PDF 原檔：報告_OCP2026_NVIDIA_800VDC端到端系統需求_20261015_original.pdf
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| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_NVIDIA_800VDC端到端系統需求_20261015_p5.png |
p5 | 真資料圖 | 儲能位置與需求表：800 VDC 鏈上標 1 機櫃本地、2 整流器（SST+ESS）、3 ESS 三個位置，右表列各事件所需 J/kW GPU、重複率（如 EDPP GPU 37.5 J／10 Hz、低壓穿越 250 J、Idle 1 秒 1000 J、電網中斷 2 小時 7.2 MJ），並註明需增加母線與斷路器電流需求 11% |
報告_OCP2026_NVIDIA_800VDC端到端系統需求_20261015_p7.png |
p7 | 真資料圖 | DC/DC Power Shelf 機櫃行為參數表（4M3 峰值 92.6 kW／穩態 71.3 kW／閒置 20.0 kW、轉換器額定 95 kW、輸入斜率 0.6 A/μs、輸入電容 26 μF/kW）與輸入阻抗、輸出至輸入轉移函數曲線 |
報告_OCP2026_NVIDIA_800VDC端到端系統需求_20261015_p8.png |
p8 | 真資料圖 | 800 VDC 時間—電壓耐受曲線（V2）：正常工作區在 800 V ±5%，900 V 以上為禁止（可能損壞），SSCB 或 2N 饋電+MCCB 對應 3 ms、N 饋電 MCCB 對應 20 ms 的可能輸出中斷區，並標示 IEC61000-4-5 2 kV 差模突波與 TVS 箝位；左側另有無箝位電感負載電路與 IEC61000-4-5 突波波形（1.2/50 μs、8/20 μs）示意 |
報告_OCP2026_NVIDIA_800VDC端到端系統需求_20261015_p10.png |
p10 | 真資料圖 | 800 VDC 配電最低要求表與曲線：典型等效輸入電容 26 μF/kW、穩定性所需最小 12 μF/kW、最大配電電感 250 μH／125A 線纜與 5 μH／1 MW 區塊；右圖為電容對可配電長度（100 μF/kW 約 243 m） |
報告_OCP2026_NVIDIA_800VDC端到端系統需求_20261015_p13.png |
p13 | 真資料圖 | 機櫃標準化啟動序列：Tapbox/來源與連接器的訊號線路圖、導通條件表（800 VDC ±5%、IMD、HVIL、水溫入口 <45 °C／出口 <85 °C 等，多項 TBD）、Walk-in 計時器 10 秒、狀態機 |
報告_OCP2026_NVIDIA_800VDC端到端系統需求_20261015_p16.png |
p16 | 真資料圖 | 接地方案比較表：實接地、高阻中點接地（紅框標示）、浮接三種在保護位置、事故能量、偵測難度、暫態過電壓、漏電流與挑戰（實接地限制母線約 26 m、機櫃至來源 7 mΩ）的比較 |
原始內容
p1
Jared Huntington Power Architect, Nvidia Mike Tu Principal Electrical Engineer, Nvidia Defining End-to-End 800 VDC System Performance Requirements AI OPEN DATA CENTER: Power Distribution
p2
• Interoperability is a requirement for industry to deploy quickly • Stable and defined 800 VDC bus behavior • Scalable power for different generations and use cases Simplifying the problem Source (MV->800V) Load Z3-4 1 2 3 Z1-2 Busway RPP DC/DC Power Shelf 800 VDC PDB SST Power Rack MV Distribution …
p3
• Where do we put energy storage and what are requirements? • Rack input electrical interface • What distribution impedance can be supported? • Rack startup negotiation • Grounding • Protection What do we need to lock down?
p4
GPU Dynamic Load Average Power (TDP) Idle EDPP 150%, 50 ms EDPP 180%, 400 µs
p5
Energy Storage Location 1 2 3
p6
Skin Effect
p7
Rack Behavior – DCDC Power Shelf Parameter Unit Value Power consumption peak (4M3) kW 92.6 Power consumption steady state (4M3) kW 71.3 Power consumption idle (4M3) kW 20.0 Power consumption peak (4M3 non-redundant) kW 123.5 Power consumption steady state (4M3 non-redundant) kW 95.0 Power consumption idle (4M3 non-redundant) kW 26.6 Converter Rating kW 95 Input slew rate per whip A/μs 0.6 Input Capacitance µF/kW 26 Input Impedance Output to Input Transfer Function
p8
DC Voltage Requirements IEC61000-4-5 – Surge Requirements Unclamped Inductive Load
p9
Modeling and Stability
p10
800 VDC Distribution Requirement
p11
Distribution Model
p12
• Simulation is the first step • Small signal stability check w/ distribution impedance • Large signal distribution check • Stability margin check • DC Time / Voltage withstand curve check at load • Single component validation • Single SST Module • DC/DC Power Shelf • Simulated max designed distribution impedance • Pilot builds and system bringup Validation
p13
Rack Standardized Startup Sequence
p14
800 VDC Arc Fault Protection
p15
800 VDC Personnel Protection
p16
Grounding
p17
• Update DC Voltage Withstand curve to allow for SSCB / IEC Surge • Standardize on rack startup sequence and checks • Minimum filter requirements • Small signal and large signal modeling is required to ensure stability • Open models should be published with specifications • Impedance vs. frequency plots for cables and busways and inductance will be limiting factor for dynamic loads Call to Action
p18
Thank You!