray 12 11 .5 11 .5 11 11 10 .5 10 .5 10 10 9.5 2.5OU IT Tray 9.5 9 9 8.5 8.5 8 8 7.5 7.5 7 2.5OU IT Tray 7 6.5 6.5 6 6 5.5 5.5 5 5 4.5 2.5OU IT Tray 4.5 4 4 3.5 3.5 3 3 2.5 2.5 2 2.5OU IT Tray 2 1.5 1.5 1 1 0.5 0.5 0 0 Generic Rack Layout 800V DC IT Rack Busbar - Simulation Data Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification.

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T rise results and test setup 0 5 10 15 20 25 30 M1 M2 M3 M4 M5 M6 M7 M8 M9 M10 T-rise 120 mins Ambient 25C Bottom Busbar Connector Bottom Busbar Top Busbar Connector Top Busbar T-rise test summary – 625A | 500 kW • Max T rise across all measurement points = ~27 °C • Physical testing within ~6% of simulation data • All components meet 30 °C T-rise TC 625 Clip Shorted 5000A/set 625A M2 M1 M3 M6 M10 M4 M5 M7 M9 M8

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• ORv3 -> Diablo voltage increase leads to reduced current requirements. • Busbar sizing and weights can remain within reasonable limits...to a point • Liquid cooling provides a pathway for improved current density while limiting conductor size & t-rise Future Technology Scaling for Future >> 800V Liquid Cooled busbar Note: The TE products shown and discussed in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification.

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• Determine next steps for interface standardization/contribution • Future study for liquid cooled version to support highest power levels • Size & weight optimization • Leverage 48V LCBB design efforts • Where to find additional information: • OCP Rack & Power • OCP Contributions Database Call to Action OCP Rack & Power link

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Thank You!