PDF 原檔：報告_OCP2026_Samtec_CPO方案_20261015_original.pdf
講者公開簡報（OCP 官方 Recorded Content 頁提供下載）。文字以 PyMuPDF 逐頁抽取，
### p<n>為頁碼；圖表內容見原檔。
圖片清單（已驗證 2026-10-19）
| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_Samtec_CPO方案_20261015_p8.png |
p8 | 真資料圖 | Improved SI 頁：CPX 模組通道示意（host die→CPX socket→CPX 模組 die），標 Die-to-Socket <15 dB、Die-to-Die <18 dB、模組通道 <3 dB；右為 0–80GHz 差動插入損耗曲線（約 80GHz 處 -16 dB） |
報告_OCP2026_Samtec_CPO方案_20261015_p10.png |
p10 | 真資料圖 | 基板訊號完整性：SDD11 回損與 SDD21 插入損耗多條量測曲線，0–120GHz，SDD21 約 100GHz 處 -3 至 -4.5 dB，標來源 Broadcom ECOC 2026 |
報告_OCP2026_Samtec_CPO方案_20261015_p13.png |
p13 | 真資料圖 | CPX 連接器／模組兩型（Type-1 含 RF socket＋MP socket 10mm、Type-2 RF/MP socket）立體構造圖，文字標 32 或 36 lane、支援 Ethernet／OCI／PCIe-CXL、銅或光 |
報告_OCP2026_Samtec_CPO方案_20261015_p14.png |
p14 | 真資料圖 | 「Composable Switch Trays」現場拍攝投影片：上圖為 XPO 模組＋ELSFP cage 前面板配置、下圖為可配置面板（高密度光連接器＋ELSFP cage），文字寫 flyover 銅與光同一 tray、204.8T 級＝512×400G 或 1,024×200G 埠、1RU 密度；此頁無 Samtec 標示，出處不明 |
原始內容
p1
Tom Palkert System Engineer, Samtec Founding member OpenCPX MSA Collaboration of system, module and connector vendors results in CPO breakthrough to enable broad adoption of CPO for AI systems. OCP Special Focus: Photonics]
p2
• The requirements for broad adoption of Co/Near-packaged Optical (CPO/NPO) solutions in next generation AI systems have proven difficult to achieve in past system designs and has limited the deployment of large scale CPO/NPO based AI systems. • Samtec, Ciena, Coherent, Terahop, Marvell, Molex joined together to solve these problems with a unique design. • This presentation will show the results of the joint work of the OpenCPX MSA to provide a CPO/NPO solution for AI that provides a high density, high bandwidth, field replaceable, copper compatible solution for AI interconnects. What did we do?
p3
• Reduced link flaps • Lower power • Improved signal integrity • Improved mechanical connections • Support for: • DAC, ACC, AEC, Optical (SMF and MMF) What is the Promise of CPO/NPO
p4
• SMF Optics: • Silicon Photonic modulators with External laser • Integrated Lasers • WDM • Multicore fiber and Expanded beam connectors • MMF Optics • 2D micro VCSEL and PD • Coherent: ECOC 2026 • Direct mod VCSEL • Multicore fiber Support for Optics
p5
• DAC: • Flyover cable to adjacent ASIC • Flyover cable to front panel pluggable module • Flyover cable to front panel DAC cable • Active Copper (ACC/AEC): • Integrated Analog amplifier • DSP copper module • RF conversion cables Support for Copper
p6
• From Meta OCP 2025: • 15M device hours for CPO: Unserviceable failures >15M MTBF • 2M for 2x400G pluggable: 0.55M MTBF • From Meta/Broadcom OFC2026: • 36M device hours with FEC bin <4 (75% of ports) • From Oracle (ECOC 2026) • Why does CPO/NPO have much better reliability and reduce link flaps? • Reduction in mechanical complexity (compared to pluggable) • Reduction in number of DSPs in the path (Reduced Latency) • Reduction in host channel length/Insertion loss • Reduction in host trace ‘discontinuities’ (number of vias, BGA escape etc) Reduced Link Flaps:
p7
• Reduced trace length/Insertion loss allows a Linear electrical interface • No DSP • CPO/NPO saves 65% vs DSP pluggable (OFC2026 M4B.6) • Silicon photonics: 3.8 pj/bit • VCSEL: 1-1.9 pj/bit Lower power CPO/NPO:
p8
• No BGA escape, No front panel pluggable connector, No AC coupling cap. • Reduced trace loss: Shorter host channels: 15 dB vs 32 dB • Improved ERL (8.5dB for pluggable vs 10 dB for CPO) Improved SI:
p9
• IL of substrate material is lower loss, lower cost than package • Fan out supports larger beachfront • Improves cooling efficiency • Linear interface still works • IL <15-18dB • (See next slide for SI) NPO substrate design Source: Broadcom OCP 2025 https://www.youtube.com/watch?v=l1uzP41MoSo
p10
Substrate signal integrity is excellent Source: Broadcom ECOC 2026
p11
• No cage, • Low complexity latching mechanism • No compression bar • No sliding module over TIM as required for pluggable • Samtec Si-Fly HD Co-Package Reflow Process Reduction in mechanical complexity
p12
• Removal tool allows service of individual modules CPX serviceability
p13
• 2 connector/module types provides separate or integrated power options • 32 or 36 lane options • Supports Ethernet, OCI, PCIe/CXL or proprietary interfaces • Supports Copper or Optics Flexibility for CPO/NPO
p14
（本頁無可抽取文字，內容在圖中）
p15
• Problem to solve • How to use CPX as a platform for Open Silicon Photonics for AI Systems (See Section 5.5) • Develop robust compliance test parameters/methods for high density CPO/NPO interfaces • Timeline for product availability: Q3 2026 (on the show floor) • Where to find additional information: • Opencpxmsa.org Call to Action
p16
Thank You! Thank You