PDF 原檔：報告_OCP2026_劍橋_光寶科_銅燒結BGA電遷移_20261015_original.pdf
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| 檔名 | 頁 | 分類 | 親眼所見內容 |
|---|---|---|---|
報告_OCP2026_劍橋_光寶科_銅燒結BGA電遷移_20261015_p2.png |
p2 | 真資料圖 | 問題陳述：XPU 水平／垂直供電兩種 BGA 位置示意，註電流密度預期超過 2 A/mm2；右為焊料 BGA 在 96h、120h 陰極側出現裂縫的剖面電鏡圖 |
報告_OCP2026_劍橋_光寶科_銅燒結BGA電遷移_20261015_p4.png |
p4 | 真資料圖 | 銅燒結 BGA 製程（銅膏點膠、100C/20min N2 乾燥、220C/5min 加 10MPa 燒結、剪切測試，電阻分布約 21-25 mΩ）與 4 樣品串接電遷移測試台，電流密度 50A/mm2 |
報告_OCP2026_劍橋_光寶科_銅燒結BGA電遷移_20261015_p5.png |
p5 | 真資料圖 | 電壓對時間曲線：SAC305 焊點 5 個樣品約 260-325h 開路失效（準則約 0.38V），燒結銅 5 個樣品至 900h 電壓持平約 0.21-0.23V |
原始內容
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Cu Sintering BGA Interconnect for Mitigating Electromigration in High-Current AI Power Delivery Chengjie Du, Xufu Ren Department of Engineering, University of Cambridge
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Problem Statement BGA application in high-current AI power delivery Solder: Electromigration failure current density expected to surpass 2 A/mm2
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Proposed solution: Cu sintering Cu nanoparticles sintering Daisy-chained interconnects for comparing electromigration reliability of soldering and Cu sintering
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Proposed solution: Cu sintering Fabrication process and performance evaluation of sintered-Cu BGA interconnect Current density: 50A/mm2
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Proposed solution: Cu sintering Sintered-Cu BGA interconnects provide significant electromigration reliability improvement compared to solder-based counterpart Under current density of 50 A/mm2, SAC305 exhibits open-circuit failure at 300 h, Sintered-Cu BGA maintains stable electrical conduction for more than 900 h
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Proposed solution: Cu sintering Open-circuit failure of SAC305 BGA interconnect: crack formation and growth at Cathode
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Proposed solution: Cu sintering Microstructure of sintered Cu remain unchanged, showing that Cu atoms migration was negligible. This microstructural stability is consistent with the stable electrical conduction
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Proposed solution : Cu sintering For SAC305 at 300 h of EM testing, significant atomic concentration occurs at anode interface. In contrast, atomic concentration of sintered Cu interconnect shows negligible variation at 900 h of EM testing.
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Next steps Large area with hundreds of Cu sintering BGA interconnects fabrication
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