PDF 原檔：產業_SEMICON2026矽光子論壇_Lumentum簡報_20260831_original.pdf
原始內容
Optical Interconnects for AI Data Centers
Matt Sysak, CTO August 31, 2026
TRANSFORM TOMORROW
40804
The Virtuous Cycle of AI Scaling
40804(
AI/ML Data Center
1080
Lumentum: Foundational AI Material Expertise
Indium Phosphide (InP)
High-performance lasers, modulators, and transceivers for scale-out and scaleup
Gallium Arsenide (GaAs)
High-volume lasers for scale-up and scalein built on large scale sensing deployments
Optical Switching Technologies
Proven MEMS and LCOS solutions supporting scalable optical switching
01.10.251.141 [讀者資訊已遮蔽]
InP Technology
840804
Lumentum: InP Technology Leadership
[讀者資訊已遮蔽] [讀者資訊已遮蔽]
NVIDIA's Spectrum-X CPO Switch
Enabled by Lumentum's high-reliability, ultra-highpower laser
/ LUMENTUM
Leveraging Lumentum Foundational Leadership in Lasers
NVIDIA Spectrum-X Photonics
CPO Co-Invention Ecosystem Partners
Technology Innovations
New Microring Modulators (MRM)
TSMC Photonics Engine Optimizations
High Power, High Efficiency Lasers
Detachable Fiber Connectors
100's of Patents, Licensed to Customers
408040
Class-leading CPO Laser Performance
Power Conversion Efficiency
Frequency (GHz)
40
8
N: 0804 @
Class-extending CPO Laser Performance
Multi-Wavelength UHP Features and Benefits
- 16 DWDM channels -For power efficient high-density links
- 350 mW per laser / 23 -24.5 dBm per fiber -High efficiency
- Wavelength control within ±25 GHz -Tight spacing control
- Pluggable ELSFP architecture -Compatible with ELSFP
H40804 00
Class-extending CPO Laser Performance
800mW SHP Features and Benefits
- >1.0 W at 25°C / >0.8 W at 50°C For higher power budget
- 1310 nm O-band Aligned with SiPh and CPO architectures
- <100 kHz linewidth Delivers high spectral purity
- Low RIN and >40 dB SMSR Improves signal integrity
- Mode-hop-free single-mode operation -Wide operating range
- Compact ELSFP implementation -compatible with ELSFP
Optical Power (W)
Current
10804(
InP EML 400G Performance (OFC '25)
448G InP EML
Partner announcement: 'Keysight, NTT Innovative Devices, and Lumentum Achieve New Benchmark 448 Gbps Data Transmission for AI'
450G InP DFB-MZI
Live demonstration in Lumentum' s booth at
108040
OFC '26 Intercepting the Market
400G+ InP EML
1.6T Optical Module
Live demonstration in Lumentum' s booth at
01.10.251.141 [讀者資訊已遮蔽]
GaAs Technology
A: đ
The Scale-Up Challenge
Sources: Nvidia
| GPU | Scale-Up BW (Tbps) | Scale-Up Size (GPU) | Rack Power (kW) |
|---|---|---|---|
| Blackwell | 7.2 | 72 | 120 |
| Rubin | 14.4 | 144 | ?? |
| Feynman | 28.8 | ?? | ?? |
High-volume optics required to break reach, power, and bandwidth constraints
1080
Scale-up technology options
| Metric | VCSEL | SiPh | InP | TFLN | Context |
|---|---|---|---|---|---|
| Speed | + | + | + | + | Wide parallel approaches do not require significant bandwidth. |
| Volume | + | + | - | - | No technology with higher deployment than 3DS VCSEL. |
| Cost | - | - | - | - | InP and TFLN are expensive; SiPh requires external laser. VCSEL requires fiber. |
| Power | + | - | - | - | External laser drives power, InP, and TFLN require external drivers. |
| Reliability | + | + | - | - | VCSELs offer redundancy and sparing to reach <1 FIT. SiPh has external laser. |
| Reach | - | + | + | + | VCSEL reach challenging with standard fiber (new fiber possible). |
| Density | + | + | - | - | InP and TFLN are not dense enough to meet scale-up interconnect requirements. |
Scale-up requires new fundamental optical technology
10804 04
What Kind of VCSEL?
- First standard, 1999
- Set from fiber/laser technology in '90s
- 3D sensing introduced, face ID, 2017
- Pushes industry to high-volume manufacturing - billions of emitters shipped
- Automotive introduced, 2021
- Forces high-temperature, high-reliability interconnects inside automobiles
- High-density interconnect proposed, 2025
- Builds on 3DS, automotive, adds bandwidth, density, signal integrity, manufacturability
850nm
940nm
980nm
1060nm
408040
UCIe-A Chiplet Concept
408040
Core Technology: GaAs VCSEL
Measured DC LI Over Temperature
Power vs. Current
Reliability Testing
10804 00
Core Technology: GaAs Photodiode
PD arrays
40804(
Core Technology: VCSEL on Interposer
Backside emitting VCSEL on Si interposer
VCSEL array power on
80 emitter fiber array/VCSEL
10804
Core Technology: High Density Fiber
- Fiber core position error relative to a perfect 125 µm hex grid < 5 µm
- Fiber average pitch was close to 125 µm
- Up to 80m / 80 core fiber array prototypes fabricated
CORNING
CORNING
Fiber position
CORNING
10804
VCSEL/CMOS Integration
Live demonstration in Lumentum's booth
VCSEL/Advanced CMOS Integration
- High-density 1060nm VCSEL and photodiode arrays
- Leverages high-volume 3DS supply chain
- Compatible with standard SMT (no fiber compatibility issue)
- 32 Gbps / channel consistent with UCIe-S and UCIe-A
- >80 Tbps bi direction optical bandwidth capability
- >1.5 Tbps/mm (path to >4 Tbps/mm)
- Capable of <2.5 pJ/bit
- Error-free operation (1e-12 BER)
01.10.251.141 [讀者資訊已遮蔽]
MEMS Technology
10804 00
Optical Circuit Switch: Breakthrough Power Savings
- 300x300 passive optical switch based on MEMs
- Spine switch replacement and network redundancy / network failover
- >65% front-end and scale-out network power reduction in 100K-scale GPU deployments*
H40804 0г
Optical Circuit Switch Performance
Thank you
TRANSFORM TOMORROW