報告_OCP2026_NVIDIA_Megmeet_液冷電源櫃800VDC_20261015

PDF 原檔：報告_OCP2026_NVIDIA_Megmeet_液冷電源櫃800VDC_20261015_original.pdf

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圖片清單（已驗證 2026-10-19）

原始內容

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Jared Huntington, Senior Power Architect, NVIDIA Roya Movahedi , Chief Marketing Officer, MEGMEET Shi Lei, Lead Engineer, MEGMEET Liquid-Cooled Power shelf and 800 VDC Platform for Next-Generation Datacenters © 2026 MEGMEET. All rights reserved.

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800 VDC Imperative 0 100 200 300 400 500 600 700 800 900 1,000 2024 2025 2026 2027 2028 2029 2030 2031 2032 Cabinet Level Power (kVA) Approximate Timeline (Year) Power Gen 1 Power Gen 2 Power Gen 3 Power Gen 4 GB200 NVL72 GB300 NVL72 Vera Rubin NVL72 144 GPU Trendline 72 GPU Trendline Gen 1 GB200/GB300 54 VDC 145 kW Gen 2 Vera Rubin NVL72 54 VDC 330 kW Gen 3 54 VDC 570 kW 800 VDC into the PSUs 100% liquid cooled Gen 4

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Power Rack Solution Compute Tray 800 VDC DC/DC Power Shelf 54 VDC Busbar 54 VDC PDB 12 VDC VRM Core voltage GPU 800 VDC 800 VDC 800 VDC 800 VDC 800 VDC

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Liquid Cooling – Rack 1. Air is not possible – 33-50 kW / rack limit 2. Fan power returns to compute – 10% return 3. Improved capacitor lifetime – lifetime doubles for every 10 °C 4. Eliminate points of ingress 5. Cable routing flexibility Power Rack 4:1 Compute to Power Rack Ratio

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Liquid Cooling – Facility 1. Eliminate chillers 2. Improved PUE 3. Density per megawatt increases 4. Heat reuse becomes viable 5. New layout possibilities without HAC

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The Next Evolution in Cooling: Liquid-Cooled Power Conversion Air-Cooled Power Shelf Liquid-Cooled Power Shelf Cold Aisle Hot Aisle Mechanical fan adds noise and potential failure points Relies on conventional hot-aisle / cold- aisle Lower power density Dependent on room air- cooling Reduced white- space footprint No conventional room-air cooling infrastructure needed. Higher power density ~18kW more per 1U Better thermal performance with direct- contact cooling Fully liquid cooled with no air used for power conversion  High-volume EV power manufacturing experience  Existing potting machines & manufacturing capabilities 6  E-CAPS in direct contact with cold plate  SIC MOSFETs: Top-side cooling optimized for increased contact to cold plate  Lower component temperature can improve capacitor life  Multiple leak sensors available for both PSU and shelf  Cuts off input power if leakage is inside the shelf  Redundancy provided in shelf; 55 kW still available if leakage is detected in one power supply Components Longer life & Reliability Built on EV power experience Liquid Leak Safety protection PMC Redfish

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Fan Cooled vs. Liquid Cooled Infrastructure Conventional Air-Cooled Power Shelf 100% Liquid-Cooled Power Shelf + Compute Heat is transported through the room by air. Heat is removed directly by liquid. No thermal hot/cold aisle required for these racks. Optimized greenfield 100% liquid-cooled design Potential facility CAPEX: Up to ~10% Mainly from infrastructure reduction and space compaction, Labor saving. Key takeaways 1. Liquid cooling can remove the thermal need for hot/cold aisles when both compute and power are liquid cooled. 2. Savings depend on facility design assumptions. 3. The benefit comes mainly from reduced air infrastructure and higher density.

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MEGMEET Power Architecture Evolution From 54 V rack power to 800 VDC rack, row and facility infrastructure 01 02 03 Today 54 V Rack Architecture Next-Generation 800 VDC Rack Architecture Fast Deploy Powerup "ready for 1st Token" Proven 54 V architecture for today’s AI racks, with fully liquid-cooled power shelves and High-density power modules. Higher voltage distribution with 800 VDC bus and rack-level conversion closer to the compute load. From rack to row to facility scale, enabling 800 VDC infrastructure for future AI factories. NVIDIA MGX 110 kW Liquid-Cooled Power Shelf (54 V) Grid / Utility Power 13.8 kVAC / 34.5 kVAC 3ϕ 480/380 VAC AC EDPP Super Capacitor Compensator 54 V DC Power Shelves 54 VDC DC/DC Power Module GPU / Compute Tray NVIDIA MGX 110 kW liquid-cooled power shelf (54 V) Mature, hot-swappable platform Grid / Utility Power 480/380 VAC 3ϕ (for front-end conversion) AC→800 VDC Liquid Cooled Power Conversion BBU / CBU GPU/Compute Rack NVIDIA MGX 100 kW liquid-cooled power shelf (800 V); 800 VDC distribution directly to the rack Conversion closer to the compute load (95 kW / 90 kW-class DC/DC shelves) Outdoor MEGMEET SST Centralized solid state transformer with 800 VDC overhead busway. Extends 800 VDC from rack to row Overhead 800 VDC Busway MEGMEET SST (Solid State Transformer) … Liquid-Cooled Compute Rack Efficient and Fast Deploy Power Architecture NVIDIA MGX Liquid-cooled 800 VDC Power Rack 800 VDC distribution directly to the rack via SST Conversion DC/DC Modules on compute board 800 to 54V Liquidcooled DC/DC Shelf

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Today: 54V 2RU 110kW Liquid-Cooled AC/DC Power Shelf Font View: Dual AC input whip Bus clip for DC output Support NVIDIA MGX Rack Liquid cool power shelf Minimum liquid inlet temperature: +17 °C Maximum liquid inlet temperature: +50 °C Maximum liquid outlet temperature: +65 °C Hot swappable PSU Main Functions and Features 3Φ AC input 54 VDC output 2RU power shelf energy >10kJ EDPP supported

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Liquid-Cooled 800 VDC Power Rack Liquid-Cooled 800 VDC Power Rack (W: 600mm D: 1200mm H: 2236mm) AC Input Power Shelf Rack Power Density 311~528 rms 800 kW standard 100 kW BBU Shelf (optional) Auxiliary Power Rack Configuration 89 kW discharge 48 RU 300 W Line-Line voltage (3L+PE) Full load ≥342 VAC 2*50 kW 1RU power modules ≥ 10 kJ EDPP Energy It can be expanded in the future Duration: ≥90s @ 40C Lifespan: ≥5 years @ 40C Output voltage 50V±5V @Shelf Power shelf + capacitor shelf (optional)

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Power Supply Air-to-Liquid Cooling: Power Density, Efficiency & Thermal Gains Cold plates directly contact heat sources, eliminating fans and heavy heat sinks — three dimensions improve simultaneously Liquid Cooling Fan + large aluminum heatsink Switch to Liquid Coolant Cold plate directly on heat source, no fan 01 Power Density 02 Efficiency 03 Thermal Performance Eliminating fans and airflow channels, heat transfer shifts from air convection to forced liquid cooling. At the same power, PSU size can decrease to 50% . Removing fan parasitic power (~2%–5%) and airflow resistance losses; lower junction temperatures reduce MOSFET switching and conduction losses, shifting the efficiency curve upward. Liquid convection h is 1–2 orders of magnitude higher than air (25–250 → 1000–10000 W/(m²·K)); hotspot temperatures drop significantly, improving reliability. Thermal path: Air「Junction→Case→Heatsink→Air」vs Liquid「Junction→Case→Cold Plate→Coolant」— shortened thermal resistance chain, order-of-magnitude cooling gain  High power density  High efficiency  Good thermal performance  High reliability 2x power density

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Cold Plate Technologies: EV vs. Datacenters Integrated aluminum housing vs. copper-tube embedded cold plate — thermal performance, form factor and cost trade-off EV Cold Plate One-piece aluminum die casting with machined / Friction Stir Welding + Strengths • Low-cost, high-volume casting / FSW • Rigid one-piece housing, vibration-proof • High IP protection rating – Limitations • Aluminum k≈200 W/m·K limits heat flux • Tall and bulky; limited uniformity • Channel shape constrained by casting • Low material utilization and heavy weight. AI PSU Cold Plate Aluminum base with copper tubes embedded + Strengths • Copper k≈400 W/m·K — ~2× heat spreading • Thin, low-profile stack height • Flexible routing follows hot SiC devices • Excellent thermal uniformity – Limitations • Higher BOM: copper + tube bending Takeaway: The Datacenter power supply cold plate has high reliability and ~2× aluminum thermal conductivity, a thinner stack, and uniform cooling for high-heat-flux SiC / GaN devices — the preferred trade-off when power density outranks unit cost.

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100KW 800V Liquid Cooled AC/DC Powershelf 2RU without BBU 5RU with BBU • Dual AC input whip • Support NVIDIA MGX Rack Liquid cool power shelf Minimum liquid inlet temperature: +17 °C Maximum liquid inlet temperature: +45 °C Maximum liquid outlet temperature: +65 °C Hot swappable PSU Main Functions and Features ✓ 3Φ AC input ✓ 2RU power shelf energy >10kJ ✓ 5RU power shelf with BBU support 90s hold-up time ✓ 800V/100kW output ✓ EDPP supported ✓

98% efficiency

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Font View: Hot swappable DC input connector Bus clip for DC output Support NVIDIA MGX Rack Liquid cool power shelf Minimum liquid inlet temperature: +17 °C Maximum liquid inlet temperature: +45 °C Maximum liquid outlet temperature: +65 °C Hot swappable PSU Main Functions and Features 800 VDC input 54 VDC output 1RU power unit with PMC EDPP supported 95kW 54V Liquid cooled DC/DC Power Shelf

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• Power: 10 kW • 100% Liquid-cooled • Peak efficiency up to 98.5% @800Vin • Fixed ratio output voltage: 16:1 • Fully protected: Input UVLO and OVP. Output OVP, OCP and OTP • Monotonic and Pre-biased startup • No minimum load required • Parallel Operation with Direct Output Connection and active current share • 4242 VDC reinforced isolation: Input to Output / Heat spreader • Power: 30 kW • Full load Efficiency up to 97.7% @ 800 Vin • <40mm hight with coldplate • Fixed ratio output voltage: 16:1 • Fully protected: Input UVLO and OVP, Output OVP, OCP and OTP • Monotonic and Pre-biased startup • No minimum load required • Parallel Operation with Direct Output Connection and active current share • 4242 VDC reinforced isolation: Input to Output / Heat spreader Power Distribution Board Solutions Liquid-Cooled DC/DC Power Module Liquid-Cooled Liquid-Cooled 800-50 VDC DC/DC Module

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