論文 Metadata
- 標題：Ultra-Thin Wafer Handling Process for Advanced Packaging Using Novel Temporary Bonding Film and De-Bonding Method
- 作者：Motohiro Negishi, Yuta Akasu, Emi Miyazawa, Tetsuya Enomoto, Kohei Taniguchi, Takashi Kawamori（全員 Resonac Corporation, Japan）
- 會議：2025 IEEE 75th Electronic Components and Technology Conference (ECTC)，2025-05-27～30，Dallas, TX, USA，pp. 890–894
- DOI：10.1109/ECTC51687.2025.00156
- 擷取範圍：IEEE 全文付費牆，僅擷取 abstract 級資訊；metadata 與 abstract 經 agy 搜尋 + Semantic Scholar API 逐字交叉驗證一致（2026-07-22）
原始內容
Abstract 原文（IEEE Xplore / Semantic Scholar，不刪改）
This study aims to demonstrate the applicability of a new temporary bonding film and a photonic de-bonding method for ultra-thin wafer handling process. We conducted wafer thinning supported on a glass carrier with the temporary bonding film, followed by de-bonding from the glass carrier. As a result, we successfully achieved wafer thinning down to a thickness of 25 μm, and the glass carrier was easily de-bonded without any damage to the wafer by Xe flash light irradiation. In addition, we also confirmed that the remaining temporary bonding film on thinned wafer could be removed easily without damage by peeling it off with a support tape. These results indicate that the new temporary bonding film and photonic de-bonding method are so promising for ultra-thin wafer handling process.
關鍵字（IEEE Xplore 頁面）
Wafer thinning process, Temporary bonding film, Xe flash light, Photonic de-bonding, De-taping