PDF 原檔：報告_OCP2026_Nokia_NPO技術選擇_20261015_original.pdf
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| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_Nokia_NPO技術選擇_20261015_p2.png |
p2 | 真資料圖 | 四級光互連能耗階梯：Re-timed pluggable ~15、LRO ~10、LPO/NPO/CPO ~6、Integrated optics with die-to-die <4（pJ/bit link power）；下表服務模式：Pluggable 熱插拔模組、NPO 可替換光引擎、CPO 雷射外置、CIO 封裝級 |
報告_OCP2026_Nokia_NPO技術選擇_20261015_p4.png |
p4 | 真資料圖 | 調變器五欄熱圖比較：InP EML/EAM、InP MZM、SiPh MZM、SiPh MRM、TFLN MZM 對驅動電壓、EO 頻寬（400G/lane 餘裕）、長度、損耗、熱敏感度，色階標 Best 至 Weakest；結論列 TFLN 領先速度、損耗與穩定性 |
報告_OCP2026_Nokia_NPO技術選擇_20261015_p5.png |
p5 | 真資料圖 | 雷射位置四欄比較（單石、PIC 整合、封裝內、外部 ELSFP）：雷射到調變器損耗 0.25／0.5–1／1.5／2 dB，熱位置、維修方式、RIN、製造方式；結論稱內部雷射可免 PM 光纖、改善 200T 交換器世代的前面板 ELSFP 密度 |
報告_OCP2026_Nokia_NPO技術選擇_20261015_p7.png |
p7 | 真資料圖 | Nokia 6 吋 InP 平台：Sunnyvale 3 吋、San Jose 6 吋（新）、Arizona 6 吋（新）三座 InP 廠；右為 Nokia 交換器搭 NPO 引擎示意圖（四邊各排 12.8T 引擎）；文字稱客戶要求 2030 年前 InP 產量約 10 倍 |
原始內容
p1
Architecting Near-Packaged Optics for AI Datacenters: Key Technology Choices and Trade-offs Armaghan Eshaghi Director, Optical Platform Solutions, NOKIA
p2
Re-timed pluggable 1 SerDes + 1 DSP ~15 pJ/bit link power Host SerDes plus a DSP in the module LRO 1 SerDes + ½ DSP ~10 pJ/bit link power DSP on the Tx side only LPO / NPO / CPO 1 SerDes ~6 pJ/bit link power Host SerDes only; shorter channel than LPO Integrated optics with die-to-die interfaces 0 SerDes < 4 pJ/bit link power Optics on the die; years from volume NPO: Same energy class as CPO. Unlike CPO, the optical engine stays a part you can replace NPO: Serviceable CPO with Internal Laser Option Pluggable NPO CPO CIO Service model Hot-swap module Replaceable engine Laser externalized Package-level
p3
Three coupled choices define an NPO engine Modulator InP (EAM / MZM) TFLN (MZM) SiPh (MZM / MRM) Laser Monolithic (InP) Integrated on PIC In-package, near OE External laser source Packaging & Assembly Host attach OE socket Thermal path Assembly Each choice trades Performance · Thermal management · Serviceability
p4
No modulator wins on every axis Best Good Fair Weakest Criterion InP EML / EAM InP MZM SiPh MZM SiPh MRM TFLN MZM Drive voltage Vdrive (EAM, MRM), Vπ (MZM) Low High Lowest Low EO bandwidth Headroom at 400G/lane High High RC-limited Moderate Highest Length Modulator section Short Moderate Long Smallest Longest Loss Incl. coupling Moderate Moderate Higher Moderate Lowest Thermal sensitivity Drift and tuning needs May need TEC May need TEC Near-athermal Active tuning Excellent TFLN leads on speed, loss and stability; InP pairs low drive and high speed with a native laser; silicon trades Vπ/thermal control for scale. Low
p5
Laser Placement and Trade-offs Distance from modulator → Internal (Monolithic) Internal (Integrated on PIC) Internal (In-package) External source (ELSFP) Optical budget lowest laser-PIC coupling loss -- 0.25dB loss laser-to-mod One bonded interface; 0.5~1dB loss laser-to-mod Micro-optic coupling; 1.5 dB loss laser-to-mod Fiber and connectors; highest loss and laser power – 2 dB loss ELSFP-to-mod Thermal Laser in the engine heat zone Laser in the engine heat zone Laser in the engine heat zone Laser at the cooler front panel Service Replace the engine Replace the engine Replace the engine Replace the laser in the field Laser RIN Good Good Great Great Manufacturing Single InP wafer Two platforms; yield compounds Known-good, burned-in laser die Shared source (4-16 lanes); PM fiber handling Internal lasers offer simpler system design, less reliance on UHPL, remove PM fibers, and help with front panel ELSFP density specially for 200T switch generation
p6
Packaging sets the power, thermal and service model Host Attach • OE on the ASIC substrate (connectorized) • OE on the ASIC main board • OE on paddle/interposer card OE Socket • 2-piece connector: CPX Type 1/2 (MSA) and other proprietary approaches • Soldered down to paddle card Metal-contact compression LGA Elastomer membrane with metal contacts Conductive elastomer (aligned particle columns, conductive polymer) Thermal Path Share the ASIC cold plate; keep lasers cool. A cold plate works only if the heat path is designed in. Assembly Known-good-die lasers and PICs; wafer-level test. Passive alignment and automation for volume.
p7
Nokia: 6-inch InP platform LASERS Monolithic Internal External MODULATORS InP 3-inch · Sunnyvale 1st InP fab 6-inch · San Jose 2nd InP fab · New 6-inch · Arizona 3rd InP fab · New SiPh TFLN Manufacturing scale and performance will pick the winners A design that can't be built at hyperscaler volume won’t have a chance. → Customers are asking for ~10× InP volume by the end of the decade. → Nokia is investing in 6-inch manufacturing to significantly scale capacity. Nokia DC Switch with NPO Engines
p8
Takeaways 1 NPO sits in the same energy class as CPO, with the optics outside the ASIC package: the near-term, serviceable path. 2 Laser choice and modulator choice are related: InP pairs natively with monolithic lasers; TFLN and SiPh need integrated/in-package/external sources. 3 A replaceable engine outside the host heat zone makes on-engine lasers viable again; external lasers remain the hedge for the hottest, densest scenarios. 4 The winners will be the engines that can be packaged, cooled and built at volume, not just the best- performing devices.
p9
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