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報告_OCP2026_緯穎_華擎_Meta_兩相液冷標準化_20261015

PDF 原檔:報告_OCP2026_緯穎_華擎_Meta_兩相液冷標準化_20261015_original.pdf

講者公開簡報(OCP 官方 Recorded Content 頁提供下載)。文字以 PyMuPDF 逐頁抽取,### p<n> 為頁碼;圖表內容見原檔。

圖片清單(已驗證 2026-10-19)

本簡報僅 5 頁,皆為講者名單、議題條列與號召頁(文字卡),無真資料圖,未存附件。

原始內容

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Jiu Xu, Thermal Engineer, Infra Hardware Design, Meta Powpow Wu, Thermal Engineer, ASRock Rack Remco Van Erp, CEO and Co-Founder, Corintis Jake Hsieh, Thermal Engineer, Wiwynn Corporation My Truong, Chief Product and Technology Officer, ZutaCore Samer Saab, Business Development Director - Advanced Liquid Cooling, Chemours Reducing Operational Complexity Through Standardized Two-Phase Liquid Cooling for AI Infrastructure COOLING: COLD PLATE

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Panel Discussion Jiu Xu Thermal Engineer, Infra Hardware Design, Meta Remco Van Erp CEO and Co-Founder, Corintis Powpow Wu Thermal Engineer, ASRock Rack Jake Hsieh Thermal Engineer, Wiwynn Corporation Samer Saab BD Director advanced cooling, Chemours My Truong Chief Technology and Product Officer, ZutaCore

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• Why is two-phase coming back into the forefront? • Operational Realities at Hyperscale • The Hardware OxM Dilemma • Where to Standardize First? • Navigating Market Realities Topics for Discussion

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Help turn two-phase cooling into standardized AI infrastructure. • Join the OCP Cooling Environments Project • Validate two-phase cooling across real-world platforms and deployments • Contribute requirements, data, and lessons learned • Align on interfaces, specifications, and deployment standards • Scale from custom solutions to an open, interoperable ecosystem Call to Action The technology is ready. Now the ecosystem needs to standardize around it. COOLING COLD PLALES

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Open Discussion