PDF 原檔：產業_SEMICON2026矽光子論壇_TSMC簡報_20260831_original.pdf
原始內容
How COUPE Redefines AI Interconnects
Aug 31, 2026
TRANSFORM TOMORROW
Outline
- Scaling for AI Growth
- What is COUPE?
- COUPE's Performance and next steps
- Conclusions
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Scaling for AI Growth
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AI Token growth accelerating computing demand
- ⚫ According to Goldman Sachs, driven by the rise of agentic AI, global AI token usage is projected to surge 24x by 2030, reaching 120 quadrillion tokens.
- ⚫ To support this soaring demand, optical transmission performance is critical.
Data: Goldman Sachs
A 24x increase mainly driven by agentic Al 2026 - 2030
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AI Bottleneck: I/O Wall
- ⚫ I/O Wall:
- AI compute power (Logic) surges at 3X every 2 years, But I/O bandwidth scales at only 1.4X.
- How to increase I/O transmission performance is the key.
https://www.idtechex.com/en/research-report/silicon-photonics-and-photonic-integrated-circuits/1151
Nvidia Datasheet: (H200, B200): https://www.nvidia.com/en-us/data-center/h200/; https://www.nvidia.com/en-us/data-center/hgx/
NVIDIA GTC 2026 Keynote, https://www.nvidia.com/gtc/keynote/
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Optical Interconnect for Scale out and Scale up
- ⚫ Traditional copper is constrained to short distances under high-frequency operation.
- ⚫ By using optical transmission, the signal reach can be extended, which enables the scale-up and scale-out application.
Scale Up
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CPO-MCM and CPO-OOI
- ⚫ CPO-MCM : Adopts a Multi-Chip Module (MCM) approach, integrating optical engines on the substrate.
- ⚫ CPO-OOI : Directly integrates the optical engine onto the XPU's interposer
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From Copper to CPO
- ⚫ CPO and OOI(Optical on Interposer) delivers a 4x~10x boost in power efficiency and a 10x~20x reduction in latency compared to Cu.
- ⚫ A highly integrated, low-loss Optical Engine is the key.
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TSMC Integrated Platform for AI
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What is COUPE?
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CO mpact U niversal P hotonic E ngine (COUPE)
- ⚫ COUPE leverages SoIC-bond stacking to integrate advanced logic (EIC) and PIC.
- ⚫ Featuring a proprietary optical path design and components, such as Si uLens and Cu BMR (Backside Metal Reflectors).
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COUPE Key Features
- ⚫ COUPE-GC (Grating Coupling): Si ulens, Cu BMR, and Si/SiN GC.
- ⚫ COUPE-EC (Edge Coupling): EC facet and SiN tip.
COUPE-GC
Common Features
COUPE-EC
GC Key Features
Si lens
Grating Coupler (GC)
Metal Reflector (MR)
COUPE Critical Devices in Tx/Rx
- ⚫ Transmitter (Tx): 1DGC, Tip Coupler, and Micro-Ring Modulator (MRM).
- ⚫ Receiver (Rx): 2DGC, Tip Coupler, and Ge Photodetector (PD).
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TSMC Process Design Kit (PDK) for Photonics Devices
- ⚫ TSMC provides a complete device PDK to help customers design SiPh and shorten their time-to-market.
How COUPE Scales Bandwidth?
- ⚫ Bandwidth per COUPE = (Lane Speed) x (Number of Lanes) x (WDM)
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COUPE Bandwidth Scaling: Fast and Narrow
• Bandwidth per COUPE:
• Scaling Strategies:
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COUPE Bandwidth Scaling: Slow and Wide
• Bandwidth per COUPE:
• Scaling Strategies:
COUPE's Performance and next steps
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Boosting MRM Bandwidth
- ⚫ Optimize inductive peaking, MRM and EIC driver optimization to improve MRM bandwidth by ~1.8x from simulation.
Inductive peaking optimization with MRM and ElC driver optimization
GC Efficiency Improvement
- ⚫ From 2025 to 2026, COUPE 1DGC and 2DGC insertion losses can be improved by 5.3% and 11%, respectively.
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EC Efficiency Improvement
- ⚫ From 2025 to 2026, improve SiN tip Polarization Dependent Loss (PDL) by 4.6%.
- ⚫ SiN tip coupler loss within wafer range can reach < 9.8%.
SiN Tip Coupler Loss Range < 9.8% Within wafer
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Extending COUPE Heterogeneous Integration
- ⚫ To improve the performance of COUPE, further heterogeneous integration of the modulator, SOA, and light source into the COUPE platform can be implemented.
- ⚫ COUPE also functions as an optical interposer.
Modulator, SOA, and Light Source: heterogeneous integration in COUPE backside.
Summary
- ⚫ Driven by the bandwidth and power efficiency in AI and HPC, Optical I/O is a valuable option to pursue.
- ⚫ Continue to improve COUPE platform performance to meet both CWDM and DWDM application.
- ⚫ The integration of COUPE with CoWoS package for different applications will be realized through close collaboration between stakeholders or STCO (System and Technology Co-Optimization).
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