報告_OCP2026_Lumentum_CPO外部雷射源架構_20261015

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圖片清單（已驗證 2026-10-19）

原始內容

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OCP SPECIAL FOCUS: PHOTONICS Christian Urricariet Senior Director of Product & Strategic Marketing Lumentum External Laser Source Architectures for Deployable CPO-Based AI Networks

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• CPO adoption was first justified by energy efficiency and bandwidth density. • At AI scale, reliability and service model expected to become equally important. • Optical failures can affect realized cluster utilization, not just component yield. • The question shifts from “Can CPO work?” to “Can CPO be operated?” CPO: From Energy Efficiency to Deployment Readiness Power Savings: Pluggables → CPO • ~30W → ~9W per port() • ~3.5x improvement() • Lower electrical loss from shorter ASIC-to-optics traces • Optimized Serdes – No DSP Link stability Fault containment Fast field resolution Higher cluster availability CPO adoption may depend on delivering power savings without compromising reliability, serviceability, or operational control. (*) Lumentum illustrative estimates; results may vary by configuration.

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• Shorter electrical paths improve power efficiency and bandwidth density. • The optical engine (OE) moves closer to high-value silicon. • Service access, thermal coupling, and failure-domain impact become first-order design considerations. The optical architecture must be treated as part of the system design, not just as a module-placement choice. Moving Optics Closer to Silicon Changes System Boundary • Faceplate serviceable • Longer electrical path ASIC Substrate PCB PCB Optical Engine Connector Transceiver Module Pluggable Optics • Optics adjacent to the ASIC package (socketed or board-mounted) • Reduced electrical loss ASIC Substrate PCB Optical Engine Substrate Near-Packaged Optics (NPO) • Optical engine integrated on ASIC package • Minimum electrical I/O ASIC Substrate PCB Optical Engine Co-Packaged Optics (CPO)

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Laser Placement Is a Separate Architecture Axis Laser Co-located with OE (ILS) • Short optical path (PMF) • Fewer optical interfaces • Tighter thermal coupling • Harder field replacement • Service boundary moves inward Board-level External Laser Source (ELS) • Thermal separation from ASIC • Independent laser optimization • Not faceplate serviceable • PM fiber / optical power delivery complexity Faceplate ELS / ELSFP • Faceplate serviceable • Thermal separation from ASIC • Independent laser optimization • Sparing / replacement flexibility • PM fiber / optical power delivery complexity • OE placement: Where is the optical engine relative to the xPU? (Pluggable vs. NPO vs. CPO) • Laser placement: Where is the CW source relative to the OE, thermal zone, and service boundary? • The tradeoff is optical power delivery complexity versus serviceability, thermal isolation, and failure containment.

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• ELS/ELSFP provides CW/UHP optical power to silicon photonics optical engines from outside the CPO package environment. • The laser source becomes independently serviceable, monitorable, and optimizable. • Laser thermal design is decoupled from the ASIC/package thermal zone. • The system designer gains new options for sparing, redundancy, optical power distribution, and failure- domain containment. External Laser Source Architecture: What Changes • Service boundary at the faceplate • Thermal boundary away from the ASIC hot zone • Laser optimization boundary independent from ASIC • Failure recovery domain defined at system level

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• The following system-level metrics are proposed as important considerations for evaluating CPO deployment readiness: • As these requirements evolve, laser placement becomes an architectural lever and not just a component choice. Deployment Metrics Beyond Power per Bit Optical power delivery Power / wavelength, loss budget, aging margin Thermal envelope Laser temp, ASIC isolation, cooling assumptions Reliability target Laser FIT, module FIT, system qualification Serviceability FRU boundary, faceplate access, replacement workflow Telemetry / RAS Optical power, temperature, alarms, fault isolation Recovery domain Sparing, redundancy, MTTR, workload impact

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• Deployable CPO requires more than an ELSFP form-factor module. • Laser-source readiness depends on technology heritage, thermal design, qualification, burn-in, and manufacturing control and readiness. • High-power operation must be demonstrated with stability and reliability at data center conditions. • Lumentum’s DWDM UHP/ELSFP platform is one example of applying proven laser-platform heritage to CPO external light sources. Evidence Point: Reliability Designed into the Light Source Platform

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• CPO is expected to be a near-term deployment path for certain scale-out architectures, e.g., NVIDIA announced CPO-based Spectrum-X / Quantum-X switches using ELS. • As OEs move closer to accelerators/scale-up, laser-source placement, service boundary, telemetry, and recovery domains remain system-level decisions, based on how the readiness metrics evolve. • Emerging architecture discussions are treating photonics as platform infrastructure rather than isolated optical components. • This talk does not endorse one implementation; it argues that laser- source placement should be evaluated as part of deployability, reliability and serviceability for every application and/or system generation. From Switch CPO to Future Scale-Up CPO Architectures

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• Problem to solve: CPO adoption needs system-level requirements for external laser source deployment, not only component specifications. • How to get involved: Engage in relevant OCP Photonics / AI systems / platform- integration discussions on ELS serviceability, thermal envelopes, telemetry, and recovery domains. • Where to find more information: • OIF ELSFP implementation agreement. • OCI MSA and Open-CPX MSA. • Lumentum CPO / ELSFP technical materials. • OCP project pages / contribution database. CTA: Define Deployable CPO Laser-Source Requirements

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Thank You!