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原始內容
TSMC 3DFabric Alliance, a significant addition to TSMC's Open Innovation Platform® (OIP), helps customers overcome the rising challenges of semiconductor and system-level design complexity and achieve speedy implementation of innovations for next-generation HPC and mobile applications using TSMC's 3DFabric technologies.
The 3DFabric Alliance is the first of its kind in the semiconductor industry and aims to achieve the following goals with the collaborative efforts of our OIP ecosystem partners:
- Accelerate 3DFabric ecosystem innovation and readiness
- Speed up 3DFabric customer adoption and production
- Lead industry in system design by integrating advanced logic with 3DFabric technologies to provide a full spectrum of best-in-class solutions and services for semiconductor design, memory modules, substrate technology, testing, manufacturing, and packaging.
Through the 3DFabric Alliance, TSMC works with alliance members in the following seven areas to deliver a full spectrum of highest-quality, readily-available solutions and services to meet customer's 3D IC design needs in all relevant design stages of EDA tools and flows, IPs and memory components, design services, as well as backend processes including OSAT, substrate, and testing.
TSMC 3DFabric® Alliance Members
| 領域 | 成員 |
|---|---|
| EDA | Cadence, Keysight, Siemens EDA, and Synopsys |
| IP | Alphawave, ARM, Cadence, proteanTecs, Silicon Creations, and Synopsys |
| DCA/VCA | Alchip and Global Unichip Corp (GUC), and IC-Link by imec |
| Memory | Micron, Samsung Memory, and SK hynix |
| OSAT | Amkor, Advanced Semiconductor Engineering (ASE) Group, Siliconware Precision Industries Ltd (SPIL), and STATSChipPAC |
| Substrate | IBIDEN, Toppan, and Unimicron Technology Corp (UMTC) |
| Testing | Advantest, Cadence, Keysight, Siemens EDA, Synopsys and Teradyne |
判讀註記
- 聯盟 2022-10-27 於 OIP Forum 發表（依 TSMC 新聞稿日期）
- 七個領域中不含「設備」與「材料」——聯盟涵蓋設計到交付的生態系，不涵蓋 fab 內的機台與耗材供應鏈
- 台廠成員僅三家：創意電子（DCA/VCA）、日月光投控含矽品（OSAT）、欣興（Substrate）